公开(公告)号：US08772946B2

公开(公告)日：2014-07-08

申请号：US13492064

申请日：2012-06-08

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.

摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。

公开(公告)号：US20130328186A1

公开(公告)日：2013-12-12

申请号：US13492064

申请日：2012-06-08

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/48 ,  H01L21/28 ,  H01L23/498

CPC分类号： H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.

摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。

公开(公告)号：US08785790B2

公开(公告)日：2014-07-22

申请号：US13293698

申请日：2011-11-10

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Hiroaki Sato ,  Philip Damberg

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Hiroaki Sato ,  Philip Damberg

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K1/115 ,  H01L23/14 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K2201/0141 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2203/025 ,  H05K2203/1105 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.

摘要翻译： 组件包括具有第一和第二间隔开并平行表面的支撑结构以及沿第一和第二表面之间的方向延伸的多个导电元件。 每个导电元件包含选自铜，铝，镍和铬的布线金属的合金和选自由镓，锗，铟，硒，锡，硫，银，磷和 铋。 该合金具有随导电元件的至少一个方向上的距离而变化的组成。 添加剂的浓度小于或等于导电元件的总原子质量的5％，并且导电元件的电阻率在2.5至30微欧姆厘米之间。

公开(公告)号：US08916781B2

公开(公告)日：2014-12-23

申请号：US13296785

申请日：2011-11-15

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K1/00 ,  H01L23/498 ,  H01R12/71 ,  H05K3/42

CPC分类号： H05K1/0271 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  H05K1/114 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10378 ,  H05K2203/0242 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

摘要： An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.

摘要翻译： 互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。 该元件由热膨胀系数小于10ppm /℃的材料构成。 至少一些导体沿开口的至少一个内表面延伸。 导体在第一表面限定多个可润湿的第一接触。 第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。

公开(公告)号：US20130118784A1

公开(公告)日：2013-05-16

申请号：US13293698

申请日：2011-11-10

申请人： Cyprian Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Philip Damberg

发明人： Cyprian Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Philip Damberg

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H05K1/115 ,  H01L23/14 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K2201/0141 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2203/025 ,  H05K2203/1105 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.

公开(公告)号：US09125333B2

公开(公告)日：2015-09-01

申请号：US13183870

申请日：2011-07-15

申请人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/40

CPC分类号： H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

摘要翻译： 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US08937361B2

公开(公告)日：2015-01-20

申请号：US13114243

申请日：2011-05-24

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L27/146

CPC分类号： H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US08652935B2

公开(公告)日：2014-02-18

申请号：US12970529

申请日：2010-12-16

申请人： Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

发明人： Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

IPC分类号： H01L21/30

CPC分类号： H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second substrates having a coefficient of thermal expansion less than 10 parts per million/° C., at least one of the confronting surfaces having a plurality of channels extending from an edge of such surface, such that the dielectric material between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material flows into at least some of the channels.

摘要翻译： 接合第一和第二微电子元件的方法包括将含有有源电路元件的第一衬底与第二衬底压在一起，在相应衬底的相对表面之间具有可流动介电材料，第一和第二衬底中的每一个具有热系数 膨胀小于10ppm /℃，至少一个相对表面具有从该表面的边缘延伸的多个通道，使得由相对表面限定的平面之间的电介质材料至少基本上不含 空隙并且具有超过一微米的厚度，并且至少一些介电材料流入至少一些通道。

公开(公告)号：US08610259B2

公开(公告)日：2013-12-17

申请号：US12884695

申请日：2010-09-17

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/6622 ,  H01L2224/05009 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element.

摘要翻译： 微电子单元包括基本上由半导体材料组成的半导体元件，其具有前表面，后表面，与前表面相邻的多个有源半导体器件，在前表面暴露的多个导电焊盘，以及延伸穿过 半导体元件。 至少一个导电焊盘可以至少部分地覆盖开口并且可以与至少一个有源半导体器件电连接。 微电子单元还可以包括暴露在后表面处以与外部部件连接的第一导电元件，第一导电元件延伸穿过开口并与至少一个导电焊盘电连接，第二导电元件延伸穿过开口 并与第一导电元件绝缘。 至少一个导电焊盘可以覆盖在第二导电元件的周边边缘上。

公开(公告)号：US08512491B2

公开(公告)日：2013-08-20

申请号：US12974611

申请日：2010-12-21

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： B32B41/00

CPC分类号： H01L22/12 ,  H01L21/67092

摘要： A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.

摘要翻译： 接合第一基板和第二基板的方法包括以下步骤：使第一基板与其上的粘合剂质量物质旋转，第二基板接触物料并覆盖第一基板，控制加热的控制台板的垂直高度， 使所述第二基板接触以控制所述粘合剂物料的温度，以便使所述第一和第二基板彼此对准的至少一个接合，或在所述第一和第二基板之间实现足够平坦的粘合界面。