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1.发明申请Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods 审中-公开用于半导体组装的粘合膜组合物，粘合剂膜，切割芯片接合膜，器件封装以及相关方法公开(公告)号：US20090162650A1
公开(公告)日：2009-06-25
申请号：US12314973
申请日：2008-12-19
申请人： Yong Woo Hong , Wan Jung Kim , Su Mi Im , Ah Ram Pyun , Chul Jeong , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Wan Jung Kim , Su Mi Im , Ah Ram Pyun , Chul Jeong , Sang Jin Kim , Chang Beom Chung
CPC分类号： H01L21/6836 , C08K5/50 , C08K5/5419 , C09D163/00 , C09J7/38 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2463/00 , H01L21/6835 , H01L24/28 , H01L24/45 , H01L2221/68327 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , Y10T428/2848 , Y10T428/31515 , Y10T428/31522 , C08L2666/28 , H01L2924/3512 , H01L2924/00 , H01L2224/48
摘要： An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
摘要翻译： 用于半导体组件的粘合膜组合物包括弹性体树脂，环氧树脂，酚类固化树脂和倍半硅氧烷低聚物。 倍半硅氧烷低聚物可以以约0.01至约3重量％的量存在。 ％，基于组合物的总固体含量。
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2.发明申请Adhesive film composition, associated dicing die bonding film, and die package 有权粘合膜组成，相关切割模片接合薄膜和模具包装公开(公告)号：US20080145668A1
公开(公告)日：2008-06-19
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译： 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。
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3.发明授权Adhesive film composition, associated dicing die bonding film, and die package 有权粘合膜组成，相关切割模片接合薄膜和模具包装公开(公告)号：US07863758B2
公开(公告)日：2011-01-04
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
IPC分类号： H01L23/488 , B32B27/36 , B32B27/38 , C08L63/00 , C08L67/02
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译： 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。
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4.发明授权Adhesive film composition, associated dicing die bonding film, die package, and associated methods 有权粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法公开(公告)号：US08211540B2
公开(公告)日：2012-07-03
申请号：US12285568
申请日：2008-10-08
申请人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
CPC分类号： H01L24/29 , C08L21/00 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/06 , C08L2666/22 , C09J7/38 , C09J161/06 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/45124 , H01L2224/45144 , H01L2224/83191 , H01L2224/8385 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T156/10 , Y10T428/2848 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2224/48
摘要： An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.
摘要翻译： 粘合膜组合物包括具有羟基，羧基或环氧基中的一个或多个的弹性体树脂，成膜树脂，甲硅烷基化的酚固化树脂，环氧树脂，固化促进剂和填料。
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5.发明申请Adhesive film composition, associated dicing die bonding film, die package, and associated methods 有权粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法公开(公告)号：US20090110940A1
公开(公告)日：2009-04-30
申请号：US12285568
申请日：2008-10-08
申请人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
CPC分类号： H01L24/29 , C08L21/00 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/06 , C08L2666/22 , C09J7/38 , C09J161/06 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/45124 , H01L2224/45144 , H01L2224/83191 , H01L2224/8385 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T156/10 , Y10T428/2848 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2224/48
摘要： An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler
摘要翻译： 粘合膜组合物包括具有羟基，羧基或环氧基中的一个或多个的弹性体树脂，成膜树脂，甲硅烷基化的酚固化树脂，环氧树脂，固化促进剂和填料
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6.发明申请Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same 有权用于半导体组装的粘合膜组合物，与其结合的膜以及包含该膜的组合物公开(公告)号：US20080102284A1
公开(公告)日：2008-05-01
申请号：US11826908
申请日：2007-07-19
申请人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
发明人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
CPC分类号： B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
摘要： A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
摘要翻译： 用于半导体组装的芯片接合膜组合物可以包括含有羟基，羧基或环氧基的弹性体树脂。 芯片接合膜组合物还可以包括玻璃化转变温度（Tg）在约0至200℃范围内的成膜树脂，环氧树脂，酚醛树脂，固化剂，硅烷偶联剂和 填料。
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7.发明授权Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same 有权用于半导体组装的粘合膜组合物，与其结合的膜以及包含该膜的组合物公开(公告)号：US08394493B2
公开(公告)日：2013-03-12
申请号：US11826908
申请日：2007-07-19
申请人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
发明人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
CPC分类号： B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
摘要： A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
摘要翻译： 用于半导体组装的芯片接合膜组合物可以包括含有羟基，羧基或环氧基的弹性体树脂。 芯片接合膜组合物还可以包括玻璃化转变温度（Tg）在约0至200℃范围内的成膜树脂，环氧树脂，酚醛树脂，固化剂，硅烷偶联剂和 填料。
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