公开(公告)号：US09455937B2

公开(公告)日：2016-09-27

申请号：US12776562

申请日：2010-05-10

申请人： Joel R. Goergen

发明人： Joel R. Goergen

IPC分类号： H04L12/28 ,  H04L12/56 ,  H04L12/931 ,  H04L12/64 ,  H04W28/02 ,  H04W28/18

CPC分类号： H04L49/40 ,  H04L12/64 ,  H04W28/02 ,  H04W28/18 ,  H04W56/00 ,  H04W72/12

摘要： A packet network device such as a network switch includes a number of functional cards or chassis modules at least some of which are connected to both an electrical backplane and a wireless backplane. The electrical backplane provides data plane signal paths and the wireless backplane provides control plane signal paths.

摘要翻译： 诸如网络交换机的分组网络设备包括多个功能卡或机箱模块，其中至少一些连接到电背板和无线背板。 电背板提供数据平面信号路径，无线背板提供控制平面信号路径。

公开(公告)号：US08898891B2

公开(公告)日：2014-12-02

申请号：US12961610

申请日：2010-12-07

申请人： Joel R. Goergen ,  Yi Zheng

发明人： Joel R. Goergen ,  Yi Zheng

IPC分类号： H05K3/42 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K1/0216 ,  B32B2305/076 ,  B32B2309/08 ,  B32B2457/08 ,  H01P3/081 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/0091 ,  H05K3/46 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09745 ,  H05K2201/098 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.

摘要翻译： 公开了电路板及其制造方法。 电路板使用形成为包括纵向通道的导体承载高速信号。 通道增加了导体的表面积，从而增强了导体承载高速信号的能力。 在至少一些实施例中，通道内的介电常数和通道之外的介质常数之间也存在不连续性，这被认为可减少信号损耗。

公开(公告)号：US08218537B1

公开(公告)日：2012-07-10

申请号：US12156339

申请日：2008-05-30

申请人： Ann Gui ,  Krishnamurthy Subramanian ,  Glenn Poole ,  Joel R. Goergen ,  Joanna Lin

发明人： Ann Gui ,  Krishnamurthy Subramanian ,  Glenn Poole ,  Joel R. Goergen ,  Joanna Lin

IPC分类号： H04L12/56 ,  H04J1/16

CPC分类号： H04L49/40 ,  H04L49/101

摘要： A serial channel switch circuit and modular packet switch using the serial channel switch circuits are disclosed. The serial channel switch circuit has a reconfigurable table for internal logical-to-physical channel switch translation. Depending on the slot in which a card containing such a serial channel switch circuit is inserted in the modular packet switch, its serial channel switch circuit may receive a different set of reconfigurable table values that are specific to that location. A global set of logical channel values can be applied to each card, which performs logical-to-physical channel mapping according to its location in the modular packet switch. Other embodiments are also described and claimed.

摘要翻译： 公开了使用串行通道切换电路的串行通道切换电路和模块化分组交换机。 串行通道切换电路具有用于内部逻辑到物理信道切换转换的可重配置表。 根据其中包含这种串行通道切换电路的卡被插入到模块化分组交换机中的插槽，其串行通道切换电路可以接收特定于该位置的不同的一组可重新配置的表值。 可以将每个逻辑信道值的全局集合应用于根据其在模块化分组交换机中的位置执行逻辑到物理信道映射的每个卡。 还描述和要求保护其他实施例。

公开(公告)号：US08208253B1

公开(公告)日：2012-06-26

申请号：US12313275

申请日：2008-11-18

申请人： Joel R. Goergen ,  Donald Lewis

发明人： Joel R. Goergen ,  Donald Lewis

IPC分类号： H05K7/20

CPC分类号： H05K7/1445

摘要： A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.

摘要翻译： 模块化分组网络设备具有其中多个逻辑卡配合到电信令背板的前侧的机箱。 逻辑卡的逻辑电源由一组将主电源转换为逻辑卡所需的逻辑电压的电源转换器卡提供。 电源转换卡位于背板背后的单独冷却路径中。 在至少一些实施例中实现的优点包括从信令背板或背板的一部分移除主电源层，提供冗余的可升级电源模块，其单独的故障不会导致逻辑卡故障，并向功率转换器电路提供冷空气， 如果位于逻辑卡上，只能加热空气。 还描述和要求保护其他实施例。

公开(公告)号：US20120033760A1

公开(公告)日：2012-02-09

申请号：US13272329

申请日：2011-10-13

申请人： Yi Zheng ,  Joel R. Goergen

发明人： Yi Zheng ,  Joel R. Goergen

IPC分类号： H04L27/04

CPC分类号： H04L25/4917 ,  H04L1/0063 ,  H04L25/4904 ,  H04L25/497

摘要： Methods and apparatus for serial channel operation are disclosed. An N+1-level signaling scheme is used to transmit N staggered but overlapping NRZ sub-sequences concurrently on a serial channel. Each sequence has a bit rate R and an essential bandwidth of R Hz. The combined bit rate of the channel is N×R, but due to a lack of correlation between the sub-sequences, the essential bandwidth remains approximately R Hz. The signaling scheme also contains redundancy that allows some errors to be detected and/or corrected. Other embodiments are also described and claimed.

公开(公告)号：US06822876B2

公开(公告)日：2004-11-23

申请号：US10068420

申请日：2002-02-05

申请人： Joel R. Goergen

发明人： Joel R. Goergen

IPC分类号： H05R1216

CPC分类号： H05K3/4688 ,  H05K1/024 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09309

摘要： A high-speed router backplane is disclosed. Because of the large number of high-speed conductive traces present in such a backplane, electromagnetic interference (EMI) can be a serious issue. And because such a router consumes significant amounts of power, some provision must exist (e.g., bus bars in the prior art) within the router for distributing power to the router components. In preferred embodiments, power distribution is accomplished using relatively thick (e.g., three- or four-ounce copper) power distribution planes within the same backplane used for high-speed signaling. To shield these planes from EMI, they are preferably placed near the center of the material stack, shielded from the signaling layers by adjacent digital ground planes. Also, where two power supply planes exist, the power supply planes are placed adjacent, further shielded by their respective power return planes. Each power distribution plane can also include a conductive guard ring to shield that plane from EMI injected at the board edges. And where the backplane includes both high-speed and lower speed signaling traces, at least some lower speed signaling traces are placed on signaling layers, designated as low-speed, that are closest to the power distribution planes.

摘要翻译： 公开了一种高速路由器背板。 由于这种背板中存在大量高速导电迹线，电磁干扰（EMI）可能是一个严重的问题。 并且因为这样的路由器消耗大量的功率，所以在路由器内必须存在一些设备（例如，现有技术中的汇流条），以将功率分配给路由器组件。 在优选实施例中，使用在用于高速信号的相同底板内的相对较厚（例如，三或四盎司铜）功率分配平面来实现功率分配。 为了屏蔽这些平面与EMI，它们优选放置在材料堆叠的中心附近，通过相邻的数字接地层与信号层屏蔽。 此外，在存在两个电源平面的情况下，电源平面被放置在相邻的位置，被其各自的功率返回平面进一步屏蔽。 每个配电平面还可以包括导电保护环，以将该平面与在板边缘处注入的EMI屏蔽。 并且在背板包括高速和低速信令迹线的地方，至少一些较低速度的信令迹线被放置在最接近配电平面的信号层（被称为低速）上。

公开(公告)号：US06812803B2

公开(公告)日：2004-11-02

申请号：US10068622

申请日：2002-02-05

申请人： Joel R. Goergen

发明人： Joel R. Goergen

IPC分类号： H03H700

CPC分类号： H05K1/0245 ,  H05K1/0248 ,  H05K1/116 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4641 ,  H05K7/1459 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09718

摘要： A high-speed router backplane, and method for its fabrication, are disclosed. The backplane uses differential signaling trace pairs on multiple high-speed signaling layers, the high-speed signaling layers separated by ground planes. Plated signaling thru-holes connect the trace pairs to the board surface for connection to external components. The signaling thru-holes pass through clearances in each ground plane. At selected ground planes, a conductive pad is patterned within each high-speed signaling thru-hole clearance, the pad slightly larger than the thru-hole diameter. The pads affect the impedance characteristics of the thru-holes, thus providing a better impedance match to the differential trace pairs, reducing signal reflections, and improving the ability to signal across the backplane at high speeds.

摘要翻译： 公开了一种高速路由器背板及其制造方法。 背板在多个高速信号层上使用差分信令跟踪对，高速信号层由接地层分开。 电镀信号通孔将走线对连接到电路板表面，以连接到外部组件。 信号通孔穿过每个接地平面内的间隙。 在选定的接地平面，每个高速信号通孔间隙内的导电焊盘都被图案化，焊盘略大于通孔直径。 这些焊盘影响通孔的阻抗特性，从而为差分走线对提供更好的阻抗匹配，减少信号反射，并提高高速信号跨背板的能力。

公开(公告)号：US09560774B2

公开(公告)日：2017-01-31

申请号：US13420167

申请日：2012-03-14

申请人： Joel R. Goergen ,  Greg Hunt

发明人： Joel R. Goergen ,  Greg Hunt

IPC分类号： H05K3/20 ,  H05K3/42 ,  H05K1/02 ,  H05K3/00

CPC分类号： H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165

摘要： A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

摘要翻译： 公开了一种高速路由器背板。 路由器背板在多个信号层上使用差分信号对，每个信号对夹在一对数字接地层之间。 通孔用于将差分信号对连接到外部组件。 为了降低路由复杂度，差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。 钻出至少一些通孔和通孔以减少孔的导电短截线长度部分。 孔的钻孔部分包括从第一轮廓到第二轮廓的转变，以减少从钻孔的端部的射频反射。

公开(公告)号：US08345439B1

公开(公告)日：2013-01-01

申请号：US12313265

申请日：2008-11-18

申请人： Joel R. Goergen ,  Donald Lewis

发明人： Joel R. Goergen ,  Donald Lewis

IPC分类号： H05K1/11

CPC分类号： H04L49/40 ,  H05K7/1458 ,  H05K2201/044

摘要： A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.

摘要翻译： 模块化分组网络设备具有其中多个逻辑卡配合到电信令背板的前侧的机箱。 逻辑卡的逻辑电源由一组将主电源转换为逻辑卡所需的逻辑电压的电源转换器卡提供。 电源转换卡位于背板背后的单独冷却路径中。 在至少一些实施例中实现的优点包括从信令背板或背板的一部分移除主电源层，提供冗余的可升级电源模块，其单独的故障不会导致逻辑卡故障，并向功率转换器电路提供冷空气， 如果位于逻辑卡上，只能加热空气。 还描述和要求保护其他实施例。

公开(公告)号：US20120144665A1

公开(公告)日：2012-06-14

申请号：US13400207

申请日：2012-02-20

申请人： Joel R. Goergen ,  Greg Hunt ,  Peter Tomaszewski ,  Joseph Pankow ,  Michael Laudon

发明人： Joel R. Goergen ,  Greg Hunt ,  Peter Tomaszewski ,  Joseph Pankow ,  Michael Laudon

IPC分类号： H05K3/32 ,  H05K3/10 ,  H05K3/30

CPC分类号： H05K1/111 ,  H05K1/0245 ,  H05K2201/0187 ,  H05K2201/0969 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.

摘要翻译： 表面焊盘的特征阻抗是通过网状网格化和用介电材料填充空间来操作的，在表面焊盘与接地平面的下方接地焊盘的耦合中提供电感元件，或这些方法的组合。 在适当的实施例中，可接受的信号迹线路由路径将存在于地平面下方的嵌入式信号层中，并在表面焊盘下交叉。 还描述和要求保护其他实施例。