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    Methods and apparatus for full-wafer test and burn-in mechanism
    1.
    发明申请
    Methods and apparatus for full-wafer test and burn-in mechanism 有权
    全晶圆测试和老化机制的方法和设备

    公开(公告)号：US20080074135A1

    公开(公告)日：2008-03-27

    申请号：US11810950

    申请日：2007-06-06

    申请人： Morgan Johnson

    发明人： Morgan Johnson

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2863 ,  G01R31/2875

    摘要： Assemblies include a substrate, such as a printed circuit board, with a first array of contact pads disposed thereon; a guide ring structure disposed on the substrate and at least partially surrounding the first array of contact pads; a translator socket disposed on the first array of contact pads, the translator socket adapted to receive the tester side of a translated wafer; a thermally conductive, conformal, heat spreading cushion adapted to be disposed over the backside of a wafer; a cover plate adapted to fit over the first array of contact pads, align with the guide ring structure, contain within it the various components disposed over the first array of contact pads, and removably attach to the substrate; and a bolster plate adapted to removably attach to a second side of the substrate. In a further aspect a translated wafer is disposed over the translator socket such that the tester side of the translator is in contact with the translator socket; and the heat spreading cushion is disposed over the backside of the translated wafer. In a still further aspect, the substrate includes signal communication means, such as but not limited to, an edge connector adapted to couple to various controller circuits, which are typically disposed on a printed circuit board.

    摘要翻译： 组件包括衬底，例如印刷电路板，其上布置有第一阵列的接触焊盘; 引导环结构，其设置在所述基板上并且至少部分地围绕所述第一接触焊盘阵列; 设置在所述第一接触焊盘阵列上的转换器插座，所述转换器插座适于接收翻译的晶片的测试器侧; 适于设置在晶片的背面上方的导热的，共形的散热垫; 适于装配在所述第一接触焊盘阵列上的盖板，与所述引导环结构对准，在其中包含设置在所述第一接触焊盘阵列上的各种部件，并且可移除地附接到所述衬底; 以及适于可移除地附接到所述基底的第二侧的垫板。 在另一方面，翻译的晶片设置在翻译器插座上方，使得翻译器的测试器侧与翻译器插座接触; 并且散热垫设置在翻译的晶片的背面上。 在另一方面，衬底包括信号通信装置，例如但不限于适于耦合到通常设置在印刷电路板上的各种控制器电路的边缘连接器。

    Methods and apparatus for planar extension of electrical conductors beyond the edges of a substrate
    2.
    发明申请
    Methods and apparatus for planar extension of electrical conductors beyond the edges of a substrate 有权
    电导体平面延伸超过衬底边缘的方法和装置

    公开(公告)号：US20080018341A1

    公开(公告)日：2008-01-24

    申请号：US11825567

    申请日：2007-07-06

    申请人： Morgan Johnson

    发明人： Morgan Johnson

    IPC分类号： G01R31/00

    CPC分类号： G01R1/07342 ,  G01R31/2886

    摘要： Concurrent electrical access to the pads of integrated circuits on a wafer is provided by an edge-extended wafer translator that carries signals from one or more pads on one or more integrated circuits to contact terminals on the inquiry-side of the edge-extended wafer translator, including portions of the inquiry-side that are superjacent the wafer when the wafer and the edge-extended wafer translator are in a removably attached state, and portions of the inquiry side that reside outside a region defined by the intersection of the wafer and the edge-extended wafer translator. In a further aspect of the present invention, access to the pads of integrated circuits on a wafer is additionally provided by contact terminals in a second inquiry area located on the wafer-side of the edge-extended wafer translator in a region thereof bounded by its outer circumference and the circumference of the attached wafer.

    摘要翻译： 通过边缘扩展晶片转换器提供对晶片上的集成电路的焊盘的并发电接口，其将信号从一个或多个集成电路上的一个或多个焊盘传送到边缘扩展晶片转换器的查询侧的接触端子 包括当晶片和边缘延伸晶片转换器处于可移除地附接状态时位于晶片上方的询问侧的部分以及位于由晶片和边缘延伸晶片转换器的相交处限定的区域之外的查询侧的部分 边缘延伸晶片转换器。 在本发明的另一方面，在位于边缘延伸晶片转换器的晶片侧的第二查询区域中的接触端子附加地提供对晶片上的集成电路焊盘的访问，该区域由其边界 外圆周和圆周。

    Selective application of conductive material to circuit boards by pick and place
    3.
    发明申请
    Selective application of conductive material to circuit boards by pick and place 失效
    导电材料通过拾取和放置选择性地应用于电路板

    公开(公告)号：US20050035462A1

    公开(公告)日：2005-02-17

    申请号：US10917029

    申请日：2004-08-11

    申请人： Morgan Johnson

    发明人： Morgan Johnson

    IPC分类号： H05K3/02 ,  H05K3/34 ,  H05K3/40 ,  H01L29/74

    CPC分类号： H05K3/4015 ,  H05K3/027 ,  H05K3/341 ,  H05K2203/0191 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/12514

    摘要： A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a first electrically conductive material disposed over a second electrically conductive material, and a soluble tape backing disposed over and attached to the second electrically conductive material. The component may be attached to a circuit board by solder relow, after which the soluble tape backing is removed. Although typical embodiments involve electrically conductive materials, it is noted that an electrically insulating material can also be disposed over and attached to an underlying material which itself is disposed on a circuit board.

    摘要翻译： 用于制造电路板（例如印刷电路板或柔性基板）的部件适于与拾取和放置设备一起使用，以提供设置在第二材料基层上的第一材料覆盖层。 这样的部件可以包括设置在第二导电材料上的第一导电材料和设置在第二导电材料上并附着到第二导电材料上的可溶性带背。 组件可以通过焊料回流连接到电路板，然后除去可溶性胶带背衬。 虽然典型的实施例涉及导电材料，但应注意的是，电绝缘材料也可以设置在本身设置在电路板上的下层材料上并附着于其上。

    Cable and connector assemblies and methods of making same
    4.
    发明申请
    Cable and connector assemblies and methods of making same 审中-公开
    电缆和连接器组件及其制造方法

    公开(公告)号：US20050009415A1

    公开(公告)日：2005-01-13

    申请号：US10855070

    申请日：2004-05-26

    申请人： Morgan Johnson

    发明人： Morgan Johnson

    IPC分类号： H01R12/06 ,  H01R12/16 ,  H01R13/514 ,  H01R12/24 ,  H01R4/02

    CPC分类号： H01R12/523 ,  H01R12/7082 ,  H01R13/514 ,  H01R13/6588 ,  H01R13/6598

    摘要： Cable and connector assemblies in which one or more conductors have transmission line characteristics, and methods of producing such assemblies include providing a body with openings therethrough, providing a conductive ground shield, at least at the inner surface of the openings, disposing at least one conductor through at least one opening, and disposing mechanical support means for positioning the at least one conductor within the at least one opening. The body may include structures for attaching the mechanical support means thereto. The body may be highly conductive so as to form the ground shield, or conductive inserts, or conductive coatings may be provided along the inner surface of the openings. The body may be formed from a unitary piece, or may be formed from a stack of slices. Alternatively, the body may be formed from a printed circuit board having plated-through holes. The body may act as a heat sink.

    摘要翻译： 其中一个或多个导体具有传输线特征的电缆和连接器组件以及制造这种组件的方法包括提供主体穿过其中的开口，至少在开口的内表面处提供导电接地屏蔽，设置至少一个导体 通过至少一个开口，以及布置用于将所述至少一个导体定位在所述至少一个开口内的机械支撑装置。 主体可以包括用于将机械支撑装置附接到其上的结构。 主体可以是高导电性的，以便形成接地屏蔽，或者可以沿着开口的内表面设置导电插入件或导电涂层。 主体可以由整体构成，或者可以由一叠切片形成。 或者，主体可以由具有电镀通孔的印刷电路板形成。 身体可以作为散热器。

    Method of making electrical circuitry
    5.
    发明授权
    Method of making electrical circuitry 失效
    制造电路的方法

    公开(公告)号：US4720470A

    公开(公告)日：1988-01-19

    申请号：US847935

    申请日：1986-04-03

    申请人： Morgan Johnson

    发明人： Morgan Johnson

    IPC分类号： H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H01L21/22

    CPC分类号： H05K3/326 ,  H01L23/5382 ,  H05K1/0287 ,  H01L2924/0002 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/175 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/4611 ,  Y10S438/94

    摘要： Electrical circuitry 32 is comprised of a plurality of layers 30, 100, each layer 30, 100 including one or more electrical pathways 36, 38, each layer 30, 100 also including insulation 34 for insulating at least part of one layer 30 from another layer 100. The pathways 36, 38 comprise repeating patterns 40, 42. Each pathway 36, 38 of each layer 30, 100 can communicate with the pathways 36, 38 of the next adjacent layers 30, 100. Some portions of the patterns 40, 42 which comprise the pathways 36, 38 of each layer 30, 100 can be at least partially aligned with some portion of the patterns 40, 42 of pathways 36, 38 of the other layers 30, 100. Other portions of the pathways 36, 38 of the layers 30, 100 remain unaligned. A pulse laser 134 can be used to sever unaligned portions of the pathways 36, 38 as appropriate to create the desired electrical circuitry 32. Components can be secured to the electrical circuitry as required. Further, such circuitry can be used in the construction of the final metallization layers of chips such as gate arrays.

    摘要翻译： 电路32由多个层30,100组成，每个层30,100包括一个或多个电通路36,38，每个层30,100还包括绝缘层34，用于将一层30的至少一部分与另一层 路径36,38包括重复图案40,42。每个层30,100的每个路径36,38可以与下一相邻层30,100的路径36,38连通。图案40,42的某些部分 其包括每个层30,100的通路36,38可以至少部分地与其它层30,100的通路36,38的图案40,42的一些部分对准。通路36,38的其他部分 层30,100保持不对齐。 可以使用脉冲激光器134来适当地切断通路36,38的未对准部分以产生所需的电路32.组件可以根据需要固定到电路。 此外，这种电路可用于构建诸如门阵列的芯片的最终金属化层。

    Electrical circuitry
    7.
    发明授权
    Electrical circuitry 失效
    电路

    公开(公告)号：US4700214A

    公开(公告)日：1987-10-13

    申请号：US53607

    申请日：1987-05-20

    申请人： Morgan Johnson

    发明人： Morgan Johnson

    IPC分类号： H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H05K3/08

    CPC分类号： H05K3/326 ,  H01L23/5382 ,  H05K1/0287 ,  H01L2924/0002 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/175 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/4611

    摘要： Electrical circuitry 32 is comprised of a plurality of layers 30, 100, each layer 30, 100 including one or more electrical pathways 36, 38, each layer 30, 100 also including insulation 34 for insulating at least part of one layer 30 from another layer 100. The pathways 36, 38 comprise repeating patterns 40, 42. Each pathway 36, 38 of each layer 30, 100 can communicate with the pathways 36, 38 of the next adjacent layers 30, 100. Some portions of the patterns 40, 42 which comprise the pathways 36, 38 of each layer 30, 100 can be at least partially aligned with some portion of the patterns 40, 42 of pathways 36, 38 of the other layers 30, 100. Other portions of the pathways 36, 38 of the layers 30, 100 remain unaligned. A pulse laser 134 can be used to sever unaligned portions of the pathways 36, 38 as appropriate to create the desired electrical circuitry 32. Components can be secured to the electrical circuitry as required. Further, such circuitry can be used in the construction of the final metallization layers of chips such as gate arrays.

    摘要翻译： 电路32由多个层30,100组成，每个层30,100包括一个或多个电通路36,38，每个层30,100还包括绝缘层34，用于将一层30的至少一部分与另一层 路径36,38包括重复图案40,42。每个层30,100的每个路径36,38可以与下一相邻层30,100的路径36,38连通。图案40,42的某些部分 其包括每个层30,100的通路36,38可以至少部分地与其它层30,100的通路36,38的图案40,42的一些部分对准。通路36,38的其他部分 层30,100保持不对齐。 可以使用脉冲激光器134来适当地切断通路36,38的未对准部分以产生所需的电路32.组件可以根据需要固定到电路。 此外，这种电路可用于构建诸如门阵列的芯片的最终金属化层。