摘要:
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要:
Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要:
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要:
Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要:
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要:
Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要:
Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
摘要:
An antenna device of a mobile terminal having improved performance by utilizing a metal object located in proximity to the antenna device as an antenna radiator is provided. The antenna device includes an antenna pattern connected to a feeder and a ground line, and a metal component positioned on the antenna pattern and including a metal that forms an antenna radiator.
摘要:
Provided are a method and system for determining a precise orbit of a LEO satellite. The method includes: estimating a precise ephemeris of a global positioning system (GPS) satellite by fitting an orbit perturbation-based GPS dynamics model to observation data of the GPS satellite received from a GPS observatory and estimating a precise ephemeris of a Galileo satellite by fitting an orbit perturbation-based Galileo dynamics model to observation data of the Galileo satellite received from a Galileo observatory; determining an initial orbit value of a LEO satellite by fitting an orbit perturbation-based LEO satellite's basic dynamics model to navigation data received from the LEO satellite; and determining the precise orbit of the LEO satellite by calculating a difference between observation values, which are calculated based on a GPS and Galileo data received from the LEO satellite, the GPS observatory and the Galileo observatory, and calculated values, which are calculated based on an orbit perturbation-based LEO satellite's dynamics model that was calculated using the initial orbit value of the LEO satellite and the precise ephemeris of the GPS and Galileo satellites. Since both the GPS and Galileo data are received and used to determine the precise orbit of a LEO satellite, more precise orbit determination can be achieved.
摘要:
An antenna device of a mobile terminal having improved performance by utilizing a metal object located in proximity to the antenna device as an antenna radiator is provided. The antenna device includes an antenna pattern connected to a feeder and a ground line, and a metal component positioned on the antenna pattern and including a metal that forms an antenna radiator.