公开(公告)号：US07062699B2

公开(公告)日：2006-06-13

申请号：US10320739

申请日：2002-12-17

申请人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu ,  Young-im Ju

发明人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu ,  Young-im Ju

IPC分类号： G11B7/07 ,  H03M13/05

CPC分类号： G11B20/18 ,  G11B7/00745 ,  G11B7/24085 ,  G11B20/1217 ,  G11B27/24 ,  G11B2020/1222 ,  G11B2020/1269 ,  G11B2220/215 ,  G11B2220/216 ,  G11B2220/218 ,  G11B2220/2545 ,  G11B2220/2562 ,  G11B2220/2566 ,  G11B2220/257 ,  G11B2220/2575

摘要： Provided is a method of recording data on an optical recording medium having a plurality of addressable unit areas. 62 sync frames, each having a sync code and data, can be recorded in each of the addressable unit areas. Thus, user data can be recorded on a recordable optical disc at a higher density.

公开(公告)号：US07564122B2

公开(公告)日：2009-07-21

申请号：US11365246

申请日：2006-03-01

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07370262B2

公开(公告)日：2008-05-06

申请号：US10766907

申请日：2004-01-30

申请人： Sung-hee Hwang ,  Hyun-jeong Park ,  Joo-seon Kim ,  Sang-hyun Ryu

发明人： Sung-hee Hwang ,  Hyun-jeong Park ,  Joo-seon Kim ,  Sang-hyun Ryu

IPC分类号： H03M13/00

CPC分类号： H03M13/29 ,  G11B20/1833 ,  G11B20/1866 ,  G11B27/3027 ,  G11B2020/1288 ,  G11B2220/2541 ,  G11B2220/2545 ,  G11B2220/2562 ,  H03M13/293

摘要： An error flag generation apparatus and method for error correction, wherein the apparatus includes: a frame-sync error memory which stores frame-sync error information for each data block; a BIS (Burst Indicator Subcode) error flag memory which stores a BIS error flag for each data block; and an error flag generator, which generates an error flag indicating error existence/absence for ECC (Error-Correction Coding) data with reference to the frame-sync error information stored in the frame-sync error memory and the BIS error flag stored in the BIS error flag memory.

摘要翻译： 一种用于纠错的错误标志生成装置和方法，其中该装置包括：帧同步错误存储器，用于存储每个数据块的帧同步错误信息; BIS（突发指示符子代码）错误标志存储器，用于存储每个数据块的BIS错误标志; 以及错误标志生成器，其参考存储在帧同步错误存储器中的帧同步错误信息和存储在帧同步错误存储器中的BIS错误标志，生成指示ECC（错误校正编码）数据的错误存在/不存在的错误标志 BIS错误标志内存。

公开(公告)号：US07174496B2

公开(公告)日：2007-02-06

申请号：US10335859

申请日：2003-01-03

申请人： Sung-hyu Han ,  Yoon-woo Lee ,  Sang-hyun Ryu ,  Young-im Ju ,  Sung-hee Hwang

发明人： Sung-hyu Han ,  Yoon-woo Lee ,  Sang-hyun Ryu ,  Young-im Ju ,  Sung-hee Hwang

IPC分类号： G11C29/00 ,  H03M13/00

CPC分类号： H03M13/05 ,  G11B20/1833 ,  H03M13/1515 ,  H03M13/29 ,  H03M13/2903 ,  H03M13/2909

摘要： An apparatus, method, and an optical storage medium to generate an error correction block include a data block generation unit processing digital data on a byte-by-byte basis and arranging the processed digital data from 0th to (N−1)th columns and from 0th to (M−1)th rows to form (M×N) data blocks. A matrix block generation unit arranges the (M×N) data blocks in K rows according to a data transmission sequence to form a matrix block. A first codeword generation unit adds a first error correction check word of 2×K bytes to each of N columns to form a first codeword of ((K×M)+2×K) bytes. A second codeword generation unit adds a second error correction check word of P bytes to each of ((K×M)+2×K) rows to form a second codeword of (N+P) bytes.

摘要翻译： 用于产生纠错块的装置，方法和光学存储介质包括数据块生成单元，以逐个字节为基础处理数字数据，并将处理后的数字数据从0 排列到 （N-1）^{列和从0 到（M-1）个第行以形成（M×N）个数据块。 矩阵块生成单元根据数据发送序列将（M×N）个数据块排列成K行，形成矩阵块。 第一码字生成单元向N列中的每一个添加2K字节的第一纠错校验字，以形成（（KxM）+ 2xK）字节的第一码字。 第二码字生成单元向（（K×M）+ 2xK）行中的每一个添加P字节的第二纠错校验字，以形成（N + P）字节的第二码字。}

公开(公告)号：US07159165B2

公开(公告)日：2007-01-02

申请号：US10022826

申请日：2001-12-20

申请人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu

发明人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu

IPC分类号： G11C29/00 ,  H03M13/00

CPC分类号： G11B20/12 ,  G11B20/1866

摘要： An optical recording medium, a data recording or reproducing apparatus, and a data recording or reproducing method used by the data recording or reproducing apparatus. In a method of recording data on an optical disc, each of a plurality of error correction code (ECC) blocks is divided into a plurality of partitions. Next, data from the partitions is interleaved so that each of the ECC blocks is alternately and equally selected to generate a recording block. The generated recording block is modulated and recorded on an optical disc. As a result, the optical recording medium, the data recording apparatus, and the data recording method used by the apparatus are compatible with the format of a conventional digital versatile disc (DVD) and have higher error correction rates. In a reproducing method, the recording block is deinterleaved.

摘要翻译： 光记录介质，数据记录或再现装置以及由数据记录或再现装置使用的数据记录或再现方法。 在光盘上记录数据的方法中，多个纠错码（ECC）块中的每一个被分成多个分区。 接下来，来自分区的数据被交织，使得每个ECC块被交替地和等同地选择以产生记录块。 所生成的记录块被调制并记录在光盘上。 结果，该装置使用的光记录介质，数据记录装置和数据记录方法与常规数字通用盘（DVD）的格式兼容，并具有更高的纠错率。 在再现方法中，记录块被解交织。

公开(公告)号：US07145251B2

公开(公告)日：2006-12-05

申请号：US11038756

申请日：2005-01-19

申请人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L29/80

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US07137045B2

公开(公告)日：2006-11-14

申请号：US10347524

申请日：2003-01-21

申请人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu ,  Young-im Ju

发明人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu ,  Young-im Ju

IPC分类号： G06F11/00

CPC分类号： H04L1/0082 ,  G11B20/1833 ,  H03M13/47 ,  H04L1/0057

摘要： A decoding method and an apparatus operate by performing error correction on code words of an error correcting code block in one direction selected from a row direction and a column direction, indicating in error flags the remaining code words except at least some code words from code words having uncorrectable errors, and performing error correction on code words in the other direction based on the error flags. Accordingly, errors that have been conventionally considered as being uncorrectable may now be corrected.

公开(公告)号：US20060218464A1

公开(公告)日：2006-09-28

申请号：US11430905

申请日：2006-05-10

申请人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu

发明人： Sung-hee Hwang ,  Yoon-woo Lee ,  Sung-hyu Han ,  Sang-hyun Ryu

IPC分类号： H03M13/00

CPC分类号： H03M13/2909 ,  G11B20/10 ,  G11B20/1217 ,  G11B20/18 ,  G11B20/1833 ,  G11B20/1866 ,  G11B2020/1222 ,  G11B2020/1295 ,  G11B2220/2537 ,  H03M13/1515 ,  H03M13/27

摘要： An optical information recording medium, a data recording apparatus, a data recording method used by the recording apparatus, and a data reproducing apparatus are provided, in which the optical information recording medium includes data provided in one or more recording blocks. A recording block of the optical information recording medium is generated by alternately arranging identifiers from ones of error correction code (ECC) blocks in the recording block, wherein each ECC block comprises a plurality of sectors having corresponding identifiers.

摘要翻译： 光学信息记录介质，数据记录装置，由记录装置使用的数据记录方法和数据再现装置，其中光学信息记录介质包括设置在一个或多个记录块中的数据。 通过从记录块中的纠错码（ECC）块中的标识符交替排列来生成光信息记录介质的记录块，其中每个ECC块包括具有相应标识符的多个扇区。

公开(公告)号：US07057280B2

公开(公告)日：2006-06-06

申请号：US10667227

申请日：2003-09-18

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/04

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07317245B1

公开(公告)日：2008-01-08

申请号：US11279002

申请日：2006-04-07

申请人： Kyu Won Lee ,  Chan Yok Park ,  Sang Hyun Ryu

发明人： Kyu Won Lee ,  Chan Yok Park ,  Sang Hyun Ryu

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L21/486 ,  H01L2924/0002 ,  H05K3/243 ,  H05K3/28 ,  H05K3/323 ,  H05K3/429 ,  H05K2201/0352 ,  H05K2203/054 ,  H05K2203/0542 ,  H05K2203/1394 ,  H05K2203/1581 ,  H01L2924/00

摘要： Disclosed is a method for manufacturing a semiconductor device substrate. A substrate having no bus line and lead-in line is efficiently manufactured. In a step needing an electroplating process, conductive film is temporarily attached to circuit patterns in order to electrically connect all circuit patterns. A plating is formed in desired regions of the circuit patterns with a predetermined thickness in an electroplating method. The conductive film is completely removed while the substrate is manufactured so that the circuit patterns are electrically independent of one another, and the resulting substrate has no bus line and lead-in line.

摘要翻译： 公开了半导体器件基板的制造方法。 没有总线和引入线的基板被有效地制造。 在需要电镀工艺的步骤中，导电膜临时连接到电路图案上，以便电连接所有电路图案。 在电镀方法中以预定的厚度在电路图案的期望区域中形成电镀。 在制造基板时，导电膜被完全去除，使得电路图案彼此电独立，并且所得到的基板没有总线和引入线。