公开(公告)号：USD586764S1

公开(公告)日：2009-02-17

申请号：US29283242

申请日：2007-08-08

申请人： Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Hiroyuki Naito

设计人： Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Hiroyuki Naito

公开(公告)号：US20050110161A1

公开(公告)日：2005-05-26

申请号：US10958246

申请日：2004-10-06

申请人： Hiroyuki Naito ,  Satoshi Shida ,  Hiroshi Haji ,  Makoto Morikawa

发明人： Hiroyuki Naito ,  Satoshi Shida ,  Hiroshi Haji ,  Makoto Morikawa

IPC分类号： H01L21/607 ,  H01L23/485 ,  H01L23/498 ,  H01L33/62 ,  H01L23/48

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/1131 ,  H01L2224/1134 ,  H01L2224/11505 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81194 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85424 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： By arranging bonding members formed of a gold nanopaste between chip-electrodes and board-electrodes, making the chip-electrodes are brought in contact with the respective board-electrodes via the bonding members and applying ultrasonic vibrations to the bonding members in the contact state, the bonding members are bonded to the board-electrodes and the chip-electrodes.

摘要翻译： 通过在芯片电极和板电极之间设置由金纳米糊状物形成的接合部件，通过接合部件使芯片电极与各个基板电极接触，并且在接触状态下对接合部件施加超声波振动， 接合部件与基板电极和芯片电极接合。

公开(公告)号：US06527905B1

公开(公告)日：2003-03-04

申请号：US09703924

申请日：2000-11-02

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component because of the air bubbles can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种将电子部件安装在物体的指定位置的方法。 该方法包括在第一施加过程中预先施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后，在不妨碍电子部件和物体的电极的连续接合的情况下，以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于气泡而导致的电子部件的破损或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。

公开(公告)号：US06298547B1

公开(公告)日：2001-10-09

申请号：US09158536

申请日：1998-09-22

申请人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

发明人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

IPC分类号： H05K1304

CPC分类号： H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic component mounting method which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

摘要翻译： 一种电子部件安装方法，其采用与花键轴的一端部的空气通路连接的第一供气装置，以及与所述花键轴的另一端附近的所述空气通路连接的第二供气装置。 第一和第二空气进料用于向空气通道供应空气以将其内部返回到大气压力。 通过使用两个单独的空气进料，可以缩短将空气通道中的真空压力恢复到大气压所需的时间。

公开(公告)号：US06206066B1

公开(公告)日：2001-03-27

申请号：US09091104

申请日：1998-06-12

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种用于将电子部件安装在物体的指定位置的方法和装置。 该方法包括在第一施加过程中施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于电子部件的断裂或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。

公开(公告)号：US08439527B2

公开(公告)日：2013-05-14

申请号：US13243517

申请日：2011-09-23

申请人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

发明人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

IPC分类号： F21V7/00

CPC分类号： F21V23/009 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21S8/026 ,  F21V3/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/507 ,  F21V29/70 ,  F21Y2115/10

摘要： Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 μm to 500 μm inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.

摘要翻译： 提供一种灯泡型灯，其包括具有很大可操作性的轻质外壳。 LED灯泡包括：安装有LED的LED模块; 在两端具有开口的圆筒状壳体，其为第一端和第二端; 安装构件，其表面上安装有LED模块，所述安装构件通过与所述壳体的第一端的内周面接触而封闭所述壳体的相应一个开口; 附接到所述壳体的第二端的基部构件; 以及设置在壳体内的照明电路。 壳体的壁厚在200μm〜500μm的范围内，壳体的至少一部分的壁厚从壳体的第一端朝向第二端部减小。

公开(公告)号：US07806642B2

公开(公告)日：2010-10-05

申请号：US11579735

申请日：2005-04-20

申请人： Shoriki Narita ,  Kenichi Ishida ,  Shuichi Hirata ,  Satoshi Shida

发明人： Shoriki Narita ,  Kenichi Ishida ,  Shuichi Hirata ,  Satoshi Shida

IPC分类号： H01L21/677

CPC分类号： H01L21/67778 ,  H01L21/67271 ,  H01L21/6732 ,  H01L21/67383 ,  H01L21/67766 ,  H01L21/68785

摘要： In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.

摘要翻译： 在用于壳体的部件供给板的接收器中，在多级堆叠中，具有放置在其上的多个部件的多个部件供给板，识别标记部分形成为位于支撑引导部分的端部或其近端处 在板进给方向上，使得从单独的支撑引导部分出来的每对成对的支撑引导部分可以与其他成对的一组支撑引导部分区分开，并且在板进给方向上视觉辨别。

公开(公告)号：USD577690S1

公开(公告)日：2008-09-30

申请号：US29296867

申请日：2007-10-30

申请人： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

设计人： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

公开(公告)号：US06748649B2

公开(公告)日：2004-06-15

申请号：US10023792

申请日：2001-12-21

申请人： Osamu Okuda ,  Akira Kabeshita ,  Satoshi Shida ,  Makoto Sueki

发明人： Osamu Okuda ,  Akira Kabeshita ,  Satoshi Shida ,  Makoto Sueki

IPC分类号： H05K330

CPC分类号： H05K13/08 ,  H05K13/0413 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

摘要： A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied to the motor, and a detecting device for detecting movement of the shall in the axial direction. A method of operating the component holding head comprises using the detecting device to detect movement of the shaft in the axial direction resulting from the shaft being driven by the motor, and controlling power supplied to the motor in response to the movement of the shaft as detected by the detecting device such that the distance that the shaft is driven by the motor in the axial direction is controlled.

摘要翻译： 保持头包括轴向可驱动的轴，其轴在轴的一端具有用于保持部件的喷嘴，用于响应于提供给马达的功率而在轴向上驱动轴的马达以及用于检测所述轴的运动的检测装置 应沿轴向。 操作部件保持头的方法包括使用检测装置来检测轴由轴由马达驱动的轴的运动，并且响应于检测到的轴的运动来控制供给马达的动力 通过检测装置使得轴被电动机沿轴向驱动的距离被控制。