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1.发明授权公开(公告)号：US08674494B2
公开(公告)日：2014-03-18
申请号：US13564309
申请日：2012-08-01
申请人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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2.发明授权公开(公告)号：US09412720B2
公开(公告)日：2016-08-09
申请号：US14184951
申请日：2014-02-20
申请人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L25/065 , H01L25/00 , H01L23/31 , H01L23/00 , H01L25/18
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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公开(公告)号：US20100007007A1
公开(公告)日：2010-01-14
申请号：US12496819
申请日：2009-07-02
申请人： Sung-hwan YOON , Jai-kyeong Shin , Yong-nam Koh , Hyoung-suk Kim , In-ku Kang , Ho-jin Lee , Sang-wook Park , Joong-kyo Kook , Min-young Son , Soong-yong Hur
发明人： Sung-hwan YOON , Jai-kyeong Shin , Yong-nam Koh , Hyoung-suk Kim , In-ku Kang , Ho-jin Lee , Sang-wook Park , Joong-kyo Kook , Min-young Son , Soong-yong Hur
IPC分类号： H01L23/498 , H01L23/29
CPC分类号： H01L23/295 , H01L23/3171 , H01L23/564 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions.
摘要翻译： 半导体封装包括：具有第一表面的半导体芯片和与第一表面相对并允许在其上形成半导体器件的第二表面; 配置在半导体芯片的第二表面上的接合焊盘; 以及设置在半导体芯片的第一表面上的金属离子阻挡层，并且防止金属离子通过半导体芯片的第一表面渗入半导体芯片。 因此，半导体封装可以通过最小化吸湿和有效地阻挡金属离子的穿透而获得优良的半导体器件。
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4.发明申请Escherichia Strain Capable of Converting Xmp to Gmp and Maintaining the Inactivated State of Gene(s) Associated with Gmp Degradation and Methods of Using the Same 有权能够将Xmp转化为Gmp并维持与Gmp降解有关的基因失活状态的大肠杆菌菌株及其使用方法公开(公告)号：US20080299620A1
公开(公告)日：2008-12-04
申请号：US11814417
申请日：2006-01-20
申请人： Young-hoon Park , Hyoung-suk Kim , Jin-nam Lee , Ki-hoon Oh , Jeong-hwan Kim , Yoon-suk Oh , Jae-ick Sim , Kyung-oh Choi
发明人： Young-hoon Park , Hyoung-suk Kim , Jin-nam Lee , Ki-hoon Oh , Jeong-hwan Kim , Yoon-suk Oh , Jae-ick Sim , Kyung-oh Choi
CPC分类号： C12N9/16 , C12N9/1077 , C12P19/32 , C12R1/19
摘要： Provided are mutant strains derived from Escherichia sp. GPU1114 (Accession No. KCCM-10536), having cumulative inactivation of deoD, aphA, appA, and hprt genes, and methods of using the same.
摘要翻译： 提供源自大肠杆菌属的突变菌株。 具有deoD，aphA，appA和hprt基因的累积失活的GPU1114（登录号KCCM-10536）及其使用方法。
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5.发明授权Alkaline, protease VapK suitable for laundry detergent, VapK gene, recombinant expression vector, and transformed microorganisms 有权碱性，蛋白酶VapK适用于洗衣粉，VapK基因，重组表达载体和转化的微生物公开(公告)号：US06955907B1
公开(公告)日：2005-10-18
申请号：US09958338
申请日：2000-01-14
申请人： Ghee Hong Jin , Hyoung Suk Kim , Hyune Mo Rho , Hyune Whan Lee
发明人： Ghee Hong Jin , Hyoung Suk Kim , Hyune Mo Rho , Hyune Whan Lee
IPC分类号： C12N15/09 , C11D3/386 , C12N1/21 , C12N9/52 , C12N15/31 , C12N15/52 , C12N15/57 , C12R1/63 , G01N33/00 , C12P21/06 , C12N1/20 , C12N9/00 , C12N15/00
CPC分类号： C12N9/52
摘要： A novel alkaline protease VapK suitable for a laundry detergent is disclosed. The gene vapk coding for the protease VapK, the recombinant plasmids containing said gene, and the transformed V. metshnikovii KS1 (pSBCm) with said recombinant plasmid are also disclosed. In addition, a process for producing the protease VapK is disclosed.
摘要翻译： 公开了一种适用于衣物洗涤剂的新型碱性蛋白酶VapK。 还公开了用所述重组质粒编码蛋白酶VapK的基因vapk，含有所述基因的重组质粒和转化的含有所述重组质粒的美沙氏杆菌KS1（pSBCm）。 此外，公开了一种生产蛋白酶VapK的方法。
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公开(公告)号：US08669078B2
公开(公告)日：2014-03-11
申请号：US12097104
申请日：2006-12-14
申请人： Jae-Gu Pan , Heung-Chae Jung , Eui-Joong Kim , Han-Seung Lee , Young Hoon Park , Hyoung Suk Kim , Jong-Kwon Han , Jin Nam Lee , Ki-Hoon Oh , Jeong Hwan Kim , Yoon-Suk Oh , Jae Ick Sim , Kuk-Ki Hong , Kyung Oh Choi , Hyun Soo Kim , Min-Ji Baek , Tae Sun Kang
发明人： Jae-Gu Pan , Heung-Chae Jung , Eui-Joong Kim , Han-Seung Lee , Young Hoon Park , Hyoung Suk Kim , Jong-Kwon Han , Jin Nam Lee , Ki-Hoon Oh , Jeong Hwan Kim , Yoon-Suk Oh , Jae Ick Sim , Kuk-Ki Hong , Kyung Oh Choi , Hyun Soo Kim , Min-Ji Baek , Tae Sun Kang
摘要： Disclosed herein are ammonia-specific 5′-XMP aminase mutants and a method for preparing the same. A mutation is introduced into the active site of glutamine-dependent catalysis in 5′-XMP aminase. The resulting 5′-XMP aminase mutant is devoid of the glutamine-dependent activity and specifically reacts with external ammonia in converting 5′-XMP into 5′-GMP. Thus, the ammonia-specific 5′-XMP aminase mutant is stabler within cells compared to the wild type, and can be useful in the industrial conversion of 5′-XMP into 5′-GMP.
摘要翻译： 本文公开了氨特异性5'-XMP氨基酶突变体及其制备方法。 在5'-XMP氨基酶中引入谷氨酰胺依赖性催化活性位点的突变。 所得到的5'-XMP氨基酶突变体缺乏谷氨酰胺依赖性活性，并特异性地与外部氨反应将5'-XMP转化为5'-GMP。 因此，与野生型相比，氨特异性5'-XMP氨基酶突变体在细胞内更稳定，可用于将5'-XMP工业转化为5'-GMP。
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公开(公告)号：US20080318278A1
公开(公告)日：2008-12-25
申请号：US12097104
申请日：2006-12-14
申请人： Jae-Gu Pan , Heung-Chae Jung , Eui-Joong Kim , Han-Seung Lee , Young Hoon Park , Hyoung Suk Kim , Jong-Kwon Han , Jin Nam Lee , Ki-Hoon Oh , Jeong Hwan Kim , Yoon-Suk Oh , Jae Ick Sim , Kuk-Ki Hong , Kyung Oh Choi , Hyun Soo Kim , Min-Ji Baek , Tae Sun Kang
发明人： Jae-Gu Pan , Heung-Chae Jung , Eui-Joong Kim , Han-Seung Lee , Young Hoon Park , Hyoung Suk Kim , Jong-Kwon Han , Jin Nam Lee , Ki-Hoon Oh , Jeong Hwan Kim , Yoon-Suk Oh , Jae Ick Sim , Kuk-Ki Hong , Kyung Oh Choi , Hyun Soo Kim , Min-Ji Baek , Tae Sun Kang
摘要： Disclosed herein are ammonia-specific 5′-XMP aminase mutants and a method for preparing the same. A mutation is introduced into the active site of glutamine-dependent catalysis in 5′-XMP aminase. The resulting 5′-XMP aminase mutant is devoid of the glutamine-dependent activity and specifically reacts with external ammonia in converting 5′-XMP into 5′-GMP. Thus, the ammonia-specific 5′-XMP aminase mutant is stabler within cells compared to the wild type, and can be useful in the industrial conversion of 5′-XMP into 5′-GMP.
摘要翻译： 本文公开了氨特异性5'-XMP氨基酶突变体及其制备方法。 在5'-XMP氨基酶中引入谷氨酰胺依赖性催化活性位点的突变。 所得到的5'-XMP氨基酶突变体缺乏谷氨酰胺依赖性活性，并特异性地与外部氨反应将5'-XMP转化为5'-GMP。 因此，与野生型相比，氨特异性5'-XMP氨基酶突变体在细胞内更稳定，可用于将5'-XMP工业转化为5'-GMP。
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8.发明申请SEMICONDUCTOR PACKAGE HAVING SUPPORTING PLATE AND METHOD OF FORMING THE SAME 审中-公开具有支撑板的半导体封装及其形成方法公开(公告)号：US20140167291A1
公开(公告)日：2014-06-19
申请号：US14184951
申请日：2014-02-20
申请人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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9.发明申请公开(公告)号：US20130049228A1
公开(公告)日：2013-02-28
申请号：US13564309
申请日：2012-08-01
申请人： Tae-Duk NAM , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk NAM , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L25/07
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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公开(公告)号：US08063313B2
公开(公告)日：2011-11-22
申请号：US12263614
申请日：2008-11-03
申请人： Yun-Jin Oh , Chang-Hoon Han , Kwang-Ryul Lee , Hyoung-Suk Kim
发明人： Yun-Jin Oh , Chang-Hoon Han , Kwang-Ryul Lee , Hyoung-Suk Kim
CPC分类号： H05K3/3452 , H01L24/73 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06562 , H01L2924/15311 , H05K2201/09772 , H05K2201/09881 , H05K2203/0191 , H05K2203/049 , H05K2203/0577 , H05K2203/058 , H05K2203/0582 , H05K2203/0585 , H05K2203/1476 , Y10T29/4913 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A printed circuit board (PCB) and a semiconductor package that are configured to prevent delamination and voids. In one example embodiment, the semiconductor package includes a PCB having a base substrate on which conductive patterns are formed and which includes an interior region having a die paddle for receiving a semiconductor chip and an exterior region disposed outside the interior region. The PCB also includes a first solder resist formed on a portion of the base substrate corresponding to the interior region and a second solder resist formed on a portion of the base substrate corresponding to the exterior region. The second solder resist may also have a greater surface roughness than the surface roughness of the first solder resist.
摘要翻译： 配置为防止分层和空隙的印刷电路板（PCB）和半导体封装。 在一个示例性实施例中，半导体封装包括具有其上形成有导电图案的基底基板的PCB，其包括具有用于接收半导体芯片的管芯焊盘和设置在内部区域外部的外部区域的内部区域。 PCB还包括形成在对应于内部区域的基底基板的一部分上的第一阻焊剂和形成在对应于外部区域的基底基板的一部分上的第二阻焊剂。 第二阻焊剂也可以具有比第一阻焊剂的表面粗糙度更大的表面粗糙度。
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