-
公开(公告)号：US20150236003A1
公开(公告)日：2015-08-20
申请号：US14404099
申请日：2012-09-14
申请人： Jumpei Konno , Takafumi Nishita , Kenji Sakata , Nobuhiro Kinoshita , Michiaki Sugiyama , Tsuyoshi Kida , Yoshihiro Ono
发明人： Jumpei Konno , Takafumi Nishita , Kenji Sakata , Nobuhiro Kinoshita , Michiaki Sugiyama , Tsuyoshi Kida , Yoshihiro Ono
IPC分类号： H01L25/00 , H01L23/498 , H01L25/065 , H01L21/56 , H01L23/00
CPC分类号： H01L21/486 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/538 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/065 , H01L25/0657 , H01L25/07 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2224/03002 , H01L2224/0401 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/27312 , H01L2224/27334 , H01L2224/2741 , H01L2224/29006 , H01L2224/29007 , H01L2224/29012 , H01L2224/29015 , H01L2224/2919 , H01L2224/32013 , H01L2224/32014 , H01L2224/32058 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/753 , H01L2224/75315 , H01L2224/81001 , H01L2224/81191 , H01L2224/81203 , H01L2224/81447 , H01L2224/81815 , H01L2224/81907 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/8385 , H01L2224/83862 , H01L2224/83906 , H01L2224/83907 , H01L2224/92 , H01L2224/9211 , H01L2224/92242 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/06568 , H01L2924/07802 , H01L2924/07811 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2224/11 , H01L21/304 , H01L2224/03 , H01L21/78 , H01L2221/68381 , H01L21/4825 , H01L2224/27 , H01L2924/01047
摘要： A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin. Here, before sealing with the resin, a gap between the second semiconductor chip and the wiring board is previously sealed with the adhesive material used when the first and second semiconductor chips are mounted.
摘要翻译： 一种制造半导体器件的方法，所述半导体器件通过层叠具有不同平面尺寸的第一半导体芯片和第二半导体芯片的方法，所述半导体器件和第二半导体芯片在通过粘合材料在布线板上的平面图中看到，其中具有相对较大的平面尺寸 以相对较小的平面尺寸安装在第一半导体芯片上。 此外，在安装第一和第二半导体芯片之后，用树脂密封第一和第二半导体芯片。 这里，在用树脂密封之前，当安装第一和第二半导体芯片时，使用所使用的粘合剂材料预先密封第二半导体芯片和布线板之间的间隙。
-
公开(公告)号：US08534532B2
公开(公告)日：2013-09-17
申请号：US13531566
申请日：2012-06-24
IPC分类号： H01L21/60
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/563 , H01L21/6836 , H01L23/49816 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2221/68327 , H01L2221/6834 , H01L2224/05554 , H01L2224/10175 , H01L2224/1146 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/136 , H01L2224/14153 , H01L2224/14155 , H01L2224/1601 , H01L2224/16105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81193 , H01L2224/81194 , H01L2224/81385 , H01L2224/814 , H01L2224/81444 , H01L2224/83102 , H01L2224/85 , H01L2224/85203 , H01L2224/94 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2224/11 , H01L2924/00 , H01L2224/48
摘要： To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W1 and a narrow part (a second portion) with a second width W2. When the solder material is heated, the thickness of the solder material arranged over the narrow part becomes smaller than the thickness of the solder material arranged in the wide part. Then, in the flip-chip bonding step, a projecting electrode is arranged over the narrow part and bonded onto the narrow part. Thus, the amount of protrusion of the solder material can be reduced.
摘要翻译： 为了提高半导体器件的可靠性，在倒装芯片接合工序中，事先将预先安装在突起电极的前端面上的焊料材料和预先施加在端子（接合引线）上的焊料材料） 加热并因此彼此集成并电连接。 端子包括具有第一宽度W1的宽部分（第一部分）和具有第二宽度W2的窄部分（第二部分）。 当焊料材料被加热时，布置在窄部分上的焊料材料的厚度变得小于布置在宽部分中的焊料材料的厚度。 然后，在倒装芯片接合工序中，将突出电极配置在狭窄部分上并粘合到窄部上。 因此，可以减少焊料材料的突出量。
-
公开(公告)号：US20130001274A1
公开(公告)日：2013-01-03
申请号：US13531566
申请日：2012-06-24
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/563 , H01L21/6836 , H01L23/49816 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2221/68327 , H01L2221/6834 , H01L2224/05554 , H01L2224/10175 , H01L2224/1146 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/136 , H01L2224/14153 , H01L2224/14155 , H01L2224/1601 , H01L2224/16105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81193 , H01L2224/81194 , H01L2224/81385 , H01L2224/814 , H01L2224/81444 , H01L2224/83102 , H01L2224/85 , H01L2224/85203 , H01L2224/94 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2224/11 , H01L2924/00 , H01L2224/48
摘要： To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W1 and a narrow part (a second portion) with a second width W2. When the solder material is heated, the thickness of the solder material arranged over the narrow part becomes smaller than the thickness of the solder material arranged in the wide part. Then, in the flip-chip bonding step, a projecting electrode is arranged over the narrow part and bonded onto the narrow part. Thus, the amount of protrusion of the solder material can be reduced.
摘要翻译： 为了提高半导体器件的可靠性，在倒装芯片接合工序中，事先将预先安装在突起电极的前端面上的焊料材料和预先施加在端子（接合引线）上的焊料材料） 加热并因此彼此集成并电连接。 端子包括具有第一宽度W1的宽部分（第一部分）和具有第二宽度W2的窄部分（第二部分）。 当焊料材料被加热时，布置在窄部分上的焊料材料的厚度变得小于布置在宽部分中的焊料材料的厚度。 然后，在倒装芯片接合工序中，将突出电极配置在狭窄部分上并粘合到窄部上。 因此，可以减少焊料材料的突出量。
-
公开(公告)号：US06552437B1
公开(公告)日：2003-04-22
申请号：US09806950
申请日：2001-04-06
申请人： Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Tomoko Higashino , Takafumi Nishita , Hiroshi Ohno
发明人： Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Tomoko Higashino , Takafumi Nishita , Hiroshi Ohno
IPC分类号： H01L2940
CPC分类号： H01L24/48 , H01L23/49503 , H01L23/4951 , H01L23/49575 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/06135 , H01L2224/06136 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48471 , H01L2224/48599 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/78 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2224/92247 , H01L2224/95 , H01L2224/97 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/12041 , H01L2924/1532 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/01026 , H01L2224/48227 , H01L2924/3512 , H01L2924/00012
摘要： Semiconductor chips (4), (5) are bonded and fixed to each other in a state where the rear surfaces of the respective semiconductor chips are faced to each other so that the other longer latus (4A2) of the semiconductor chip (4) and one longer latus (5A1) of the semiconductor chip (5) may confront the side of leads (10B), and supporting leads (8) are bonded and fixed onto the circuit forming surface (4A) of the semiconductor chip (4) or the circuit forming surface (5A) of the semiconductor chip (5). Owing to such a construction, the structure of a semiconductor device can be thinned. The semiconductor chips (4), (5) are bonded and fixed to each other in a state where the, positions of the respective semiconductor chips are staggered relatively to each other so that the electrodes (6) of the semiconductor chip (4) may lie outside the other longer latus (5A2) of the semiconductor chip (5), and that the electrodes (6) of the semiconductor chip (5) may lie outside the other longer latus (4A2) of the semiconductor chip (4). Owing to such a construction, the available percentage of the products of the semiconductor device can be heightened.
摘要翻译： 半导体芯片（4），（5）在各半导体芯片的背面彼此相对的状态下彼此接合固定，使得半导体芯片（4）的另一个较长的凹槽（4A2）和 半导体芯片（5）的一个较长的凹槽（5A1）可以面对引线（10B）的侧面，并且支撑引线（8）被接合并固定到半导体芯片（4）的电路形成表面（4A）上或 半导体芯片（5）的电路形成表面（5A）。 由于这样的结构，半导体器件的结构可以变薄。半导体芯片（4），（5）在各自的半导体芯片的位置相对于每个半导体芯片交错的状态下彼此接合并固定 使得半导体芯片（4）的电极（6）可以位于半导体芯片（5）的另一个较长的凹槽（5A2）之外，并且半导体芯片（5）的电极（6）可以位于外部 半导体芯片（4）的另一个较长的凹槽（4A2）。 由于这样的结构，可以提高半导体器件的产品的可用百分比。
-
公开(公告)号：US06750080B2
公开(公告)日：2004-06-15
申请号：US10372136
申请日：2003-02-25
申请人： Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Tomoko Higashino , Takafumi Nishita , Hiroshi Ohno
发明人： Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Tomoko Higashino , Takafumi Nishita , Hiroshi Ohno
IPC分类号： H01L2144
CPC分类号： H01L24/48 , H01L23/49503 , H01L23/4951 , H01L23/49575 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/06135 , H01L2224/06136 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48471 , H01L2224/48599 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/78 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2224/92247 , H01L2224/95 , H01L2224/97 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/12041 , H01L2924/1532 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/01026 , H01L2224/48227 , H01L2924/3512 , H01L2924/00012
摘要： Two semiconductor chips are bonded to each other with the rear surfaces of the respective semiconductor chips faced to each other, so that two longer sides of the semiconductor chips may confront the side of leads, and supporting leads are bonded and fixed onto the circuit forming surface of one of the semiconductor chips. The semiconductor chips are further bonded to each other in a state where the positions of the respective semiconductor chips are staggered relative to each other so that electrodes of one semiconductor chip may lie outside the other longer side of the other semiconductor chip, and that electrodes of the second semiconductor chip may lie outside the other longer side of the first semiconductor chip.
摘要翻译： 两个半导体芯片彼此接合，各半导体芯片的后表面彼此面对，使得半导体芯片的两个较长的侧面可以面对引线的侧面，并且支撑引线被接合并固定到电路形成表面 的其中一个半导体芯片。 半导体芯片在各半导体芯片的位置相对于彼此交错的状态下进一步接合，使得一个半导体芯片的电极可以位于另一半导体芯片的另一个较长侧的外侧，并且， 第二半导体芯片可以位于第一半导体芯片的另一长边的外侧。
-
公开(公告)号：US07214622B2
公开(公告)日：2007-05-08
申请号：US11187981
申请日：2005-07-25
IPC分类号： H01L21/302
CPC分类号： H01L24/32 , H01L21/563 , H01L23/49838 , H01L24/16 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/114 , H01L2224/116 , H01L2224/1181 , H01L2224/1182 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/27013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/8114 , H01L2224/81193 , H01L2224/81203 , H01L2224/81208 , H01L2224/81801 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H05K1/111 , H05K3/3436 , H05K3/3484 , H05K2201/09781 , H05K2201/10674 , H05K2203/043 , H05K2203/046 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In the assembly of a semiconductor device, improvement in the reliability of flip chip bonding is aimed at. By forming a dummy terminal in the end portion of the row of a plurality of terminals for a flip chip in the package substrate, the flow of flux or solder can be suppressed with the dummy terminal, and a solder layer can be formed on the plurality of terminals for a flip chip. Thereby, the thickness of the solder layer formed on each terminal for a flip chip can fully be secured, without making solder adhere to the wire connection terminal closely formed to the terminal for a flip chip. As a result, improvement in the reliability of flip chip bonding can be aimed at.
摘要翻译： 在半导体器件的组装中，针对倒装芯片接合的可靠性的提高。 通过在封装衬底中用于倒装芯片的多个端子的端部的端部中形成虚拟端子，可以通过虚拟端子来抑制焊剂或焊料的流动，并且可以在多个端子上形成焊料层 的倒装芯片的端子。 由此，可以完全确保形成在倒装芯片的各个端子上的焊料层的厚度，而不会使焊料粘附到与倒装芯片的端子紧密形成的导线连接端子。 结果，可以针对倒装芯片接合的可靠性的提高。
-
公开(公告)号：US20060030075A1
公开(公告)日：2006-02-09
申请号：US11187981
申请日：2005-07-25
IPC分类号： H01L21/48
CPC分类号： H01L24/32 , H01L21/563 , H01L23/49838 , H01L24/16 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/114 , H01L2224/116 , H01L2224/1181 , H01L2224/1182 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/27013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/8114 , H01L2224/81193 , H01L2224/81203 , H01L2224/81208 , H01L2224/81801 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H05K1/111 , H05K3/3436 , H05K3/3484 , H05K2201/09781 , H05K2201/10674 , H05K2203/043 , H05K2203/046 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In the assembly of a semiconductor device, improvement in the reliability of flip chip bonding is aimed at. By forming a dummy terminal in the end portion of the row of a plurality of terminals for a flip chip in the package substrate, the flow of flux or solder can be suppressed with the dummy terminal, and a solder layer can be formed on the plurality of terminals for a flip chip. Thereby, the thickness of the solder layer formed on each terminal for a flip chip can fully be secured, without making solder adhere to the wire connection terminal closely formed to the terminal for a flip chip. As a result, improvement in the reliability of flip chip bonding can be aimed at.
摘要翻译： 在半导体器件的组装中，针对倒装芯片接合的可靠性的提高。 通过在封装衬底中用于倒装芯片的多个端子的端部的端部中形成虚拟端子，可以通过虚拟端子来抑制焊剂或焊料的流动，并且可以在多个端子上形成焊料层 的倒装芯片的端子。 由此，可以完全确保形成在倒装芯片的各个端子上的焊料层的厚度，而不会使焊料粘附到与倒装芯片的端子紧密形成的导线连接端子。 结果，可以针对倒装芯片接合的可靠性的提高。
-
公开(公告)号：US08084869B2
公开(公告)日：2011-12-27
申请号：US12478837
申请日：2009-06-05
IPC分类号： H01L23/29
CPC分类号： H01L23/49838 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48229 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81801 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/112 , H05K3/4652 , H05K2201/09227 , H05K2201/099 , H05K2201/10734 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A technique permitting the reduction in size of a semiconductor device is provided. In a BGA type semiconductor device with a semiconductor chip flip-chip-bonded onto a wiring substrate, bump electrodes of the semiconductor chip are coupled to lands formed at an upper surface of the wiring substrate. The lands at the upper surface of the wiring substrate are coupled electrically to solder balls formed on a lower surface of the wiring substrate. Therefore, the lands include first type lands with lead-out lines coupled thereto and second type lands with lead-out lines not coupled thereto but with vias formed just thereunder. The lands are arrayed in six or more rows at equal pitches in an advancing direction of the rows. However, a row-to-row pitch is not made an equal pitch. In land rows which are likely to cause a short-circuit, the pitch between adjacent rows is made large, while in land rows which are difficult to cause a short-circuit, the pitch between adjacent rows is made small. By so doing, both prevention of a short-circuit and improvement of the layout density of lands are attained at a time.
摘要翻译： 提供了允许半导体器件的尺寸减小的技术。 在具有倒装芯片接合在布线基板上的半导体芯片的BGA型半导体器件中，半导体芯片的突起电极被耦合到在布线基板的上表面上形成的焊盘。 布线基板的上表面的焊盘电连接到形成在布线基板的下表面上的焊球。 因此，焊盘包括具有与其耦合的引出线的第一类型的焊盘和没有耦合到其上的导出线，但是具有刚好形成的通孔的第二类型的焊盘。 焊盘沿着行的前进方向以等间距排列成六行或更多行。 然而，行到行间距不是相等的音高。 在可能导致短路的陆地列中，相邻行之间的间距变大，而在难以引起短路的陆地行中，相邻行之间的间距变小。 通过这样做，一次可以实现防止短路的改善和布局密度的提高。
-
公开(公告)号：US20110227234A1
公开(公告)日：2011-09-22
申请号：US13153384
申请日：2011-06-03
申请人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： H01L23/49
CPC分类号： G06K19/077 , G06K19/07732 , H01L24/06 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed.
摘要翻译： 多功能卡装置具有连接到接口控制器和外部连接端子的外部连接端子，接口控制器，存储器和安全控制器。 接口控制器具有多个接口控制模式，并且根据来自外部的指令通过控制模式来控制外部接口动作和存储器接口动作。 外部连接端子具有针对每个接口控制模式个性化的单个端子，以及共用公共端子。 公共端子包括时钟输入端子，电源端子和接地端子。 数据终端和安全控制器的专用终端包括在各个终端中。 外部连接终端的部分共享和个性化可以保证接口的可靠性，并且可以通过某种接口控制模式来增加对物理量的控制。 安全控制器独立接口的安全过程也可以保证。
-
公开(公告)号：US08021932B2
公开(公告)日：2011-09-20
申请号：US12430277
申请日：2009-04-27
IPC分类号： H01L21/00
CPC分类号： H01L23/49838 , H01L21/563 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/814 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2224/05599 , H01L2224/05099
摘要： To provide a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of the wiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device.
摘要翻译： 提供具有改善的可靠性的半导体器件。 半导体器件包括布线板，通过金凸块接合在布线板上的微计算机芯片倒装芯片，叠置在微计算机芯片上的第一存储芯片，用于将第一存储器芯片耦合到布线板的导线，用于将第一存储器芯片耦合到布线板的底部填充材料， 填充微型计算机芯片的倒装芯片连接部分，以及用树脂密封微型计算机芯片和第一存储器芯片的密封构件。 此外，在对底部填充材料充电时，对应于排气侧的芯片的角部的布线板的阻焊膜的第二开口部分的角部靠近微型计算机芯片，这可以提高润湿性和扩展 的第二开口部分的底部填充材料，从而减少了引线到第二开口部分的暴露，从而提高了半导体器件的可靠性。
-
-
-
-
-
-
-
-
-
搜索结果
71 条记录 (耗时 0.035 秒)
