公开(公告)号：US09190211B2

公开(公告)日：2015-11-17

申请号：US14452595

申请日：2014-08-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Seiji Fujita ,  Hiroshige Adachi ,  Kazuhiro Kaneko ,  Satoru Adachi ,  Sadaaki Sakamoto

IPC: H01G4/10 ,  H01G4/12 ,  C04B35/20 ,  C04B35/443 ,  C04B35/462 ,  H01G4/30 ,  H01G4/40 ,  B32B18/00 ,  H01L23/552

CPC classification number: H01G4/129 ,  B32B18/00 ,  C03C3/064 ,  C03C12/00 ,  C03C14/004 ,  C04B35/20 ,  C04B35/443 ,  C04B35/462 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3262 ,  C04B2235/3281 ,  C04B2235/3445 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/62 ,  H01G4/105 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/30 ,  H01G4/40 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19105

Abstract: A composite laminated ceramic electronic component that includes co-fired low dielectric-constant ceramic layers and high dielectric-constant ceramic layers. The low dielectric-constant ceramic layers and high dielectric-constant ceramic layers are each composed of a glass ceramic containing: a first ceramic composed of MgAl2O4 and/or Mg2SiO4; a second ceramic composed of BaO, RE2O3 (RE is a rare-earth element), and TiO2; glass containing each of 44.0 to 69.0 weight % of RO (R is an alkaline-earth metal), 14.2 to 30.0 weight % of SiO2, 10.0 to 20.0 weight % of B2O3, 0.5 to 4.0 weight % of Al2O3, 0.3 to 7.5 weight % of Li2O, and 0.1 to 5.5 weight % of MgO; and MnO, and the content ratios of the glass, etc. are varied between the low dielectric-constant ceramic layers and the high dielectric-constant ceramic layers.

Abstract translation: 一种复合层压陶瓷电子元件，包括共烧低介电常数陶瓷层和高介电常数陶瓷层。 低介电常数陶瓷层和高介电常数陶瓷层各自由玻璃陶瓷组成，该陶瓷含有：由MgAl 2 O 4和/或Mg 2 SiO 4组成的第一陶瓷; 由BaO，RE2O3（RE为稀土元素）和TiO2组成的第二陶瓷; 含有44.0〜69.0重量％的RO（R为碱土金属），14.2〜30.0重量％的SiO 2，10.0〜20.0重量％的B 2 O 3，0.5〜4.0重量％的Al 2 O 3，0.3〜7.5重量％ 的Li 2 O和0.1〜5.5重量％的MgO; 和MnO，并且玻璃等的含量比在低介电常数陶瓷层和高介电常数陶瓷层之间变化。

公开(公告)号：US08780524B2

公开(公告)日：2014-07-15

申请号：US13394983

申请日：2011-03-07

Applicant: Noritaka Yoshida

Inventor： Noritaka Yoshida

IPC: H01G4/06 ,  C03C1/00 ,  C04B38/00 ,  B29C65/00

CPC classification number: H01G4/129 ,  C03C11/007 ,  H01B3/12 ,  H01G4/33

Abstract: A ceramic electronic component includes a ceramic sintered body and an electrode provided on a surface of the ceramic sintered body. The electrode contains Ag. The ceramic sintered body contain glass material made of borosilicate glass. The glass material has closed pores and open pores therein. The closed pores and the open pores have diameters decreasing as being located away from the surface of the ceramic sintered body. This ceramic electronic component can prevent delamination of the electrode from the ceramic sintered body during a process of firing a green sheet.

Abstract translation: 陶瓷电子部件包括陶瓷烧结体和设置在陶瓷烧结体的表面上的电极。 电极含有Ag。 陶瓷烧结体包含由硼硅酸盐玻璃制成的玻璃材料。 玻璃材料具有闭孔和开孔。 闭孔和开放孔的直径随陶瓷烧结体表面的位置而减小。 该陶瓷电子部件能够防止在烧成生片的过程中电极与陶瓷烧结体分层。

公开(公告)号：US20140085842A1

公开(公告)日：2014-03-27

申请号：US14036256

申请日：2013-09-25

Applicant: Ping-Jung Yang

Inventor： Ping-Jung Yang

IPC: H05K1/09

CPC classification number: H01L24/30 ,  H01G4/129 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L51/0096 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/056 ,  H01L2224/05688 ,  H01L2224/05788 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32151 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05B33/0896 ,  H05K1/09 ,  Y02E10/549 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01029

Abstract: A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein one of the conductors comprise a copper-tungsten alloy material, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors.

Abstract translation: 一种基板，包括具有第一表面和与所述第一表面相对的第二表面的固体玻璃芯体; 多个导体从第一表面开始延伸穿过固体玻璃核心并且在第二表面处终止，其中一个导体具有第三表面和第四表面，其中第三表面和第一表面基本上共面，其中第二表面 并且所述第四表面基本上共面，其中所述导体之一包括铜 - 钨合金材料，其中所述固体玻璃芯直接与所述导体接触; 以及形成在所述第一表面处的第一介电层和第一金属层，其中所述第一表面处的所述第一金属层与所述导体之一电耦合。

公开(公告)号：US20120262839A1

公开(公告)日：2012-10-18

申请号：US13386082

申请日：2010-07-23

Applicant: Takashi Murata

Inventor： Takashi Murata

IPC: H01G4/08 ,  B32B17/00

CPC classification number: H01G4/129 ,  H01G4/105 ,  Y02T10/7022 ,  Y10T428/24355

Abstract: A glass film for a capacitor has a thickness of 50 μm or less and an average surface roughness Ra of 50 Å or less. The glass film for a capacitor also has a dielectric constant at a frequency of 1 MHz of 5 or more and a dielectric dissipation factor at a frequency of 1 MHz of 0.05 or less.

Abstract translation: 电容器用玻璃膜的厚度为50μm以下，平均表面粗糙度Ra为50以下。 用于电容器的玻璃膜还具有1MHz的频率为5或更大的介电常数，并且在1MHz的频率下的介电损耗因子为0.05或更小。

公开(公告)号：US08183108B2

公开(公告)日：2012-05-22

申请号：US12301791

申请日：2006-06-15

Applicant: William J. Borland ,  Seigi Suh ,  Jon-Paul Maria ,  Jon Fredrick Ihlefeld ,  Ian Burn

Inventor： William J. Borland ,  Seigi Suh ,  Jon-Paul Maria ,  Jon Fredrick Ihlefeld ,  Ian Burn

IPC: H01L21/20 ,  H01B3/20 ,  H01B3/00

CPC classification number: H01L21/31691 ,  C23C18/1212 ,  C23C18/1241 ,  C23C18/1266 ,  C23C18/1283 ,  C23C18/1295 ,  H01G4/129 ,  H05K1/162 ,  H05K2201/017 ,  H05K2201/0355

Abstract: A method of making dense dielectrics layers via chemical solution deposition by adding inorganic glass fluxed material to high dielectric constant compositions, depositing the resultant mixture onto a substrate and annealing the substrate at temperatures between the softening point of the inorganic glass flux and the melting point of the substrate. A method of making a capacitor comprising a dense dielectric layer.

Abstract translation: 一种通过在高介电常数组合物中添加无机玻璃助熔材料，通过化学溶液沉积制造致密电介质层的方法，将所得混合物沉积在基材上，并在无机玻璃熔剂的软化点和熔点之间的温度 底物。 一种制造包括致密介电层的电容器的方法。

公开(公告)号：US08147633B2

公开(公告)日：2012-04-03

申请号：US13175813

申请日：2011-07-01

Applicant: Soo Hyun Lyoo ,  Yong Seok Choi

Inventor： Soo Hyun Lyoo ,  Yong Seok Choi

IPC: C03C29/00 ,  C03C1/00

CPC classification number: B32B18/00 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2237/343 ,  C04B2237/56 ,  C04B2237/588 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01G4/129 ,  H01G4/30 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24926 ,  Y10T428/2495 ,  Y10T428/252

Abstract: There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.

Abstract translation: 提供了制造陶瓷烧结体的方法。 根据本发明的一个方面的陶瓷烧结体的制造方法可以包括：制备至少一个具有第一陶瓷颗粒和玻璃颗粒的陶瓷片; 制备具有比玻璃颗粒和第一陶瓷颗粒小的粒径的第二陶瓷颗粒的至少一个约束片; 通过在陶瓷片和约束片彼此接触的同时交替陶瓷片和约束片形成陶瓷层压体; 并且烧结陶瓷层压体，使得当陶瓷片烧结时，不与第一陶瓷颗粒反应的组分从玻璃颗粒移动到约束片中以烧结约束片。

公开(公告)号：US20110277912A1

公开(公告)日：2011-11-17

申请号：US13175813

申请日：2011-07-01

Applicant: Soo Hyun Lyoo ,  Yong Seok Choi

Inventor： Soo Hyun Lyoo ,  Yong Seok Choi

IPC: C04B37/00

CPC classification number: B32B18/00 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2237/343 ,  C04B2237/56 ,  C04B2237/588 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01G4/129 ,  H01G4/30 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24926 ,  Y10T428/2495 ,  Y10T428/252

Abstract: There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.

Abstract translation: 提供了制造陶瓷烧结体的方法。 根据本发明的一个方面的陶瓷烧结体的制造方法可以包括：制备至少一个具有第一陶瓷颗粒和玻璃颗粒的陶瓷片; 制备具有比玻璃颗粒和第一陶瓷颗粒小的粒径的第二陶瓷颗粒的至少一个约束片; 通过在陶瓷片和约束片彼此接触的同时交替陶瓷片和约束片形成陶瓷层压体; 并且烧结陶瓷层压体，使得当陶瓷片烧结时，不与第一陶瓷颗粒反应的组分从玻璃颗粒移动到约束片中以烧结约束片。

公开(公告)号：US07727585B2

公开(公告)日：2010-06-01

申请号：US11961218

申请日：2007-12-20

Applicant: Kei Sato ,  Nobuyuki Kobayashi ,  Tsutomu Nanataki

Inventor： Kei Sato ,  Nobuyuki Kobayashi ,  Tsutomu Nanataki

IPC: B05D1/12

CPC classification number: C03C3/0745 ,  C03C8/10 ,  C03C8/14 ,  C03C17/04 ,  H01G4/1209 ,  H01G4/129 ,  H01G4/33 ,  H01L21/02175 ,  H01L21/02197 ,  H01L21/31691 ,  H01L28/40 ,  H01L41/43 ,  Y10T29/42

Abstract: A manufacturing method of a dielectric device includes steps described below. (1) Mixing step: Powders serving as a matrix and additive powders for sintering the matrix are mixed. (2) Mixture heat-treating step: The mixture of the matrix and the additive that has been subject to the mixing step is heat-treated. (3) Deposition layer formation step: The material powders obtained through the mixture heat-treating step are injected toward a substrate so as to form a deposition layer on the substrate. (4) Deposition layer heat-treating step: The deposition layer formed on the substrate through the deposition layer formation step is heat-treated so as to form the dielectric layer on the substrate.

公开(公告)号：US20100014213A1

公开(公告)日：2010-01-21

申请号：US12090335

申请日：2006-10-20

Applicant: Uwe Wozniak ,  Thomas Feichtinger ,  Hermann Gruenbichler ,  Pavol Dudesek ,  Thomas Puerstinger

Inventor： Uwe Wozniak ,  Thomas Feichtinger ,  Hermann Gruenbichler ,  Pavol Dudesek ,  Thomas Puerstinger

IPC: H01G4/12 ,  H01C7/10

CPC classification number: H01G4/129 ,  B32B18/00 ,  B32B2315/02 ,  C04B35/486 ,  C04B2235/3427 ,  C04B2235/3463 ,  C04B2235/36 ,  C04B2235/365 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/661 ,  C04B2237/068 ,  C04B2237/10 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/348 ,  H01C7/025 ,  H01C7/043 ,  H01C7/046 ,  H01G4/1227

Abstract: An electrical component includes a ceramic base body. The ceramic base body includes several ceramic layers including a function layer and a composite layer bordering the function layer. The composite layer can include a zirconium oxide-glass filler mixture.

Abstract translation: 电气部件包括陶瓷基体。 陶瓷基体包括多个陶瓷层，包括功能层和与功能层相邻的复合层。 复合层可以包括氧化锆 - 玻璃填料混合物。

公开(公告)号：US07641970B2

公开(公告)日：2010-01-05

申请号：US10590779

申请日：2005-03-03

Applicant: Takafumi Kawano ,  Masataka Yamanaga ,  Koichi Fukuda

Inventor： Takafumi Kawano ,  Masataka Yamanaga ,  Koichi Fukuda

IPC: B32B5/16 ,  B05D3/02 ,  C04B35/462 ,  C04B35/468 ,  C04B35/47

CPC classification number: C04B35/462 ,  B32B2311/08 ,  B32B2311/12 ,  C01G23/002 ,  C01G23/003 ,  C01P2002/72 ,  C01P2002/85 ,  C01P2004/04 ,  C04B35/4682 ,  C04B35/47 ,  C04B35/62805 ,  C04B35/62821 ,  C04B35/62897 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3234 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/80 ,  C04B2237/346 ,  C04B2237/407 ,  C04B2237/408 ,  H01B3/12 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/129 ,  H01G4/30 ,  Y10T428/12181 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993

Abstract: A low temperature sinterable dielectric ceramic composition is obtained by bending 2.5-20 parts by weight of a glass component per 100 parts by weight of an aggregate of dielectric particles which are composed of Ti-containing dielectric material and contain an oxide including Ti and Zn in the surface portions. A low temperature sintered dielectric ceramic is produced by sintering this low temperature sinterable dielectric ceramic composition at 880 to 1000° C. With this low temperature sinterable dielectric ceramic composition, there can be obtained a multiplayer electronic component having an internal conductor composed of Ag, Cu or an alloy containing at least one of them.

Abstract translation: 低温可烧结介电陶瓷组合物是通过以每100重量份的由含Ti电介质材料构成并含有包含Ti和Zn的氧化物的电介质颗粒的聚集体的形式弯曲2.5-20重量份的玻璃组分 表面部分。 通过在880〜1000℃烧结该低温烧结性电介质陶瓷组合物来制造低温烧结介电陶瓷。使用该低温烧结性介电陶瓷组合物，可以获得具有由Ag，Cu构成的内部导体的多层电子元件 或含有其中至少一种的合金。