Abstract:
Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.
Abstract:
The tiltable-body apparatus including a frame member, a tiltable body, and a pair of torsion springs having a twisting longitudinal axis. The torsion springs are disposed along the twisting longitudinal axis opposingly with the tiltable body being interposed, support the tiltable body flexibly and rotatably about the twisting longitudinal axis relative to the frame member, and include a plurality of planar portions, compliant directions of which intersect each other when viewed along a direction of the twisting longitudinal axis. A center of gravity of the tiltable body is positioned on the twisting longitudinal axis of the torsion springs.
Abstract:
An across-wafer optical MEMS device includes a protective lid having across-wafer light-transmissive portions. The across-wafer optical MEMS device allows light to pass in a direction substantially parallel to a surface on which the optical MEMS device is mounted. The light-transmissive portions in the protective lid allow light to pass from an optical device located on one side of the optical MEMS device to a second device located on another side of the optical MEMS device. A plurality of optical MEMS devices can be located on the substrate and enclosed by the same lid without wafer-level encapsulation of each optical MEMS device.
Abstract:
A MEMS (Micro Electro Mechanical System) variable optical attenuator is provided that is capable of optical attenuation over a full range of optical power. The MEMS variable optical attenuator comprises a microelectronic substrate, a MEMS actuator and an optical shutter. The MEMS variable optical attenuator may also comprise a clamping element capable of locking the optical shutter at a desired attenuation position. The variable light attenuator is capable of attenuating optical beams that have their optical axis running parallel and perpendicular to the substrate. Additionally, the MEMS actuator of the present invention may comprise an array of MEMS actuators capable of supplying the optical shutter with greater displacement distances and, thus a fuller range of optical attenuation. In one embodiment of the invention, the MEMS actuator comprises a thermal arched beam actuator. Additionally, the variable optical attenuator of the present invention may be embodied in a thermal bimorph cantilever structure. This alternate embodiment includes a microelectronic substrate and a thermal bimorph cantilever structure having at least two materials of different thermal coefficient of expansion. The thermal bimorph is responsive to thermal activation and moves in the direction of the material having the lower thermal coefficient expansion. Upon activation, the thermal bimorph intercepts the path of the optical beam and provides for the desired level of optical attenuation. The invention also provides for a method of optical attenuation and a method for fabricating an optical attenuator in accordance with the described structures.
Abstract:
A wideband power attenuator in RF-MEMS multilayer technology, for attenuating an electromagnetic signal, includes an upper layer with two RF ground planes, and between said two RF ground planes a central RF-MEMS movable switch as a floating electrode, an RF input, an RF output of an RF line running across the attenuator, a number of lower layers including in sequence: a ground floor of an electrically insulating substrate; two DC biasing electrodes to electrostatically control said movable switch, and DC biasing lines to feed the DC biasing electrodes; two DC-RF decoupling resistors, each decoupling resistor being connected on one side to respective terminals of said movable switch, and on the other side to respective one of the two RF ground planes; a resistive load adapted to be connected to the RF line to attenuate the electromagnetic signal on the basis of the floating movable switch configuration, between a non-contact RF position and a contact RF position with said RF line.
Abstract:
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Abstract:
A process for manufacturing an interaction system of a microelectromechanical type for a storage medium, the interaction system provided with a supporting element and an interaction element carried by the supporting element, envisages the steps of: providing a wafer of semiconductor material having a substrate with a first type of conductivity and a top surface; forming a first interaction region having a second type of conductivity, opposite to the first type of conductivity, in a surface portion of the substrate in the proximity of the top surface; and carrying out an electrochemical etch of the substrate starting from the top surface, the etching being selective with respect to the second type of conductivity, so as to remove the surface portion of the substrate and separate the first interaction region from the substrate, thus forming the supporting element.
Abstract:
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).
Abstract:
Microstructured hybrid actuator assemblies in which microactuators carrying designed surface properties to be revealed upon actuation are embedded in a layer of responsive materials. The microactuators in a microactuator array reversibly change their configuration in response to a change in the environment without requiring an external power source to switch their optical properties.
Abstract:
This disclosure provides systems, methods and apparatus for shutter-based EMS light modulators controlled by electrode actuators that include complementary sets of corrugations or teeth along the opposing beams of the actuators. The complementary sets of corrugations substantially engage one another when drawn together via an actuation voltage. By applying the actuation voltage across the opposing beams of such an actuator, the beams are drawn together both by the electromotive force resulting from the electric field acting between the portions of the beams that are substantially perpendicular to the direction of actuation of the actuator, and by fringing fields between the sides of the corrugations, which are substantially parallel to the direction of actuation. The additional fringing fields provide for increased electromotive force for a given input voltage.