公开(公告)号：US08076233B2

公开(公告)日：2011-12-13

申请号：US12561737

申请日：2009-09-17

Applicant: Kuniko Ishikawa ,  Norio Kainuma ,  Kenji Kobae

Inventor： Kuniko Ishikawa ,  Norio Kainuma ,  Kenji Kobae

IPC: H01L21/60

CPC classification number: H01L24/11 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2224/0401

Abstract: A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.

Abstract translation: 电极连接部分的制造方法包括用焊料覆盖电极形成表面，在覆盖电极形成表面的焊料片上滚动加热辊，以及在加热辊经过焊料片之后去除焊料片。

公开(公告)号：US20120248616A1

公开(公告)日：2012-10-04

申请号：US13361344

申请日：2012-01-30

Applicant: Masayuki KITAJIMA ,  Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa

Inventor： Masayuki KITAJIMA ,  Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa

IPC: H01L23/48 ,  B23K35/24

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K1/206 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0255 ,  B23K35/262 ,  B23K35/302 ,  B23K35/3613 ,  B23K2101/42 ,  C22C13/00 ,  H01L2924/0002 ,  H05K3/284 ,  H05K3/3484 ,  H05K2201/0323 ,  H05K2201/10977 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00

Abstract: To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus.

Abstract translation: 提供一种电子部件，其包含：包含电极焊盘的布线板; 包括多个电极的部件，所述部件安装在所述布线板上; 覆盖该部件的密封树脂; 以及多个端子，其被配置为将布线板内设置的布线与外部基板连接，其中所述多个电极和所述电极焊盘与焊料连接，并且其中在所述焊料之间设置有第一树脂层和第二树脂层 和密封树脂，其中第一树脂层具有第一杨氏模量，第二树脂层的第二杨氏模量大于第一杨氏模量。

公开(公告)号：US07833831B2

公开(公告)日：2010-11-16

申请号：US11951693

申请日：2007-12-06

Applicant: Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

Inventor： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

IPC: H01L21/00

CPC classification number: B23K1/06 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0285 ,  H05K2203/0338 ,  H05K2203/1105 ,  Y10T428/12493 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

Abstract translation: 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。

公开(公告)号：US20100075493A1

公开(公告)日：2010-03-25

申请号：US12561737

申请日：2009-09-17

Applicant: Kuniko Ishikawa ,  Norio Kainuma ,  Kenji Kobae

Inventor： Kuniko Ishikawa ,  Norio Kainuma ,  Kenji Kobae

IPC: H01L21/60

CPC classification number: H01L24/11 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2224/0401

Abstract: A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.

Abstract translation: 电极连接部分的制造方法包括用焊料覆盖电极形成表面，在覆盖电极形成表面的焊料片上滚动加热辊，以及在加热辊经过焊料片之后去除焊料片。

公开(公告)号：US07566586B2

公开(公告)日：2009-07-28

申请号：US11634119

申请日：2006-12-06

Applicant: Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

Inventor： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

Abstract translation: 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

公开(公告)号：US08418910B2

公开(公告)日：2013-04-16

申请号：US13367509

申请日：2012-02-07

Applicant: Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa ,  Masayuki Kitajima

Inventor： Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa ,  Masayuki Kitajima

IPC: B23K35/14 ,  B23K35/34 ,  B23K31/02

CPC classification number: H01L24/13 ,  B22F1/0014 ,  B22F1/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C23C24/106 ,  H01L23/49811 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11502 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13599 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13709 ,  H01L2224/13711 ,  H01L2224/13713 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13813 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/13899 ,  H01L2224/13913 ,  H01L2224/13939 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81055 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81509 ,  H01L2224/81511 ,  H01L2224/81513 ,  H01L2224/81639 ,  H01L2224/81644 ,  H01L2224/81647 ,  H01L2224/81699 ,  H01L2224/81711 ,  H01L2224/81713 ,  H01L2224/81739 ,  H01L2224/81744 ,  H01L2224/8181 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15738 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/01007 ,  H01L2924/01008 ,  H01L2924/01018 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/0103 ,  H01L2924/053 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Abstract translation: 导电接合材料包括：具有第一熔点或更高熔点的高熔点金属颗粒的金属组分; 中间熔点金属颗粒，其具有第一温度或更高的第二熔点，第二温度或更低，第二温度低于第一熔点并高于第一温度; 和具有第三熔点或更低熔点的低熔点金属颗粒，第三熔点低于第一温度。

公开(公告)号：US20110079896A1

公开(公告)日：2011-04-07

申请号：US12892029

申请日：2010-09-28

Applicant: Yoshiyuki SATOH ,  Kenji KOBAE ,  Kimio NAKAMURA ,  Takayoshi MATSUMURA ,  Kuniko ISHIKAWA

Inventor： Yoshiyuki SATOH ,  Kenji KOBAE ,  Kimio NAKAMURA ,  Takayoshi MATSUMURA ,  Kuniko ISHIKAWA

IPC: H01L23/488 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L21/56 ,  H01L24/12 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/0665

Abstract: A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion.

Abstract translation: 一种半导体器件制造方法，包括以下步骤：在要安装半导体芯片的衬底的电极上形成焊料部分; 将树脂层施加到基板上以使得焊料部分的顶部区域暴露的厚度; 固化树脂层; 在要安装半导体芯片的区域上提供热固性底部填充材料; 将所述半导体芯片的电极朝向所述焊料部分，使得所述电极面向所述焊料部分; 并加热底部填充材料和焊料部分。

公开(公告)号：US20080206587A1

公开(公告)日：2008-08-28

申请号：US11951693

申请日：2007-12-06

Applicant: Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

Inventor： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

IPC: B32B15/00 ,  B23K31/02 ,  B23K1/20

CPC classification number: B23K1/06 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0285 ,  H05K2203/0338 ,  H05K2203/1105 ,  Y10T428/12493 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

Abstract translation: 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。

公开(公告)号：US20120211549A1

公开(公告)日：2012-08-23

申请号：US13367509

申请日：2012-02-07

Applicant: Takatoyo YAMAKAMI ,  Takashi KUBOTA ,  Kuniko ISHIKAWA ,  Masayuki KITAJIMA

Inventor： Takatoyo YAMAKAMI ,  Takashi KUBOTA ,  Kuniko ISHIKAWA ,  Masayuki KITAJIMA

IPC: B23K1/20 ,  B23K35/24

CPC classification number: H01L24/13 ,  B22F1/0014 ,  B22F1/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C23C24/106 ,  H01L23/49811 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11502 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13599 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13709 ,  H01L2224/13711 ,  H01L2224/13713 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13813 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/13899 ,  H01L2224/13913 ,  H01L2224/13939 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81055 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81509 ,  H01L2224/81511 ,  H01L2224/81513 ,  H01L2224/81639 ,  H01L2224/81644 ,  H01L2224/81647 ,  H01L2224/81699 ,  H01L2224/81711 ,  H01L2224/81713 ,  H01L2224/81739 ,  H01L2224/81744 ,  H01L2224/8181 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15738 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/01007 ,  H01L2924/01008 ,  H01L2924/01018 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/0103 ,  H01L2924/053 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Abstract translation: 导电接合材料包括：具有第一熔点或更高熔点的高熔点金属颗粒的金属组分; 中间熔点金属粒子，其具有第一温度以上的第二熔点，第二温度以下，第二温度低于第一熔点且高于第一温度; 和具有第三熔点或更低熔点的低熔点金属颗粒，第三熔点低于第一温度。

公开(公告)号：US20070264752A1

公开(公告)日：2007-11-15

申请号：US11634119

申请日：2006-12-06

Applicant: Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

Inventor： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

Abstract translation: 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。