公开(公告)号：US08854935B2

公开(公告)日：2014-10-07

申请号：US14111487

申请日：2011-08-22

申请人： Kenji Sakata

发明人： Kenji Sakata

IPC分类号： G11B20/10 ,  H04N21/432 ,  H04N21/426 ,  H04N5/775 ,  G11B20/00 ,  H04N5/85

CPC分类号： G11B20/00 ,  G11B20/10 ,  G11B2220/2541 ,  H04N5/775 ,  H04N5/85 ,  H04N21/42646 ,  H04N21/4325

摘要： A front-end unit 2 includes: a communication unit 8 and a local storage 9 to be used by a CPU 4b on the board in which the front-end unit itself is arranged; and I/F units 10a, 10b that make connections in an accessible manner from the CPU 4b to the communication unit 8 and the local storage 9 in the front-end unit 2.

摘要翻译： 前端单元2包括：通信单元8和本地存储器9，其被布置在前端单元本身的板上的CPU 4b使用; 以及从CPU 4b到通信单元8和前端单元2中的本地存储器9以可访问的方式进行连接的I / F单元10a，10b。

公开(公告)号：US08643247B2

公开(公告)日：2014-02-04

申请号：US13859470

申请日：2013-04-09

申请人： Tatsuyuki Saito ,  Ryuichi Takakusagi ,  Toshiyuki Kimura ,  Yoshichika Kawashima ,  Kenji Sakata

发明人： Tatsuyuki Saito ,  Ryuichi Takakusagi ,  Toshiyuki Kimura ,  Yoshichika Kawashima ,  Kenji Sakata

IPC分类号： H02K13/00

CPC分类号： H02K3/28 ,  H02K7/1166 ,  H02K13/10 ,  H02K23/04 ,  H02K23/34

摘要： Disclosed is an electric motor including a yoke formed in a bottomed cylindrical shape; permanent magnets arranged on an inner peripheral surface of the yoke; an armature including a rotary shaft journalled on the yoke, an armature core formed with a plurality of teeth and fixed onto the rotary shaft, an armature coil wound around the teeth of the armature core, a commutator having a plurality of segments and being fixed onto the rotary shaft, and a connecting wire connecting two segments arranged to face each other back to back around the rotary shaft, the armature being surrounded by the permanent magnets and accommodated within the yoke; and a first brush, a second brush, and a third brush coming into sliding contact with the segments of the commutator of the armature.

摘要翻译： 公开了一种电动马达，其包括形成为有底圆筒形状的磁轭; 设置在所述轭的内周面上的永磁体; 一个电枢，包括一个轴颈轴颈上的旋转轴，一个形成有多个齿并固定在旋转轴上的电枢铁芯，一个缠绕在电枢铁心上的电枢线圈，一个具有多个段的换向器，并固定在 旋转轴和连接线，其将彼此相对地彼此面对地布置成围绕旋转轴彼此相对地连接，电枢被永磁体包围并容纳在轭内; 以及第一刷子，第二刷子和与衔铁的换向器的段滑动接触的第三刷子。

公开(公告)号：US20140029401A1

公开(公告)日：2014-01-30

申请号：US14111487

申请日：2011-08-22

申请人： Kenji Sakata

发明人： Kenji Sakata

IPC分类号： G11B20/00

CPC分类号： G11B20/00 ,  G11B20/10 ,  G11B2220/2541 ,  H04N5/775 ,  H04N5/85 ,  H04N21/42646 ,  H04N21/4325

摘要： A front-end unit 2 includes: a communication unit 8 and a local storage 9 to be used by a CPU 4b on the board in which the front-end unit itself is arranged; and I/F units 10a, 10b that make connections in an accessible manner from the CPU 4b to the communication unit 8 and the local storage 9 in the front-end unit 2.

摘要翻译： 前端单元2包括：通信单元8和本地存储器9，其被布置在前端单元本身的板上的CPU 4b使用; 以及从CPU 4b到通信单元8和前端单元2中的本地存储器9以可访问的方式进行连接的I / F单元10a，10b。

公开(公告)号：US08618712B2

公开(公告)日：2013-12-31

申请号：US13859458

申请日：2013-04-09

申请人： Tatsuyuki Saito ,  Ryuichi Takakusagi ,  Toshiyuki Kimura ,  Yoshichika Kawashima ,  Kenji Sakata

发明人： Tatsuyuki Saito ,  Ryuichi Takakusagi ,  Toshiyuki Kimura ,  Yoshichika Kawashima ,  Kenji Sakata

IPC分类号： H02K13/00

CPC分类号： H02K3/28 ,  H02K7/1166 ,  H02K13/10 ,  H02K23/04 ,  H02K23/34

摘要： Disclosed is a windshield wiper motor having a reduction mechanism unit and an electric motor. The electric motor of the windshield wiper motor includes a yoke formed in a bottomed cylindrical shape; permanent magnets arranged on an inner peripheral surface of the yoke; an armature including a rotary shaft journalled to the yoke, an armature core where a plurality of teeth are formed and fixed onto the rotary shaft, an armature coil wound around teeth of the armature core, a commutator having a plurality of segments and being fixed onto the rotary shaft, and a plurality of connecting wires connecting two segments arranged to face each other back to back around the rotary shaft, being surrounded by the permanent magnets and arranged within the yoke; and a first brush, a second brush, and a third brush coming into sliding contact with the segments of the commutator of the armature.

摘要翻译： 公开了一种具有减速机构单元和电动机的挡风玻璃刮水器电动机。 挡风玻璃刮水器电动机的电动机包括形成为有底圆筒形的磁轭; 设置在所述轭的内周面上的永磁体; 一个电枢，包括一个旋转轴，该旋转轴安装在磁轭上，一个电枢磁芯，其中多个齿形成并固定在旋转轴上，电枢线圈缠绕在电枢铁芯的齿上，一个换向器具有多个段并固定在 旋转轴和多个连接线，其连接两个彼此相对地相对地彼此相对地相对地布置的旋转轴，所述多个连接线被所述永磁体包围并设置在所述轭内; 以及第一刷子，第二刷子和与衔铁的换向器的段滑动接触的第三刷子。

公开(公告)号：US08404517B2

公开(公告)日：2013-03-26

申请号：US13485729

申请日：2012-05-31

申请人： Kenji Sakata ,  Tsuyoshi Kida

发明人： Kenji Sakata ,  Tsuyoshi Kida

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacturing a semiconductor device, includes mounting a semiconductor chip on a wiring substrate such that one surface of the semiconductor chip is faced to one surface of the wiring substrate, and filling a first resin in a gap between the surface of the wiring substrate and the surface of the semiconductor chip such that part of the first resin protrudes from the gap. In the filling of the first resin, the first resin is injected into the gap by use of a first resin injection nozzle while the first resin injection nozzle is being moved along any one of sides of the semiconductor chip or along two sides of the semiconductor chip which are adjacent to each other.

摘要翻译： 一种制造半导体器件的方法，包括将半导体芯片安装在布线基板上，使得半导体芯片的一个表面面对布线基板的一个表面，并且在布线基板的表面之间的间隙中填充第一树脂 以及半导体芯片的表面使得第一树脂的一部分从间隙突出。 在第一树脂的填充中，通过使用第一树脂注入喷嘴将第一树脂注入到间隙中，同时第一树脂注入喷嘴沿着半导体芯片的任一侧移动或沿着半导体芯片的两侧移动 它们彼此相邻。

公开(公告)号：US07702515B2

公开(公告)日：2010-04-20

申请号：US10279882

申请日：2002-10-25

申请人： Akio Fujino ,  Naotake Shindou ,  Kenji Sakata

发明人： Akio Fujino ,  Naotake Shindou ,  Kenji Sakata

IPC分类号： G06Q99/00

CPC分类号： G06Q10/10 ,  G06Q10/1053

摘要： A job seeking information input section inputs information for job seeking conditions of a job seeker, and a job seeking information extractor extracts at least one piece of information for job seeking conditions of persons other than the job seeker from a database. A job-recruiter response information extractor extracts all or a part of pieces of job-recruiter response information that relates to respective responses of the job recruiters to the persons whose information corresponds to the extracted information, from a database. An output section outputs the extracted job-recruiter response information.

摘要翻译： 作业寻求信息输入部分输入求职者求职条件的信息，求职信息提取器从数据库中提取除求职者以外的人的求职条件的至少一条信息。 求职者回复信息提取器从数据库中提取与作业招聘者的各自的响应相关联的信息对应于提取的信息的人的全部或一部分招聘者回复信息。 输出部分输出提取的作业招聘者应答信息。

公开(公告)号：US20060046242A1

公开(公告)日：2006-03-02

申请号：US11237695

申请日：2005-09-29

申请人： Kosei Takano ,  Kenji Sakata

发明人： Kosei Takano ,  Kenji Sakata

IPC分类号： G09B25/00

CPC分类号： G06Q30/02 ,  G06Q20/12 ,  G09B5/00

摘要： An apparatus for providing various pieces of information related to a product that requires a proper disposal by a consumer to a client apparatus of the consumer via a network includes an educating unit that conducts an education related to a disposal of the product for the consumer via the client apparatus; and an education-history storing unit that stores a progress of the education conducted, as an education history.

摘要翻译： 一种用于提供与消费者需要经由网络向消费者的客户端装置适当处置的产品相关的各种信息的装置，包括：教育单元，其通过经由所述消费者的消费者进行与所述消费者的产品相关的教育 客户端设备 作为教育历史，存储进行教育进度的教育历史存储单元。

公开(公告)号：US5149465A

公开(公告)日：1992-09-22

申请号：US674381

申请日：1991-03-25

申请人： Toru Ueki ,  Kenji Sakata ,  Masaji Yoshimura ,  Kazuharu Kanezaki ,  Ineo Iwata

发明人： Toru Ueki ,  Kenji Sakata ,  Masaji Yoshimura ,  Kazuharu Kanezaki ,  Ineo Iwata

IPC分类号： C08L71/12 ,  H01B1/24

CPC分类号： H01B1/24 ,  C08L71/123

摘要： A conductive resin composition which has electrical conductivity and antistatic property, is excellent in heat resistance and processability, and comprises:(A) from 50 to 95% by weight of a polyphenylene ether resin,(B) from 50 to 5% by weight of a copolymer of a styrenic compound and an .alpha.,.beta.-unsaturated dicarboxylic acid imide compound,(C) from 5 to 30 parts by weight of a conductive carbon per 100 parts by weight of the sum of the resin (A) and the copolymer (B), and (D) from 1 to 20 parts by weight of a low molecular weight polystyrene per 100 parts by weight of the sum of the resin (A) and the copolymer (B).

公开(公告)号：US4622360A

公开(公告)日：1986-11-11

申请号：US795435

申请日：1985-11-06

申请人： Tadashi Gomi ,  Kenji Sakata ,  Ichiro Aoyama ,  Nobuo Sono

发明人： Tadashi Gomi ,  Kenji Sakata ,  Ichiro Aoyama ,  Nobuo Sono

IPC分类号： C09D175/00 ,  C08G18/08 ,  C08G18/83 ,  C09G1/04 ,  C09G1/16 ,  C08L75/04

CPC分类号： C08G18/838 ,  C08G18/0823 ,  C09G1/16

摘要： Removable water-borne urethane resin coating composition comprising polyurethane resin containing carboxyl groups and/or carboxylate groups and polyvalent metal complex as a cross-linking agent and method for removing the coating formed by using the removable water-borne urethane resin coating composition which comprises treating said coating with a ligand containing alkaline solution and removing the coating.The coating formed by using the composition is superior in water resistance, recoatability, detergent resistance, black heel mark resistance, abrasion resistance and service life.

摘要翻译： 包含含有羧基和/或羧酸酯基团的聚氨酯树脂和作为交联剂的多价金属络合物的可移除的水性聚氨酯树脂涂料组合物和通过使用可除去的水性聚氨酯树脂涂料组合物形成的涂层的方法，该组合物包括处理 所述涂层具有含碱性溶液的配体并除去涂层。 通过使用该组合物形成的涂料在耐水性，可再涂性，耐洗涤性，黑色跟踪标记抗性，耐磨性和使用寿命方面优异。

公开(公告)号：US20150236003A1

公开(公告)日：2015-08-20

申请号：US14404099

申请日：2012-09-14

申请人： Jumpei Konno ,  Takafumi Nishita ,  Kenji Sakata ,  Nobuhiro Kinoshita ,  Michiaki Sugiyama ,  Tsuyoshi Kida ,  Yoshihiro Ono

发明人： Jumpei Konno ,  Takafumi Nishita ,  Kenji Sakata ,  Nobuhiro Kinoshita ,  Michiaki Sugiyama ,  Tsuyoshi Kida ,  Yoshihiro Ono

IPC分类号： H01L25/00 ,  H01L23/498 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/07 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/27312 ,  H01L2224/27334 ,  H01L2224/2741 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/753 ,  H01L2224/75315 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83001 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83906 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/11 ,  H01L21/304 ,  H01L2224/03 ,  H01L21/78 ,  H01L2221/68381 ,  H01L21/4825 ,  H01L2224/27 ,  H01L2924/01047

摘要： A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin. Here, before sealing with the resin, a gap between the second semiconductor chip and the wiring board is previously sealed with the adhesive material used when the first and second semiconductor chips are mounted.

摘要翻译： 一种制造半导体器件的方法，所述半导体器件通过层叠具有不同平面尺寸的第一半导体芯片和第二半导体芯片的方法，所述半导体器件和第二半导体芯片在通过粘合材料在布线板上的平面图中看到，其中具有相对较大的平面尺寸 以相对较小的平面尺寸安装在第一半导体芯片上。 此外，在安装第一和第二半导体芯片之后，用树脂密封第一和第二半导体芯片。 这里，在用树脂密封之前，当安装第一和第二半导体芯片时，使用所使用的粘合剂材料预先密封第二半导体芯片和布线板之间的间隙。