公开(公告)号：US6149988A

公开(公告)日：2000-11-21

申请号：US208752

申请日：1998-12-10

申请人： Hisato Shinohara ,  Akira Sugawara

发明人： Hisato Shinohara ,  Akira Sugawara

IPC分类号： B23K26/06 ,  B23K26/073 ,  B41M5/24 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  B05D3/06

CPC分类号： B41M5/24 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/0738 ,  B23K26/364 ,  B23K26/40 ,  B23K2203/172 ,  H05K1/0306 ,  H05K3/027 ,  H05K3/38

摘要： A method for treating an object with a laser including emitting a laser beam from a laser; expanding the laser beam in a first direction; removing a portion of the laser beam though a mask, the portion including at least edges of the expanded laser beam extending in the first direction; and condensing the laser beam in a second direction orthogonal to the first direction in order to form a line-shaped laser beam on an object.

摘要翻译： 一种使用激光处理物体的方法，包括从激光器发射激光束; 沿第一方向扩展激光束; 通过掩模去除所述激光束的一部分，所述部分至少包括沿所述第一方向延伸的所述扩大的激光束的边缘; 并且在与第一方向正交的第二方向上会聚激光束，以便在物体上形成线形激光束。

公开(公告)号：US6024830A

公开(公告)日：2000-02-15

申请号：US107552

申请日：1998-06-29

申请人： Greydon W. Nedblake ,  John Garbe

发明人： Greydon W. Nedblake ,  John Garbe

IPC分类号： B23K26/08 ,  B23K26/40 ,  B32B7/12 ,  B32B27/08 ,  B65C9/00 ,  B65C9/18 ,  B65C9/34 ,  G09F3/10 ,  B32B31/00

CPC分类号： G09F3/10 ,  B23K26/0846 ,  B23K26/40 ,  B32B27/08 ,  B32B7/12 ,  B65C9/1803 ,  B65C9/1815 ,  B65C9/1865 ,  B65C9/34 ,  B23K2203/172 ,  B65C2009/0034 ,  B65C2009/0037 ,  B65C2009/0043 ,  B65C2009/1846 ,  Y10T156/1059 ,  Y10T156/1062 ,  Y10T156/1074 ,  Y10T156/1075 ,  Y10T156/1092 ,  Y10T156/125 ,  Y10T156/1339 ,  Y10T156/1348 ,  Y10T428/28 ,  Y10T428/2813

摘要： Label-forming and applying apparatus is provided which dispenses a web of label material presenting individual labels with respective boundaries, and individually cuts such labels using one or more laser beams. The laser unit is equipped with a controller having an electronic memory which stores information about the label boundaries, so that the laser unit can be precisely controlled in order to successively cut labels from the web. An applicator assembly is also provided which picks up the cut labels and transfers the labels to an application station where they are applied to respective articles.

摘要翻译： 提供了标签形成和施加装置，其分配具有相应边界的具有各个标签的标签材料的网，并且使用一个或多个激光束单独地切割这些标签。 激光单元配备有具有电子存储器的控制器，该电子存储器存储关于标签边界的信息，使得可以精确地控制激光单元以便从卷筒纸连续切割标签。 还提供了一种涂抹器组件，其拾取切割的标签并将标签转移到施加于其上的应用位置，在那里它们被施加到相应的物品上。

公开(公告)号：US5933218A

公开(公告)日：1999-08-03

申请号：US740956

申请日：1996-11-05

申请人： Masato Matsubara ,  Tsukasa Fukushima ,  Miki Kurosawa

发明人： Masato Matsubara ,  Tsukasa Fukushima ,  Miki Kurosawa

IPC分类号： B23K26/06 ,  B23K26/067 ,  B23K26/38 ,  B23K101/42 ,  G03F7/20 ,  H05K3/00 ,  G03B27/54 ,  H01S3/098

CPC分类号： B23K26/0673 ,  B23K26/066 ,  B23K26/067 ,  B23K26/382 ,  B23K26/386 ,  B23K26/40 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/172 ,  G03F7/2006 ,  H05K3/0017

摘要： A laser beam machining apparatus including an image-transfer optical system having a mask inserted in an optical path between a laser oscillator and a workpiece, and a lens for reducing and forming an image of the mask on a processing surface; a focusing optical system; a drive unit for selecting one of the image-transfer optical system and the focusing optical system; and a numerical controller for controlling the image-transfer optical system, the focusing optical system, and the drive unit, wherein one of the image-transfer optical system and the focusing optical system is selected in correspondence with the diameter and depth of a hole to be processed.

摘要翻译： 一种激光束加工设备，包括具有插入在激光振荡器和工件之间的光路中的掩模的图像转移光学系统和用于在处理表面上减小和形成掩模的图像的透镜; 聚焦光学系统; 用于选择图像转印光学系统和聚焦光学系统之一的驱动单元; 以及用于控制图像转印光学系统，聚焦光学系统和驱动单元的数字控制器，其中，所述图像转印光学系统和聚焦光学系统之一根据孔的直径和深度来选择 被处理。

公开(公告)号：US5776220A

公开(公告)日：1998-07-07

申请号：US573471

申请日：1995-12-15

申请人： Roger A. Allaire ,  Harry E. Menegus ,  Bruce H. Raeder ,  Harrie J. Stevens

发明人： Roger A. Allaire ,  Harry E. Menegus ,  Bruce H. Raeder ,  Harrie J. Stevens

IPC分类号： B23K26/073 ,  C03B33/09 ,  C03C23/00 ,  B05B12/00 ,  B05B12/04 ,  C03C17/23

CPC分类号： B23K26/0736 ,  B23K26/364 ,  B23K26/40 ,  C03B33/091 ,  C03C23/0025 ,  B23K2203/172 ,  Y10T225/12

摘要： A glass breaking system is provided for breaking large sheets of glass into small sheets, in which a laser beam having an elongated beam spot shape, with a largest dimension which is at least 20 mm, more preferably at least 30 mm, and most preferably at least 40 mm, is moved across a glass sheet to produce a partial crack score line. The glass sheet is then separated along the score line by applying a bending moment in the area of the partial crack.

摘要翻译： 提供一种玻璃破碎系统，用于将大片玻璃切割成小片，其中具有细长束斑形状的激光束，其最大尺寸为至少20mm，更优选至少30mm，最优选在 至少40mm，穿过玻璃板移动以产生部分裂纹刻痕线。 然后通过在部分裂纹的区域中施加弯曲力矩，沿着刻痕线分离玻璃板。

公开(公告)号：US5767480A

公开(公告)日：1998-06-16

申请号：US508513

申请日：1995-07-28

申请人： Noah L. Anglin ,  Nick Bacile ,  Vladimir Perelman

发明人： Noah L. Anglin ,  Nick Bacile ,  Vladimir Perelman

IPC分类号： B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  H01L21/48 ,  H01L23/495 ,  B23K26/00

CPC分类号： B23K26/361 ,  B23K26/362 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/4821 ,  H01L23/49541 ,  B23K2201/42 ,  B23K2203/05 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  H01L2924/0002 ,  Y10T29/49121

摘要： Lead frames for integrated circuit packaging are partly fabricated using laser machining to form the very small diameter (0.005 to 0.010 diameter) holes in the lead frames which are later used for epoxy adhesive penetration. A high power Nd:YAG laser provides a laser beam which is moved and focused by a control unit onto the surface of a continuous stock strip in order is to drill the epoxy holes at the desired locations. A similar apparatus, but using a copper vapor laser, can trim very fine pitch (0.005 inch) leads for the lead frames. The remaining parts of the lead frames, which involve larger sized elements, are formed conventionally by using stamping or etching. By controlling the laser operating parameters in terms of laser power, pulse duration and pulse frequency and by control of the location of the laser beam by deflecting galvanometers, very precise cutting and drilling can be accomplished, with accuracy down to 0.00005 inch or less. Tooling costs are thereby reduced and in addition new types of lead frames with very closely spaced lead tips can be fabricated that cannot be fabricated using conventional processes.

摘要翻译： 用于集成电路封装的引线框架部分地使用激光加工制造，以在引线框架中形成非常小的直径（0.005至0.010直径）的孔，后来用于环氧树脂粘合剂渗透。 高功率Nd：YAG激光器提供激光束，其由控制单元移动和聚焦到连续坯料的表面上，以便在期望的位置钻出环氧树脂孔。 类似的设备，但使用铜蒸气激光器，可以修剪引线框架的非常细的间距（0.005英寸）引线。 引导框架的其余部分涉及更大尺寸的元件，通常通过使用冲压或蚀刻来形成。 通过根据激光功率，脉冲持续时间和脉冲频率控制激光器的工作参数，并通过偏转电流计控制激光束的位置，可以精确地进行精确的切割和钻孔，精度低至0.00005英寸或更小。 从而减少了模具成本，此外，可以制造不能使用常规工艺制造的具有非常紧密间隔的引线头的新型引线框架。

公开(公告)号：US5766497A

公开(公告)日：1998-06-16

申请号：US829370

申请日：1997-03-31

申请人： Alexander Mitwalsky ,  James Gardner Ryan ,  Thomas Anthony Wassick

发明人： Alexander Mitwalsky ,  James Gardner Ryan ,  Thomas Anthony Wassick

IPC分类号： H01L21/306 ,  B23K26/06 ,  B23K26/18 ,  B23K26/40 ,  H01L21/268 ,  H01L21/311 ,  H05K3/00 ,  B44C1/22 ,  H01L21/00

CPC分类号： B23K26/0661 ,  B23K26/18 ,  B23K26/40 ,  H01L21/311 ,  H01L21/31105 ,  B23K2201/40 ,  B23K2203/172 ,  B23K2203/50 ,  H05K3/0017

摘要： A process for ablation etching through one or more layers of dielectric materials while not etching an underlying conductive material layer comprises selecting parameters whereby the ablation process automatically stops when the conductive material layer is reached, or monitoring the process for end point detection of the desired degree of ablation. Parameters selected are the absorptivity of the dielectric layer versus that of the conductive material layer. End point detection comprises monitoring radiant energy reflected from the workpiece or the content of the materials being ablated from the workpiece.

摘要翻译： 在不蚀刻下面的导电材料层的情况下，通过一个或多个介电材料层进行烧蚀蚀刻的方法包括选择参数，由此当达到导电材料层时，消融过程自动停止，或者监测所需程度的终点检测过程 的消融。 选择的参数是电介质层与导电材料层的吸收率。 终点检测包括监测从工件反射的辐射能或从工件烧蚀的材料的内容物。

公开(公告)号：US5744776A

公开(公告)日：1998-04-28

申请号：US332565

申请日：1994-10-31

申请人： David J. Bauer

发明人： David J. Bauer

IPC分类号： B60K37/00 ,  B23K26/00 ,  B23K26/03 ,  B23K26/38 ,  B23K26/40 ,  B29C35/08 ,  B29C59/00 ,  B29C59/16 ,  B60R21/2165

CPC分类号： B23K26/0087 ,  B23K26/0006 ,  B23K26/03 ,  B23K26/0344 ,  B23K26/0665 ,  B23K26/123 ,  B23K26/364 ,  B23K26/386 ,  B23K26/40 ,  B23K26/402 ,  B29C59/007 ,  B29C59/16 ,  B60R21/2165 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/32 ,  B23K2203/34 ,  B23K2203/38 ,  B23K2203/42 ,  B23K2203/50 ,  B29C2035/0838 ,  B29C2791/009 ,  B29C2793/0054 ,  B29L2031/3005 ,  B29L2031/3008 ,  B29L2031/3038 ,  B60R2021/21654

摘要： A process for preweakening the inside of an automotive trim piece cover layer of various constructions by use of a laser beam so as to enable formation of an air bag deployment opening in the trim piece formed at the time the air bag deploys. The laser beam impinges the inside surface of the cover to form a groove scoring or spaced perforations to form a preweakening pattern. A robot arm may be used to move a laser generator so as to form the preweakening pattern. The laser beam can be controlled in accordance with sensed conditions to achieve accurate preweakening, and may also be used to trim substrate panels and to perform other cutting operations.

摘要翻译： 一种通过使用激光束对各种结构的汽车装饰件覆盖层的内部进行预锻造的方法，以便能够在气囊展开时形成的装饰件中形成气囊展开开口。 激光束撞击盖的内表面以形成凹槽刻痕或间隔开的穿孔以形成预制纹图案。 可以使用机器人手臂来移动激光发生器，以形成预觉图案。 可以根据感测到的条件来控制激光束以实现精确的预冲动，并且还可以用于修整基板并进行其它切割操作。

公开(公告)号：US5718384A

公开(公告)日：1998-02-17

申请号：US546238

申请日：1995-10-20

申请人： Christoph Treutler ,  Hans-Friedemann Kober

发明人： Christoph Treutler ,  Hans-Friedemann Kober

IPC分类号： F02M61/16 ,  B23K26/40 ,  B23K26/402 ,  B29C33/38 ,  B29D33/00 ,  F02M61/18 ,  B05B1/32

CPC分类号： F02M61/184 ,  B23K26/40 ,  B23K26/402 ,  B29C33/3857 ,  B23K2203/172 ,  B23K2203/42 ,  B29L2031/045

摘要： The invention relates to an injection nozzle for a diesel injection system in motor vehicles, having at least one spray passage penetrating an injection nozzle and to a process for manufacturing the injection nozzle. The invention provides for the injection nozzle to be formed from two parts which engage with one another as a form-fit and are in contact on generated surfaces and for the spray passages to be configured as open-edged depressions on at least one of the generated surfaces.

摘要翻译： 本发明涉及一种用于机动车辆中的柴油喷射系统的喷射喷嘴，其具有至少一个穿过喷射喷嘴的喷射通道和用于制造喷射喷嘴的工艺。 本发明提供了注射喷嘴由两部分形成，这两个部分彼此接合，形成配合，并在生成的表面上接触，并且喷射通道被构造成在所产生的至少一个上的开口凹陷 表面。

公开(公告)号：US5641416A

公开(公告)日：1997-06-24

申请号：US548019

申请日：1995-10-25

申请人： Surjit S. Chadha

发明人： Surjit S. Chadha

IPC分类号： B23K26/38 ,  B23K26/40 ,  H01L21/301 ,  H01L21/78 ,  B23K26/08

CPC分类号： H01L21/78 ,  B23K26/386 ,  B23K26/40 ,  B23K2203/172 ,  B23K2203/50

摘要： A process for separating FED baseplates or other types of die assemblies from one another without producing any particulate matter or slag that could damage some of the baseplates. In one embodiment a high energy beam is aligned with a cutting line on the wafer that defines a path between the die assemblies along which the wafer is to be cut. At least one of the high energy beam or the wafer is moved in the direction of the cutting line so that the high energy beam passes over the wafer and penetrates the wafer to an intermediate depth along the length of the cutting line. The moving step is then repeated after each pass of the high energy beam over the wafer until the wafer is severed along the cutting path.

摘要翻译： 一种将FED基板或其他类型的模具组件彼此分离而不产生可能损坏一些基板的任何颗粒物质或炉渣的方法。 在一个实施例中，高能量束与晶片上的切割线对准，其限定晶片待切割的模具组件之间的路径。 高能量束或晶片中的至少一个沿着切割线的方向移动，使得高能束通过晶片并将晶片穿过切割线的长度的中间深度。 然后在晶片上的高能量束每次通过之后重复移动步骤，直到晶片沿切割路径切断。

公开(公告)号：US5593606A

公开(公告)日：1997-01-14

申请号：US276797

申请日：1994-07-18

申请人： Mark D. Owen ,  James N. O'Brien

发明人： Mark D. Owen ,  James N. O'Brien

IPC分类号： B23K26/00 ,  B23K26/38 ,  B23K26/40 ,  B23K101/42 ,  C23C14/04 ,  C23C14/28 ,  H05K3/00 ,  H05K3/02 ,  H05K3/40 ,  H05K3/42

CPC分类号： H05K3/4076 ,  B23K26/384 ,  B23K26/386 ,  B23K26/388 ,  B23K26/40 ,  B23K26/402 ,  C23C14/046 ,  C23C14/048 ,  C23C14/28 ,  H05K3/0035 ,  H05K3/0038 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/14 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/40 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  B23K2203/54 ,  H05K2203/107 ,  H05K2203/108 ,  H05K3/027 ,  H05K3/427

摘要： The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential drilling or via formation in a wide variety of materials such as metals, organic dielectrics, and reinforcement materials having different thermal absorption characteristics in response to ultraviolet light. These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz. The laser system (10) and method circumvent conventional depth of cut saturation limitations and can achieve an increased depth of cut per pulse in a target (40) formed of either single- or multi-layered material.

摘要翻译： 连续泵浦的Q开关Nd：YAG激光器（10）的输出被频率转换以提供用于在多层靶（40）中形成通孔（72,74）的紫外光（62）。 选择输出脉冲（62）的参数以便于在各种各样的材料（例如响应于紫外光的不同热吸收特性的金属，有机电介质和增强材料）中促进基本清洁，同时或顺序的钻孔或通孔形成。 这些参数通常包括以下标准中的至少两个：在束斑区域上测量的大于约100毫瓦的高平均功率，短于约100纳秒的时间脉冲宽度，小于约50微米的光点直径，以及 重复率大于约1千赫兹。 激光系统（10）和方法规避了传统的切割深度饱和度限制，并且可以实现由单层或多层材料形成的目标（40）中每脉冲的切割深度增加。