公开(公告)号：US08525312B2

公开(公告)日：2013-09-03

申请号：US13208822

申请日：2011-08-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

发明人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.

摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。

公开(公告)号：US20130037925A1

公开(公告)日：2013-02-14

申请号：US13208822

申请日：2011-08-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

发明人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.

摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。

公开(公告)号：US08963310B2

公开(公告)日：2015-02-24

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。

公开(公告)号：US20130049179A1

公开(公告)日：2013-02-28

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

公开(公告)号：US5463529A

公开(公告)日：1995-10-31

申请号：US317968

申请日：1994-10-04

申请人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

发明人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

IPC分类号： F02F7/00 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

CPC分类号： H01L23/40 ,  F02F7/00 ,  H01L23/3675 ,  H01L2924/0002 ,  Y10T29/4913

摘要： A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.

摘要翻译： 提供了由散热器单元和散热器组成的可拆卸的散热器组件。 散热器单元具有至少一个翅片和用于从封装的电子设备辐射热量的联接套环。 散热器包括附接到与封装的电子设备热接触的内部套环的平台。 该平台具有一个或多个适合于与位于散热器单元的联接环上的一个或多个凸缘相配合的凸片。 当凸缘与散热片接头配合并且散热片转动时，凸缘内的耦合凹槽接合散热器的平台。 因此，散热器可以快速方便地附接到散热器或从散热器移除。 因此，本发明允许各种不同的散热器与附接到电子设备封装的单个散热器可互换地使用。

公开(公告)号：US06963138B2

公开(公告)日：2005-11-08

申请号：US10357142

申请日：2003-02-03

申请人： Qwai H. Low ,  Chok J. Chia ,  Ramaswamy Ranganathan ,  Tauman T. Lau

发明人： Qwai H. Low ,  Chok J. Chia ,  Ramaswamy Ranganathan ,  Tauman T. Lau

IPC分类号： H01L23/485 ,  H01L23/532 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L23/53295 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00

摘要： An integrated circuit with a pressure resistant current carrying structure having electrically conductive layers for carrying current. A first electrically nonconductive material at least partially surrounds the electrically conductive layers, and provides electrical insulation between the electrically conductive layers. The first electrically nonconductive material has a first degree of fragility and a first dielectric constant. A second electrically nonconductive material is disposed in a pattern within the first electrically nonconductive material and between the electrically conductive layers, and provides structural support for the first electrically nonconductive material between the electrically conductive layers. The second electrically nonconductive material has a second degree of fragility that is less than the first degree of fragility and a second dielectric constant that is greater than the first dielectric constant.

摘要翻译： 一种具有耐压载流结构的集成电路，其具有用于承载电流的导电层。 第一非导电材料至少部分地围绕导电层，并且在导电层之间提供电绝缘。 第一非导电材料具有第一程度的脆性和第一介电常数。 第二非导电材料以第一非导电材料内部和导电层之间的图案设置，并为导电层之间的第一非导电材料提供结构支撑。 第二非导电材料具有小于第一脆性程度的第二脆性程度和大于第一介电常数的第二介电常数。

公开(公告)号：US6040632A

公开(公告)日：2000-03-21

申请号：US6784

申请日：1998-01-14

申请人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi Lim

发明人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi Lim

IPC分类号： H01L23/485 ,  H01L27/10

CPC分类号： H01L24/02 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043

摘要： A multiple-sized integrated circuit (IC) die and a method of making a multiple-sized IC die includes forming a plurality of IC dies on a semiconductor wafer. Each IC die has multiple rows of bonding pads around its periphery. Adjacent bonding pads on separate rows of each IC die are electrically connected together so that attachment to any one of the connected bond pads yields the same result. A plurality of scribe streets separate each IC die on the wafer, with the scribe street defining the width between each IC die. Rows of bonding pads reside in the scribe street area. Different rows of bonding pads may be selectively removed from the IC die by scribing the wafer so as to include one or more of the rows of bonding pads, thereby allowing one IC die design to have multiple sizes. An IC die separated from the wafer may still be sized smaller as long as there remain at least two rows of bonding pads around the periphery.

摘要翻译： 多尺寸集成电路（IC）管芯和制造多尺寸IC管芯的方法包括在半导体晶片上形成多个IC管芯。 每个IC芯片周围都有多排接合焊盘。 每个IC管芯的独立行上的相邻接合焊盘电连接在一起，使得连接到任何一个连接的接合焊盘产生相同的结果。 多个划线区将晶片上的每个IC芯片分开，划线条限定每个IC芯片之间的宽度。 焊盘行位于划痕街区域。 可以通过划片晶片来选择性地从IC芯片去除不同行的焊盘，以便包括一行或多行接合焊盘，从而允许一个IC管芯设计具有多个尺寸。 只要在周围保持至少两排接合焊盘，则与晶片分离的IC裸片仍可具有更小的尺寸。

公开(公告)号：US5568683A

公开(公告)日：1996-10-29

申请号：US472320

申请日：1995-06-07

申请人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

发明人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

IPC分类号： F02F7/00 ,  H01L23/367 ,  H01L23/40 ,  H05K3/30

CPC分类号： H01L23/40 ,  F02F7/00 ,  H01L23/3675 ,  H01L2924/0002 ,  Y10T29/4913

摘要： A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.

摘要翻译： 提供了由散热器单元和散热器组成的可拆卸的散热器组件。 散热器单元具有至少一个翅片和用于从封装的电子设备辐射热量的联接套环。 散热器包括附接到与封装的电子设备热接触的内部套环的平台。 该平台具有一个或多个适合于与位于散热器单元的联接环上的一个或多个凸缘相配合的凸片。 当凸缘与散热片接头配合并且散热片转动时，凸缘内的耦合凹槽接合散热器的平台。 因此，散热器可以快速方便地附接到散热器或从散热器移除。 因此，本发明允许各种不同的散热器与附接到电子设备封装的单个散热器可互换地使用。

公开(公告)号：US06603200B1

公开(公告)日：2003-08-05

申请号：US08928826

申请日：1997-09-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi (Allen) Lim

发明人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi (Allen) Lim

IPC分类号： H01L23053

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package includes a connector board and plural levels of individual conductors and conductive vias disposed through the connector board to form electrical connections between external connection pads on an undersurface of the connector board and finger connections on the upper surface of the connector board. An integrated circuit die is mounted in a central region of the connector board within confines of the individual conductors that are arranged about the die, and wire bond connections are formed between selected ones of the finger connections, the individual conductors, and the connection pads on the integrated circuit die to provide distributed connections for ground and power at one or more operating voltage levels on the individual conductors.

摘要翻译： 集成电路封装包括连接器板和多层单独的导体以及通过连接器板设置的导电通路，以在连接器板的下表面上的外部连接焊盘和连接器板的上表面上的指状连接之间形成电连接。 集成电路管芯安装在连接器板的中心区域，在围绕管芯布置的各个导体的限制范围内，并且引线接合连接形成在指状连接，各个导体和连接焊盘上的选定的导体之间 集成电路管芯，以在单个导体上的一个或多个工作电压电平上提供用于接地和电力的分布式连接。

公开(公告)号：US5973393A

公开(公告)日：1999-10-26

申请号：US771636

申请日：1996-12-20

申请人： Chok J. Chia ,  Seng-Sooi Lim ,  Qwai H. Low

发明人： Chok J. Chia ,  Seng-Sooi Lim ,  Qwai H. Low

IPC分类号： H01L23/29 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K3/34 ,  H01L23/02 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436

摘要： An apparatus and method for packaging an integrated circuit having a semiconductor die with electronic circuitry disposed thereon includes lead frames for mounting thereon solder balls of a ball grid array packaging structure. In one embodiment, the semiconductor die is coupled to conductors of the lead frame via gold wires attached to both the semiconductor die and the lead frame. The lead frame is encapsulated in plastic with apertures disposed therein for exposing upper and lower portions of conductors of the lead frame. The apertures are filled with solder balls to contact both the upper and lower portions of the lead frame conductors. Solder balls on the top of one integrated circuit package may be connected to mating solder balls on the bottom of another integrated circuit package, and so on, thereby achieving multiple stacking of integrated circuit packages.

摘要翻译： 一种用于封装具有设置在其上的电子电路的半导体管芯的集成电路的装置和方法，包括用于安装在球栅阵列封装结构上的焊球的引线框架。 在一个实施例中，半导体管芯经由连接到半导体管芯和引线框架两者的金线耦合到引线框架的导体。 引线框架封装在塑料中，其中设置有孔，用于暴露引线框架的导体的上部和下部。 孔被填充有焊球以接触引线框架导体的上部和下部。 一个集成电路封装顶部的焊球可以连接到另一个集成电路封装的底部上的匹配焊球等，从而实现集成电路封装的多个堆叠。