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    SEMICONDUCTOR PACKAGE AND METHOD OF ESTIMATING SURFACE TEMPERATURE OF SEMICONDUCTOR DEVICE INCLUDING THE SAME
    2.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF ESTIMATING SURFACE TEMPERATURE OF SEMICONDUCTOR DEVICE INCLUDING THE SAME 有权
    半导体封装和估算包括其中的半导体器件的表面温度的方法

    公开(公告)号：US20140247859A1

    公开(公告)日：2014-09-04

    申请号：US14136787

    申请日：2013-12-20

    申请人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunho JUNG

    发明人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunho JUNG

    IPC分类号： G01K7/01

    CPC分类号： G01K7/42 ,  G01K3/06 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

    摘要翻译： 半导体封装包括第一封装，第一封装包括第一衬底和安装在第一衬底上的第一半导体芯片以及与第一封装相对并间隔开的第二封装。 第二封装包括其上安装有第二半导体芯片的第二基板。 半导体封装还包括将第一和第二封装彼此电连接的连接结构，连接到第一衬底的第一温度传感器，连接到第一半导体芯片的第二温度传感器和连接到第二半导体的第三温度传感器 芯片。

    SEMICONDUCTOR MODULE AND MODULE SYSTEM HAVING THE SAME
    6.
    发明申请
    SEMICONDUCTOR MODULE AND MODULE SYSTEM HAVING THE SAME 有权
    具有相同功能的半导体模块和模块系统

    公开(公告)号：US20130077239A1

    公开(公告)日：2013-03-28

    申请号：US13547595

    申请日：2012-07-12

    申请人： Jin-Kwon BAE ,  Eun-Seok CHO

    发明人： Jin-Kwon BAE ,  Eun-Seok CHO

    IPC分类号： H01L23/467

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

    摘要翻译： 提供了一种半导体模块。 半导体模块包括包括第一表面和与第一表面相对的第二表面的基板。 半导体器件设置在衬底的第一表面上。 气流引导件设置在基板的第二表面上。 气流引导件包括一个包括远离第二表面的端部的板。