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公开(公告)号：US20240278533A1
公开(公告)日：2024-08-22
申请号：US18653598
申请日：2024-05-02
申请人： Apple Inc.
发明人： Xiaowei Wu , Farzad Khademolhosseini , Digvijay Raorane , Chyi-Huey J Yeh , Yuxi Zhao , Terry C Lam , Bhadrinarayana Lalgudi Visweswaran , Supriya Goyal , Yasmin F Afsar , Paul S Drzaic , Wei Lv , Wenyong Zhu , Sijun Niu , Masoud Ghorbani Moghaddam
IPC分类号： B32B7/025 , B32B3/26 , B32B5/02 , B32B7/023 , B32B7/12 , B32B9/00 , B32B9/04 , B32B27/08 , B32B27/36 , C09J7/25 , C09J9/00 , H01L25/075 , H10K59/80
CPC分类号： B32B7/025 , B32B3/263 , B32B5/028 , B32B7/023 , B32B7/12 , B32B9/005 , B32B9/047 , B32B27/08 , B32B27/36 , C09J7/255 , C09J9/00 , B32B2255/10 , B32B2260/021 , B32B2260/046 , B32B2307/204 , B32B2307/4026 , B32B2307/418 , B32B2307/7376 , B32B2457/20 , C09J2301/208 , C09J2301/21 , C09J2301/312 , C09J2467/006 , H01L25/0753 , H10K59/871
摘要： In devices with flexible displays, multilayer adhesive stacks may be included. A multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. Including multiple layers of adhesive in the adhesive stack (as opposed to a single layer) provides more degrees of freedom for the tuning and optimization of the properties of the adhesive stack. The multilayer adhesive stack therefore has better performance than if only a single layer of adhesive is used. The multilayer adhesive stack may include one or more layers of soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass to optimize the mechanical and optical performance of the multilayer adhesive stack. Soft adhesive layers may be included to optimize lateral decoupling (e.g., during folding and unfolding) of the adhesive stack. Harder layers may be included to provide rigidity and prevent denting during impact events.
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公开(公告)号：US12068435B2
公开(公告)日：2024-08-20
申请号：US17404380
申请日：2021-08-17
发明人： Dong Hee Shin , Sun Kwun Son , Na Hyeon Cha
IPC分类号： H01L33/38 , H01L25/075 , H01L27/15 , H01L33/00
CPC分类号： H01L33/382 , H01L25/0753 , H01L27/156 , H01L33/005 , H01L2933/0016
摘要： A display device comprises a planarization layer disposed on a substrate, a first alignment electrode and a second alignment electrode that extend in a first direction and are spaced apart from each other on the planarization layer, a first insulating layer disposed on the first alignment electrode and the second alignment electrode and comprising a first opening exposing the planarization layer between the first alignment electrode and the second alignment electrode, a light-emitting element disposed on the planarization layer overlapping the first opening, a first contact electrode and a second contact electrode disposed on the first insulating layer, the first contact electrode electrically contacting a first end of the light-emitting element and the second contact electrode electrically contacting a second end of the light-emitting element, and a second insulating layer disposed on the light-emitting element.
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公开(公告)号：US12068430B2
公开(公告)日：2024-08-20
申请号：US17234173
申请日：2021-04-19
发明人： Evgeniy Bart , Yunda Wang , Matthew Shreve
IPC分类号： H01L33/00 , H01L21/683 , H01L25/075 , H01L33/62
CPC分类号： H01L33/0095 , H01L21/6835 , H01L25/0753 , H01L33/62 , H01L2221/68354 , H01L2221/68368 , H01L2933/0066
摘要： A method utilizes a target substrate has an array of chips on a carrier with a plurality of vacancies and a plurality of donor coupons are incompletely filled with functional chips. A bounding box is defined that encompasses the vacancies on the target substrate. Outcomes are simulated by overlapping a representation of the bounding box over a representation of each of a plurality of donor coupons at a plurality of translational offsets on a substrate plane to determine matches. An optimal one of the outcomes is found at a selected one or more of the donor coupons corresponding one or more offsets. A parallel transfer of the matching functional chips fills the vacancies on the target substrate using the one or more selected donor coupons and corresponding one or more offsets.
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公开(公告)号：US12068294B2
公开(公告)日：2024-08-20
申请号：US18479129
申请日：2023-10-02
发明人： Yun-Li Li
IPC分类号： H01L29/205 , H01L25/075 , H01L25/16 , H01L33/00 , H01L33/60
CPC分类号： H01L25/0753 , H01L25/167 , H01L33/60
摘要： A manufacturing method of a micro light emitting diode structure includes: providing a first transfer stamp carrying a plurality of micro light emitting elements; providing a second transfer stamp carrying a plurality of light blocking structures, wherein each of the light blocking structures includes a light blocking layer and a light shielding layer disposed on the light blocking layer; providing a temporary substrate; transferring the micro light emitting elements onto the temporary substrate by the first transfer stamp; and transferring the light blocking structures onto the temporary substrate by the second transfer stamp. The micro light emitting elements and the light blocking structures are arranged alternately and fixed to the temporary substrate by connection layer. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer.
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公开(公告)号：US12068292B2
公开(公告)日：2024-08-20
申请号：US17495210
申请日：2021-10-06
发明人： Yen-Yeh Chen , Chih-Ling Wu
IPC分类号： H01L25/075 , H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/50 , H01L33/58 , H01L33/62
摘要： An LED micro display device includes a circuit substrate, micro light-emitting elements, an insulating layer, and a common electrode layer. The circuit substrate has conductive patterns. The micro light-emitting elements are bonded to the circuit substrate and disposed corresponding to the conductive patterns. Each micro light-emitting element has a bottom surface, a top surface and a side wall. The bottom surface connects to the corresponding conductive pattern. The side wall has a first sidewall portion adjacent to the circuit substrate and a second sidewall portion connected to the first sidewall portion. The insulating layer is disposed on the circuit substrate, covers first sidewall portions, and exposes second sidewall portions. The common electrode layer covers the insulating layer and second sidewall portions. The common electrode layer is electrically connected to the micro light-emitting elements, contacts the second sidewall portions, and exposes the top surfaces.
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公开(公告)号：US12068264B2
公开(公告)日：2024-08-20
申请号：US17446518
申请日：2021-08-31
发明人： Yingteng Zhai
IPC分类号： H01L23/60 , H01L25/075 , H01L27/12 , H01L33/58 , H01L33/62
CPC分类号： H01L23/60 , H01L25/0753 , H01L27/1214 , H01L33/58 , H01L33/62
摘要： A display panel includes a first substrate, a second substrate, a light emitting element, and a first conductor. The second substrate is arranged opposite to the first substrate. The light emitting element is located on a side of the first substrate facing towards the second substrate. The first conductor is located on a side of the first substrate facing towards the second substrate.
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公开(公告)号：US12067185B2
公开(公告)日：2024-08-20
申请号：US18149380
申请日：2023-01-03
申请人： InnoLux Corporation
发明人： Kuan-Feng Lee , Yuan-Lin Wu , Yu-Hsien Wu
IPC分类号： G06F3/041 , G06F3/044 , H01L25/075 , H05K1/18 , H10K59/40
CPC分类号： G06F3/0416 , G06F3/0412 , G06F3/044 , H01L25/075 , H05K1/189 , H10K59/40
摘要： A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.
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公开(公告)号：US20240274775A1
公开(公告)日：2024-08-15
申请号：US18648939
申请日：2024-04-29
发明人： Wengang SU , Wei HAO , Haiwei SUN , Lingyun SHI , Feifei WANG , Rui SHI
IPC分类号： H01L33/62 , H01L23/48 , H01L25/075 , H01L33/60
CPC分类号： H01L33/62 , H01L23/48 , H01L25/0753 , H01L33/60
摘要： A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line includes a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion includes a plurality of connection sub-portions, each of the connection sub-portions includes at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.
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公开(公告)号：US20240274764A1
公开(公告)日：2024-08-15
申请号：US18633496
申请日：2024-04-11
发明人： Jih-Kang CHEN , Shiou-Yi KUO
IPC分类号： H01L33/54 , H01L25/075 , H01L25/16 , H01L33/00
CPC分类号： H01L33/54 , H01L25/0753 , H01L25/167 , H01L33/0093 , H01L33/0095 , H01L2933/005
摘要： A light-emitting element includes light-emitting diode (LED) chip with a first and second surface opposite to each other, and sidewalls connecting the first and second surface. The light-emitting element further includes an insulation structure covering the first surface, the second surface, and the sidewalls. The light-emitting element further includes multiple connection pads disposed on the first surface. In a cross-sectional view, the insulation layer includes a plurality of protrusion portions disposed on the sidewalls. Each of the protrusion portions protrudes from the sidewalls and extends laterally with a protrusion length. The protrusion length of one of the plurality of protrusion portions is different from that of another one of the plurality of protrusion portions.
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公开(公告)号：US20240274752A1
公开(公告)日：2024-08-15
申请号：US18616855
申请日：2024-03-26
申请人： Japan Display Inc.
发明人： Hayata AOKI , Masumi NISHIMURA , Hiroumi KINJO
IPC分类号： H01L33/32 , H01L25/075 , H01L33/10 , H01L33/16
CPC分类号： H01L33/32 , H01L25/0753 , H01L33/10 , H01L33/16
摘要： A light emitting device includes a plurality of pixels arranged in a matrix in a first direction and in a second direction orthogonal to the first direction. Each of the plurality of pixels includes an amorphous substrate, a semi-transparent reflective layer over the amorphous substrate, a first insulating alignment layer over the semi-transparent reflective layer, a first semiconductor layer over the first insulating alignment layer, a light emitting layer over the first semiconductor layer, a second semiconductor layer over the light emitting layer, and an electrode layer over the second semiconductor layer. Each of the first semiconductor layer, the light emitting layer, and the second semiconductor layer includes gallium nitride.
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