公开(公告)号：US20160327446A1

公开(公告)日：2016-11-10

申请号：US15110261

申请日：2014-11-17

申请人： ROBERT BOSCH GMBH

发明人： Johannes Classen ,  Jochen Reinmuth ,  Arnd Kaelberer

IPC分类号： G01L9/00

CPC分类号： G01L9/0041 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/012 ,  G01L9/0073 ,  G01L13/026 ,  G01L19/0636

摘要： A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device includes an ASIC wafer having a front side and a rear side, and a rewiring system, formed on the front side of the ASIC wafer, which includes a plurality of stacked strip conductor levels and insulation layers. The pressure sensor device also includes a MEMS wafer having a front side and a rear side, a first micromechanical functional layer which is formed above the front side of the MEMS wafer, and a second micromechanical functional layer which is formed above the first micromechanical functional layer.

摘要翻译： 一种微机械压力传感器装置及相应的制造方法。 微机械压力传感器装置包括具有前侧和后侧的ASIC晶片和形成在ASIC晶片的前侧上的重新布线系统，其包括多个堆叠的带状导体层和绝缘层。 压力传感器装置还包括具有前侧和后侧的MEMS晶片，形成在MEMS晶片前侧的第一微机械功能层和形成在第一微机械功能层上方的第二微机械功能层 。

公开(公告)号：US20160297671A1

公开(公告)日：2016-10-13

申请号：US14685259

申请日：2015-04-13

申请人： EPCOS AG

发明人： Wolfgang Pahl

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/07 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15151 ,  H01L2924/16152

摘要： A MEMS sensor component with a reduced sensitivity to internal or external stress and small spatial dimensions is provided. The component comprises a MEMS chip arranged in a cavity below a cap and elastically mounted to a carrier substrate by a connection element in a flip-chip configuration.

摘要翻译： 提供了对内部或外部应力和小空间尺寸的灵敏度降低的MEMS传感器部件。 该组件包括布置在盖下方的空腔中的MEMS芯片，并且通过倒装芯片配置的连接元件弹性地安装到载体基板。

公开(公告)号：US09446945B2

公开(公告)日：2016-09-20

申请号：US14639530

申请日：2015-03-05

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yi-Heng Tsai ,  Yi-Hsien Chang ,  Chun-Ren Cheng ,  Chun-Wen Cheng ,  Tzu-Heng Wu ,  Wei-Cheng Shen

IPC分类号： H01L31/0203 ,  B81B7/00 ,  B81C1/00

CPC分类号： B81C1/00238 ,  B81B7/0048

摘要： A three-dimensional (3D) integrated circuit (IC) includes a first IC and a second IC. The first IC includes a MEMS device and a first bonding structure. The second IC includes a second bonding structure. The first and second bonding structures are bonded together to couple the first IC to the second IC. A conformal barrier layer is disposed over a surface of the second IC nearest the first IC. An etch isolation structure is arranged beneath the surface of the second IC and encloses a sacrificial region which is arranged on either side of the second bonding structure and which is arranged in the second IC.

摘要翻译： 三维（3D）集成电路（IC）包括第一IC和第二IC。 第一IC包括MEMS器件和第一接合结构。 第二IC包括第二接合结构。 第一和第二接合结构被结合在一起以将第一IC耦合到第二IC。 在距离第一IC最近的第二IC的表面上设置保形阻挡层。 蚀刻隔离结构被布置在第二IC的表面下方并且包围一个牺牲区域，该牺牲区域被布置在第二接合结构的任一侧上并且被布置在第二IC中。

公开(公告)号：US20160244324A1

公开(公告)日：2016-08-25

申请号：US15144046

申请日：2016-05-02

申请人： InvenSense, Inc.

发明人： Ilya Gurin

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0058 ,  B81B7/0048 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00674

摘要： In accordance with an example embodiment of this disclosure, a micro-electro-mechanical system (MEMS) device comprises a substrate, a CMOS die, and a MEMS die, each of which comprises a top side and a bottom side. The bottom side of the CMOS die is coupled to the top side of the substrate, and the MEMS die is coupled to the top side of the CMOS die, and there is a cavity positioned between the CMOS die and the substrate. The cavity may be sealed by a sealing substance, and may be filled with a filler substance (e.g., an adhesive) that is different than the sealing substance (e.g., a gaseous or non-gaseous substance). The cavity may be fully or partially surrounded by one or more downward-protruding portions of the CMOS die and/or one or more upward-protruding portions of the substrate.

摘要翻译： 根据本公开的示例性实施例，微电子机械系统（MEMS）装置包括基板，CMOS管芯和MEMS管芯，每个管芯包括顶侧和底侧。 CMOS裸片的底侧耦合到衬底的顶侧，并且MEMS管芯耦合到CMOS管芯的顶侧，并且存在位于CMOS管芯和衬底之间的空腔。 空腔可以由密封材料密封，并且可以填充与密封物质（例如气态或非气态物质）不同的填充物质（例如粘合剂）。 空腔可以由CMOS管芯的一个或多个向下突出部分和/或衬底的一个或多个向上突出部分完全或部分地包围。

公开(公告)号：US20160229689A1

公开(公告)日：2016-08-11

申请号：US15004252

申请日：2016-01-22

申请人： Analog Devices, Inc.

发明人： Bradley C. Kaanta ,  John A. Alberghini ,  Kemiao Jia

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048

摘要： A packaged microchip has a base, a die with a mounting surface, and an electrically inactive interposer between the base and the die. The interposer has a first side with at least one recess that extends no more than part-way through the interposer from the first side. Accordingly, the recess defines a top portion (of the first side) with a top area. The die mounting surface, which is coupled with the interposer, correspondingly has a die area. The top area of the interposer preferably is less than the die area.

摘要翻译： 封装的微芯片具有基座，具有安装表面的管芯，以及在基座和管芯之间的无电插拔器。 插入器具有第一侧面，该第一侧面具有至少一个凹槽，该凹槽不超过第一侧的插入件的一部分延伸。 因此，凹部限定具有顶部区域的顶部（第一侧的顶部）。 与插入器耦合的管芯安装表面相应地具有管芯区域。 插入件的顶部面积优选小于模具面积。

公开(公告)号：US20160169931A1

公开(公告)日：2016-06-16

申请号：US14858563

申请日：2015-09-18

申请人： STMICROELECTRONICS S.R.L.

发明人： Alessandro TOCCHIO

IPC分类号： G01P15/02

CPC分类号： G01P15/02 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/5712 ,  G01P15/125 ,  G01P2015/0831 ,  G01P2015/0837

摘要： Described herein is a microelectromechanical detection structure, provided with: a substrate having a top surface extending in a plane; a detection-electrode arrangement; an inertial mass, suspended above the substrate and the detection-electrode arrangement; and elastic elements, coupling the inertial mass to a central anchorage element fixed with respect to the substrate, in such a way that it is free to rotate about an axis of rotation as a function of a quantity to be detected along a vertical axis, the central anchorage element being arranged at the axis of rotation. A suspension structure is coupled to the detection-electrode arrangement for supporting it, suspended above the substrate and underneath the inertial mass, and is anchored to the substrate via at least one first anchorage region; the fixed-electrode arrangement is anchored to the suspension structure via at least one second anchorage region.

摘要翻译： 本文描述的是一种微机电检测结构，其具有：具有在平面内延伸的顶表面的基底; 检测电极装置; 悬浮在衬底上的惯性质量块和检测电极装置; 以及将惯性质量联接到相对于衬底固定的中心锚固元件，使得其可以围绕作为沿着垂直轴检测的量的函数的旋转轴线自由旋转， 中心锚固元件布置在旋转轴线处。 悬架结构耦合到检测电极装置，用于支撑它，悬浮在基底上方和惯性块下方，并且经由至少一个第一锚固区域锚固到基底; 固定电极装置经由至少一个第二锚定区域锚固到悬挂结构。

公开(公告)号：US20160169758A1

公开(公告)日：2016-06-16

申请号：US14569068

申请日：2014-12-12

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： STEPHEN R. HOOPER ,  CHAD S. DAWSON

IPC分类号： G01L9/00 ,  B81C1/00 ,  B81B7/00

CPC分类号： B81B7/0061 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  G01L9/0073 ,  G01L13/025 ,  G01L15/00 ,  H01L2224/48137

摘要： A package includes a MEMS die and a cap element coupled to and stacked with the MEMS die. The MEMS die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure. A first pressure sensor is vented to a first external environment via a first vent extending through the bottom of the MEMS die and is adapted to detect a first pressure of the first external environment. The MEMS die can be coupled to a lead frame having an opening that is aligned with the first vent. A second sensor is vented to a second external environment via a second vent extending through the cap element and is adapted to detect a second pressure of the second external environment. A difference between the first and second pressures is the differential pressure.

摘要翻译： 封装包括MEMS管芯和耦合到MEMS管芯并与其堆叠的帽元件。 MEMS管芯包括至少两个物理隔离的压力传感器，每个压力传感器位于其单独的悬臂平台结构上。 第一压力传感器经由延伸穿过MEMS管芯的底部的第一通气孔排放到第一外部环境，并适于检测第一外部环境的第一压力。 MEMS管芯可以连接到具有与第一通气口对准的开口的引线框架。 第二传感器经由延伸穿过盖元件的第二通风孔排放到第二外部环境，并适于检测第二外部环境的第二压力。 第一和第二压力之间的差值是差压。

公开(公告)号：US20160167949A1

公开(公告)日：2016-06-16

申请号：US14568845

申请日：2014-12-12

申请人： Apple Inc.

发明人： Tongbi Jiang ,  Jie-Hua Zhao ,  Peter G. Hartwell

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/99 ,  B81C3/001 ,  B81C2203/035 ,  B81C2203/07

摘要： MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.

公开(公告)号：US09366593B2

公开(公告)日：2016-06-14

申请号：US14039706

申请日：2013-09-27

申请人： Infineon Technologies AG

发明人： Mathias Vaupel ,  Horst Theuss ,  Helmut Wietschorke

IPC分类号： G01L9/00 ,  B81B7/00 ,  B81C1/00 ,  G01L19/00

CPC分类号： G01L9/0045 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  G01L9/0042 ,  G01L9/0054 ,  G01L19/0007 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

摘要翻译： 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。

公开(公告)号：US09343367B2

公开(公告)日：2016-05-17

申请号：US14577128

申请日：2014-12-19

申请人： ANALOG DEVICES, INC.

发明人： Thomas M. Goida ,  Xiaojie Xue

IPC分类号： H01L21/78 ,  H01L29/06 ,  H01L23/31

CPC分类号： H01L25/0657 ,  B81B7/0048 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

摘要： An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.

摘要翻译： 公开了一种集成器件管芯和封装。 集成器件裸片包括一体式。 整体可以具有包括一个或多个活性组分的上部部分。 上部可以具有限定上部的周边的至少一部分的第一和第二相对侧边，使得上部的上表面设置在第一和第二相对的侧面的上边缘之间。 整体也可以具有与上部一体地形成的下部。 下部可以包括从上部向下延伸的基座。 基座可以从第一和第二相对侧面的下边缘侧向插入。 基座可以包括配置成联接到托架的远端部分。