Abstract:
High quality epitaxial layers of piezoelectric monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the piezoelectric monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying piezoelectric monocrystalline material layer.
Abstract:
A piezoelectric element includes a first electrode layer 14 provided on a substrate 11 and made of a noble metal to which at least one additive selected from the group consisting of Mg, Ca, Sr, Ba, Al and oxides thereof is added, an orientation control layer 15 provided on the first electrode layer 14 and made of a cubic or tetragonal perovskite oxide that is preferentially oriented along a (100) or (001) plane, and a piezoelectric layer 16 provided on the orientation control layer 15 and made of a rhombohedral or tetragonal perovskite oxide that is preferentially oriented along a (001) plane.
Abstract:
In a piezoelectric element, a cubic or tetragonal orientation control layer (15) is provided on a first electrode layer (14), and formed on the orientation control layer (15) is a piezoelectric layer (16) having a rhombohedral or tetragonal crystalline structure and made of lead zirconate titanate to which a Pb-containing complex perovskite compound expressed by the chemical formula Pb(AaBb)O3 has been added in an amount that is from 1 mol % to 50 mol %. The piezoelectric layer (16) is formed so that the crystal grains thereof become columnar grains which extend in the thickness direction of the piezoelectric layer (16) and in which the ratio of the average cross-sectional diameter to the length is from 1/50 to 1/14.
Abstract translation:在压电元件中,在第一电极层(14)上设置立方或四方取向控制层(15),并且在取向控制层(15)上形成具有菱形或四边形晶体结构的压电层(16) 并由化学式Pb(A a B b B b)O 3表示的含Pb复合钙钛矿化合物的锆钛酸铅制成, 的添加量为1摩尔%〜50摩尔%。 形成压电体层16,使其晶粒成为在压电体层16的厚度方向上延伸的柱状晶粒,其平均截面直径与长度的比率为1/50 到1/14。
Abstract:
A piezoelectric film is provided that is represented by the following general formula: Pb1-b[((X1/3Nb2/3)1-cB′c)1-aYa]O3 wherein X is at least one of Mg, Zn and Ni; B′ is at least one of Zr, Ti and Hf; Y is at least one of V, Nb, Ta, Cr, Mo and W; a satisfies 0.05≦a
Abstract translation:提供了由以下通式表示的压电膜:Pb 1-b [((X 1/3 Nb 2/3) )1-c B'C 1)a-1-a a a a 3 a / 3 >其中X是Mg,Zn和Ni中的至少一种; B'是Zr,Ti和Hf中的至少一种; Y是V,Nb,Ta,Cr,Mo和W中的至少一种; a满足0.05 <= a <0.30; b满足0.025 <= b <= 0.15; 当X为Mg时,c满足0.25 <= c <= 0.35; 当X为Ni时,c满足0.30 <= c <0.40; 当X为Zn时,c满足0.05 <= c <0.15。
Abstract:
A porous layer composed of porous silicon, and the like is formed by anodization and the like on a substrate acting as a vibration sheet of, for example, a liquid discharging head, and a single crystal thin film is epitaxially grown on the porous layer. A lower electrode, a piezoelectric film, and an upper electrode are laminated on the single crystal thin film, and the piezoelectric film is made to a single crystal or a highly oriented polycrystal by a heat treatment. Stress caused by a difference between the thermal expansion coefficient of the substrate and that of the piezoelectric film can be eased by interposing the porous layer therebetween.
Abstract:
In piezoelectric thin films constituting crystalline dielectric thin film elements used for a piezoelectric actuator of a liquid discharge head, stress is generated in the crystallization step by heating due to the lattice misfit. Given this fact, by interposing between a substrate and intermediate layer which has a twin structure that absorbs the stress, film peeling and deterioration of the piezoelectric properties of the piezoelectric thin films are prevented. The intermediate layer is of a multi-layer structure which has a first intermediate layer comprising a twin structure thin film and a second intermediate layer which is the lower electrode, and because the substrate also serves as a lower electrode, the intermediate layer has a single layer structure comprising a twin structure thin film.
Abstract:
A thin film multilayer body is disclosed that includes a single crystal substrate of silicon or gallium arsenide; an intermediate layer of magnesia spinel formed on the single crystal substrate by epitaxial growth; and a conductive layer of a platinum-group element formed on the intermediate layer by epitaxial growth. An oxide layer is to be epitaxially grown on the conductive layer, the oxide layer having a crystalline structure having a simple perovskite lattice.
Abstract:
A perovskite-containing composite material comprising a substrate, an intermediate layer of a first titanium-containing perovskite and a covering layer of a second perovskite, both the first and the second perovskites being quaternary or higher-substituted perovskites. This composite material exhibits a single-phase perovskite covering layer and, consequently, can very suitably be used for the manufacture of electronic components and modules comprising integrated passive components. A description is given of a method of manufacturing said composite material.
Abstract:
A thin film sensor element includes a sensor holding substrate having an opening part and a multilayer film adhered thereon at least consisting of an electrode film A, an electrode film B having (100) plane orientation, and a piezoelectic dielectric oxide film present between the electrode film A and the electrode film B. As a result, a thin film sensor element which is small, light, highly accurate, and inexpensive can be attained which can be used for an acceleration sensor element and a pyroelectric infrared sensor element. On the surface of a flat plate KBr substrate, a rock-salt crystal structure oxide of a conductive NiO is formed by a plasma MOCVD method whose vertical direction is crystal-oriented to direction against the substrate surface. By means of a sputtering method, a PZT film is formed by an epitaxial growth on that surface, and a Ni-Cr electrode film is formed thereon. Next, the multilayer film structure is reversed and adhered to a sensor substrate having an opening part with an adhesive. After a connection electrode is connected, the whole structure is washed with water, thereby removing the KBr substrate.
Abstract:
Efficient, simple, miniature and economical piezoelectric and ultrasonic devices employing optical fibers coated with lead-zirconate-titanate (PZT) thin piezoelectric and ferroelectric films are described. The PZT thin films are fabricated chemically by a sol-gel method. Optical fibers can be dipped into the PZT solution, and followed by an annealing and an electric poling process in order to achieve good piezoelectricity in the coated PZT films. This coating process can be devised as an on-line method and thus coating length can be larger than meters. Due to the long coating length, high piezoelectricity, miniature and flexible nature, devices using optical fibers may be used for medical, telecommunication and sensor applications.