摘要:
A device for storing and loading unbelted ammunition in a turret equipped with a tubular weapon, the tubular weapon being equipped with one shaft magazine on either side, with a ring magazine to receive ammunition disposed in the turret basket. Each respective shaft magazine can be supplied with ammunition by way of an associated lifting device. A ring magazine is disposed in a turret basket so as to be rotatable about its axis by means of a drive. Vertical, radially oriented shafts are provided in the ring magazine to receive ammunition and an auxiliary shaft device fixed to the turret is disposed above the ring magazine, with the shaft magazines being articulated to the tubular weapon in such a manner that their shafts, with the tubular weapon in an indexed position, are aligned with the auxiliary shafts of the auxiliary shaft device which are an upward extension of the shafts of ring magazine therebelow, whereby any two types of freely selectable ammunition may be loaded into the respective shaft magazines via the ring magazine and auxiliary shaft device.
摘要:
A digital phase control circuit incorporates a phase detector and a controllable oscillator controlled by an internal clock. The oscillator is formed as a presettable counter which is counted by the internal clock and preset with a variable intial value corresponding to a function of the frequency of the current data clock derived from an incoming data stream. The phase detector is formed as a shift register for delaying data signals, a counter storage register associated with a counter, and an intermediate storage register associated with the shift register, the storage registers manifesting the state of the counter or the state of the shift register at a predetermined time during an operating cycle, as indicated by the counter. Depending on the position of a data signal in the shift register when the counter reaches a predetermined state, one of the storage registers is selected for connection to a rated value generator for selection of a new rated value for presetting the counter, such new rated value being selected in accordance with the frequency of the current data clock and with the phase-signifying content of one of the storage registers.
摘要:
An aperture device for measuring thin films has an aperture ring, of a material and thickness that is impenetrable by the radiation from radionuclides. The ring has a passage for emitted and reflected radiation extending approximately perpendicular to said ring, and a radiation device consisting of at least one collimating radiation source holder comprising a tube of a predetermined diameter that is permeable to radiation in the forward direction and has sides and a back that are impermeable to radiation and houses a radionuclide. The forward end surface of the tube lies behind the forward end surface of the passage. The cross-section of the passage is large compared to the cross-section of the radionuclide. A partition divides the passage into at least two chambers that are open at their rearward and forward ends. The partition has partition walls that are impermeable to radiation. The radiation source holder is arranged in one of the chambers, the cross-section of which chamber is a multiple of the cross-section of the radiation source holder. The forward end surface of the radiation source holder lies behind the forward end surface of the partition.
摘要:
A measuring device for detection pf measurement signals during a penetrating movement of a penetrating member into a surface of a test object or during a sensing movement of the penetrating member on the surface of the test object. The measuring device includes a housing which accommodates a force generating device and on which a holding element is arranged remote from the force generating device, which holding element is movable relative to the housing at least in one direction along a longitudinal axis of the housing and which accommodates the penetrating member. The measuring device also includes at least one first measuring element for measuring the penetration depth of the penetrating member into the surface of the test object or a traversing movement of the penetrating member along the longitudinal axis relative to the housing during a sensing movement on the surface of the test object, wherein a transmission element is provided which extends between the force generating device and the penetrating member.
摘要:
Measuring probe for non-destructive measuring of the thickness of thin layers, in particular in cavities, which are accessible by an opening or on curved surfaces, with a measuring head, which includes at least one sensor element and at least one contact spherical cap, assigned to the sensor element on a surface, to be checked, of the cavity, and with a gripping element for positioning and guiding the measuring probe on and/or along the surface to be measured, wherein on the gripping element, a long, elastically yielding guide bar is provided, which accepts the at least one measuring head on its end opposing the gripping element, in such a way that it is moveable with at least one degree of freedom in relation to the guide bar.
摘要:
An optoelectronic semiconductor device includes an optoelectronic semiconductor layer sequence on a metal carrier element, which includes as a first component silver and as a second component a material having a lower coefficient of thermal expansion than silver, wherein the first and second components are intermixed in the metal carrier element.
摘要:
The invention relates to a measuring probe for non-destructive measuring of the thickness of thin layers, in particular in cavities, which are accessible by an opening or on curved surfaces, with a measuring head, which comprises at least one sensor element and at least one contact spherical cap, assigned to the sensor element on a surface, to be checked, of the cavity, and with a gripping element for positioning and guiding the measuring probe on and/or along the surface to be measured, wherein on the gripping element, a long, elastically yielding guide bar is provided, which accepts the at least one measuring head on its end opposing the gripping element, in such a way that it is moveable with at least one degree of freedom in relation to the guide bar.
摘要:
The invention relates to a measuring probe for measuring the thickness of thin layers, having a housing (14) with at least one sensor element (17), which is received at least slightly moveably along a longitudinal axis (16) and which comprises at least one first winding device (44), which has a magnetic pot core (41) arranged in the longitudinal axis (16) of the housing (14), and to whose central pin (42) a first and second coil (70, 71) are allocated, and having a spherical positioning cap (21) on the central pin (42) pointing towards the measuring surface of an object to be measured, which cap comprises a bearing surface (57) for fitting on a measuring surface, wherein a second winding device (48) is provided allocated to the spherical positioning cap (21), which device is formed from a discoidal or annular carrier (49) having at least one Archimedean coil (51), and a shield (83, 85) is provided at least partially between the first and second winding device (44, 48).
摘要:
The invention relates to a measuring probe for non-destructive measuring of the thickness of thin layers on an object with a measuring head, which comprises at least one sensor element for contact on a measurement surface of an object, and with a support device for receiving the measuring head, which is at least partly surrounded by a housing, wherein at least one further measuring head, which is adjacent to and separated from the first measuring head, is arranged on the support device, which can be controlled independently of the first measuring head.
摘要:
A method of producing optoelectronic components is indicated, in which a plurality of semiconductor bodies, each with a semiconductor layer sequence, are provided. In addition, a component carrier assembly with a plurality of connection pads is provided. The semiconductor bodies are positioned relative to the component carrier assembly. An electrically conductive connection is produced between the connection pads and the associated semiconductor bodies and the semiconductor bodies are attached to the component carrier assembly. The optoelectronic components are finished in that one component carrier (30) is formed from the component carrier assembly, to which the semiconductor bodies are attached, for each optoelectronic component.