公开(公告)号：US20080074853A1

公开(公告)日：2008-03-27

申请号：US11819021

申请日：2007-06-25

Applicant: Jin-seok Jang ,  Jae-mo Chung ,  Jin-hee Sung ,  So-bo Chung ,  Jeong-su Kim ,  Dong-ho Lee ,  Tae-soo Kim

Inventor： Jin-seok Jang ,  Jae-mo Chung ,  Jin-hee Sung ,  So-bo Chung ,  Jeong-su Kim ,  Dong-ho Lee ,  Tae-soo Kim

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009

Abstract: A flexible printed circuit board includes a first substrate portion having at least one first terminal, a second substrate portion in communication with the first substrate portion and having at least one circuit device, a connection substrate portion in communication with the second substrate portion, the connection substrate portion extending away from the second substrate portion in a same direction as the first substrate portion, and a third substrate portion in communication with the connection substrate portion, the third substrate portion having at least one second terminal.

Abstract translation: 柔性印刷电路板包括具有至少一个第一端子的第一衬底部分，与第一衬底部分连通并具有至少一个电路器件的第二衬底部分，与第二衬底部分连通的连接衬底部分， 基板部分沿与第一基板部分相同的方向从第二基板部分延伸，以及与连接基板部分连通的第三基板部分，第三基板部分具有至少一个第二端子。

公开(公告)号：US20070290965A1

公开(公告)日：2007-12-20

申请号：US11762813

申请日：2007-06-14

Applicant: Naoya Shiraishi

Inventor： Naoya Shiraishi

IPC: G09G3/36

CPC classification number: H05K3/242 ,  G02F1/133308 ,  G02F1/13452 ,  G02F2201/46 ,  H05K1/0393 ,  H05K1/147 ,  H05K3/005 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/167 ,  H05K2203/175

Abstract: The invention provides a miniaturized liquid crystal display device used in a mobile phone or the like which prevents the possibility of short-circuiting of lines of a flexible printed circuit board which supplies a power source or the like to a liquid crystal display device due to a phenomenon that a punch-out hole formed in the flexible printed circuit board at a plating terminal is brought into contact with a frame made of metal. Pins are formed on a holder on which a liquid crystal panel is mounted, and the pins of the holder are inserted into the punch-out hole formed in the flexible printed circuit board at the plating terminal and a pin hole formed in the frame. Lines made of metal are exposed on an inner side of the punch-out hole formed in the flexible printed circuit board at a plating terminal. Although there may exist the possibility that the lines are brought into contact with the pin of the holder, the holder is made of a resin and constitutes an insulator and hence, short-circuiting can be prevented. Further, a hole is formed in the frame, and the pins of the holder functions as a stopper and hence, there is no possibility that the punch-out hole formed in the flexible printed circuit board at the plating terminal is brought into contact with the frame made of metal. Accordingly, it is possible to prevent short-circuiting of lines of the flexible printed circuit board attributed to a phenomenon that the metal frame is brought into contact with the punch-out hole formed in the flexible printed circuit board at the plating terminal.

Abstract translation: 本发明提供了一种用于移动电话等的小型化液晶显示装置，其防止由于向液晶显示装置供应电源等的柔性印刷电路板的线路短路的可能性 在电镀端子处形成在柔性印刷电路板上的穿孔与金属框架接触的现象。 在安装有液晶面板的保持器上形成引脚，并且将保持器的销插入形成在电镀端子处的柔性印刷电路板中的冲孔中，以及在框架中形成的销孔。 金属制的线在电镀端子上露出在柔性印刷电路板上形成的冲孔的内侧。 虽然可能存在线与保持器的销接触的可能性，但是保持器由树脂制成并构成绝缘体，因此可以防止短路。 此外，在框架中形成孔，并且保持器的销用作止动件，因此，形成在电镀端子处的柔性印刷电路板中的冲孔不可能与 框架由金属制成。 因此，可以防止由于金属框架与在电镀端子处形成在柔性印刷电路板上的冲孔而接触的现象导致柔性印刷电路板的线路短路。

公开(公告)号：US20070278952A1

公开(公告)日：2007-12-06

申请号：US11755412

申请日：2007-05-30

Applicant: Si-Duk Sung ,  Byung-Sik Koh

Inventor： Si-Duk Sung ,  Byung-Sik Koh

IPC: H05B33/08 ,  H05B33/04

CPC classification number: H05B33/22 ,  H01L27/3276 ,  H05B33/10 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10128

Abstract: A display device includes an insulating substrate having an upper surface and a lower surface opposing the upper surface, a display element including a first electrode, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer, a first film connected to a first side of the upper surface, and a first circuit substrate connected to the first film and including a first surface facing the display element, a second surface opposing the first surface, and an electric element protruding from the second surface.

Abstract translation: 显示装置包括具有上表面和与上表面相对的下表面的绝缘基板，显示元件包括第一电极，第一电极上的有机发光层和有机发光层上的第二电极， 第一膜连接到上表面的第一侧，第一电路基板连接到第一膜并且包括面向显示元件的第一表面，与第一表面相对的第二表面和从第二表面突出的电元件。

公开(公告)号：US07304382B2

公开(公告)日：2007-12-04

申请号：US11436957

申请日：2006-05-18

Applicant: James Douglas Wehrly, Jr. ,  Ron Orris ,  Leland Szewerenko ,  Tim Roy ,  Julian Partridge ,  David L. Roper

Inventor： James Douglas Wehrly, Jr. ,  Ron Orris ,  Leland Szewerenko ,  Tim Roy ,  Julian Partridge ,  David L. Roper

IPC: H01L23/34

CPC classification number: H01L23/13 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/18 ,  H01L2224/49175 ,  H01L2924/15311 ,  H05K1/147 ,  H05K1/182 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/056 ,  H05K2201/091 ,  H05K2201/10515 ,  H05K2201/10689

Abstract: The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC package are configured to allow the lower surface of the body of the leaded IC package to contact the surface of the flex circuitry either directly or indirectly through an adhesive. A semiconductor die is connected to the reverse side of the flex circuit. In one embodiment, the semiconductor die is disposed on the reverse side of the flex while, in an alternative embodiment, the semiconductor die is disposed into a window in the flex circuit to rest directly or indirectly upon the body of the leaded IC package. Module contacts are provided in a variety of configurations. In a preferred embodiment, the leaded IC package is a flash memory and the semiconductor die is a controller.

公开(公告)号：US20070258217A1

公开(公告)日：2007-11-08

申请号：US11777925

申请日：2007-07-13

Applicant: David Roper ,  Douglas Wehrly ,  Mark Wolfe

Inventor： David Roper ,  Douglas Wehrly ,  Mark Wolfe

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L23/4093 ,  H01L23/5387 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2203/1572 ,  H01L2924/00

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

Abstract translation: 灵活的电路填充有沿一个或两个主要侧面布置的集成电路（IC）。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 配置有从中心轴线分叉以产生优选为“V”形结构的翼的刚性基底为围绕基底的边缘缠绕的填充柔性电路提供支撑结构。

公开(公告)号：US20070257349A1

公开(公告)日：2007-11-08

申请号：US11774846

申请日：2007-07-09

Applicant: James Wehrly ,  David Roper

Inventor： James Wehrly ,  David Roper

IPC: H01L23/02 ,  H01L23/52

CPC classification number: H05K1/147 ,  H01L23/49827 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3421 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: There is provided a stacked IC module including first and second leaded packages in stacked disposition, each of the first and second leaded packages having plural leads emergent along at least one side of each of the respective leaded packages, and a flexible circuit disposed in part between the first and second leaded packages, wherein the flexible is folded back on itself to create an arcuate connective field that is compressed to have conformity with the plural leads of the first and second leaded packages.

Abstract translation: 提供了一种堆叠IC模块，包括堆叠配置的第一和第二引线封装，每个第一和第二引线封装具有多个引线沿着每个相关引线封装的至少一侧出现，并且柔性电路部分地设置在 第一和第二引线封装，其中柔性件自身折回以产生被压缩以与第一和第二引线封装的多个引线一致的弓形连接场。

公开(公告)号：US20070211711A1

公开(公告)日：2007-09-13

申请号：US11715142

申请日：2007-03-07

Applicant: James E. Clayton

Inventor： James E. Clayton

IPC: H04L12/50

CPC classification number: H05K1/189 ,  G11C5/04 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/09745 ,  H05K2201/2018

Abstract: A thin multichip module comprises: a frame comprising a recessed cavity; a flexible circuit having a plurality of integrated circuit chips disposed thereon, the flexible circuit bonded to the frame over at least a portion of the cavity; and the chips enclosed within the cavity by the flexible circuit; and, electrodes on the module configured to be accessible to an external socket after the frame is inserted in the module.

Abstract translation: 薄多芯片模块包括：框架，包括凹腔; 柔性电路，其上设置有多个集成电路芯片，所述柔性电路在所述空腔的至少一部分上结合到所述框架; 并且通过柔性电路封装在腔内的芯片; 并且模块上的电极被配置为在将框架插入模块之后可由外部插座访问。

公开(公告)号：US20070170561A1

公开(公告)日：2007-07-26

申请号：US11330307

申请日：2006-01-11

Applicant: James Wehrly

Inventor： James Wehrly

IPC: H01L23/02

CPC classification number: H05K1/189 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/147 ,  H05K1/182 ,  H05K3/326 ,  H05K2201/056 ,  H05K2201/091 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The present invention provides an improvement on the use of flexible circuit connectors for electrically coupling IC devices to one another in a stacked configuration by use of the flexible circuit to provide the connection of the stacked IC module to other circuits. Use of the flexible circuit as the connection of the IC module allows the flexible circuit to provide strain relief and allows stacked IC modules to be assembled with a lower profile than with previous methods. The IC module can be connected to external circuits through the flexible circuit connectors by a variety of means, including solder pads, edge connector pads, and socket connectors. This allows for IC devices to occupy less space then with previous methods, which is beneficial in modules such as memory modules with multiple, stacked memory devices.

Abstract translation: 本发明提供了使用柔性电路连接器来改进使用柔性电路将叠层IC模块连接到其它电路的层叠结构中的IC器件彼此电连接的柔性电路连接器。 使用柔性电路作为IC模块的连接允许柔性电路提供应变消除，并允许堆叠的IC模块以比以前的方法更低的轮廓组装。 IC模块可以通过各种方式通过柔性电路连接器连接到外部电路，包括焊盘，边缘连接器焊盘和插座连接器。 这允许IC器件占用较少的空间，然后使用先前的方法，这在诸如具有多个堆叠的存储器件的存储器模块的模块中是有益的。

公开(公告)号：US20070158821A1

公开(公告)日：2007-07-12

申请号：US11482325

申请日：2006-07-07

Applicant: Leland Szewerenko ,  James Douglas Wehrly ,  David L. Roper

Inventor： Leland Szewerenko ,  James Douglas Wehrly ,  David L. Roper

IPC: H01L23/12

CPC classification number: H05K3/326 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/147 ,  H05K1/182 ,  H05K1/189 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/091 ,  H05K2201/09463 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry. The leaded packaged IC is disposed along one side of a flex circuit. The semiconductor die is disposed along the flex circuitry and preferably is between at least a part of the flex circuitry and the body of the leaded packaged IC. Preferably, the die is attached to a conductive layer of the flex circuitry. The flex circuitry preferably employs at least two conductive layers and the leaded packaged IC and die are preferably connected to one of the conductive layers of the flex circuitry. In preferred modules, the leaded packaged IC is preferably a flash memory device and the semiconductor die is preferably a controller.

Abstract translation: 本发明提供一种使用柔性电路组合引线封装IC和半导体管芯的系统和方法。 引线封装IC沿柔性电路的一侧设置。 半导体管芯沿着柔性电路布置，并且优选地位于柔性电路的至少一部分和引线封装IC的主体之间。 优选地，管芯附接到柔性电路的导电层。 柔性电路优选地采用至少两个导电层，并且有铅封装的IC和管芯优选地连接到柔性电路的导电层中的一个。 在优选的模块中，有铅封装的IC优选地是闪存器件，并且半导体管芯优选地是控制器。

公开(公告)号：US20070115017A1

公开(公告)日：2007-05-24

申请号：US11624608

申请日：2007-01-18

Applicant: Paul Goodwin ,  James Cady ,  Douglas Wehrly

Inventor： Paul Goodwin ,  James Cady ,  Douglas Wehrly

IPC: G01R31/02

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

Abstract translation: 柔性电路具有用于安装在插座或卡缘连接器中的触点。 柔性电路包括安装在边缘连接器触头两侧的集成电路器件。 优选地，柔性电路围绕刚性基板的边缘缠绕，并且在基板的两侧上提供用于安装在插座中的触点。 可以用相同的策略覆盖多个柔性电路。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。