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公开(公告)号:US08595504B2
公开(公告)日:2013-11-26
申请号:US12190238
申请日:2008-08-12
申请人: Shih-I Huang , Shiuh-Pyng Shieh , Sheng-Ming Chang , Chi-Wei Wang
发明人: Shih-I Huang , Shiuh-Pyng Shieh , Sheng-Ming Chang , Chi-Wei Wang
IPC分类号: H04L9/00
CPC分类号: H04L9/3236 , H04L9/3247 , H04L2209/805
摘要: A method for authenticating a message in a network is provided. The method includes a step of generating, in a sink device, a private key and a public key. The private key includes a plurality of sub-private keys. The method further includes a step of generating, in the sink device, a signature for the message. The signature includes a sub-private key and an authentication path associated with the sub-private key in a hash tree. The hash tree is constructed during the generation of the sub-public keys.
摘要翻译: 提供了一种用于在网络中验证消息的方法。 该方法包括在宿设备中生成私钥和公钥的步骤。 私钥包括多个子私钥。 该方法还包括在宿设备中生成消息的签名的步骤。 签名包括子私钥和与散列树中的子私钥相关联的认证路径。 在生成子公钥期间构建散列树。
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公开(公告)号:US08258615B2
公开(公告)日:2012-09-04
申请号:US12389388
申请日:2009-02-20
申请人: Sheng-Ming Chang , Che-Yuan Jao , Ching-Chih Li
发明人: Sheng-Ming Chang , Che-Yuan Jao , Ching-Chih Li
IPC分类号: H01L23/498
CPC分类号: H01L23/642 , H01L23/3114 , H01L23/367 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L25/0657 , H01L2224/48091 , H01L2224/73215 , H01L2924/00014 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3011 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: The present invention provides a semiconductor device capable of eliminating voltage (IR) drop of a semiconductor die inside the semiconductor device and a fabricating method of the semiconductor device. The semiconductor device comprises the semiconductor die, and the semiconductor die comprises a first surface area, a plurality of first pads potentially equivalent to each other, a passivation layer, a plurality of first openings, and a first conducting medium layer. The passivation layer is disposed on the plurality of first pads. The plurality of first openings is formed on the passivation layer, and utilized for exposing the plurality of first pads. The first conducting medium layer is formed on the first surface area, and utilized for fulfilling the plurality of first openings to connect the plurality of first pads.
摘要翻译: 本发明提供能够消除半导体器件内的半导体管芯的电压(IR)下降的半导体器件以及半导体器件的制造方法。 半导体器件包括半导体管芯,并且半导体管芯包括第一表面区域,潜在地相当于彼此的多个第一焊盘,钝化层,多个第一开口和第一导电介质层。 钝化层设置在多个第一焊盘上。 多个第一开口形成在钝化层上,并用于暴露多个第一焊盘。 第一导电介质层形成在第一表面区域上,用于实现多个第一开口以连接多个第一焊盘。
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公开(公告)号:US20100171211A1
公开(公告)日:2010-07-08
申请号:US12350208
申请日:2009-01-07
申请人: Che-Yuan Jao , Sheng-Ming Chang
发明人: Che-Yuan Jao , Sheng-Ming Chang
IPC分类号: H01L23/488
CPC分类号: H01L24/06 , H01L23/50 , H01L23/552 , H01L24/05 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48139 , H01L2224/48145 , H01L2224/48147 , H01L2224/48463 , H01L2224/4847 , H01L2224/4911 , H01L2224/49111 , H01L2224/85399 , H01L2225/06506 , H01L2225/06527 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01076 , H01L2924/01077 , H01L2924/01082 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor device is provided by the present invention. The semiconductor device includes a semiconductor die, and the semiconductor die includes a die core having at least two bond pads with voltage level equivalent to each other and electrically connected to each other via at least a bond wire, and an input/output (I/O) periphery. The semiconductor device of the present invention is capable of solving the IR drop of the semiconductor die with low cost.
摘要翻译: 本发明提供一种半导体器件。 所述半导体器件包括半导体管芯,并且所述半导体管芯包括具有至少两个接合焊盘的芯片,所述至少两个接合焊盘的电压水平彼此相等并且至少通过接合线彼此电连接,以及输入/输出(I / O)周边。 本发明的半导体器件能够以低成本解决半导体管芯的IR下降。
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公开(公告)号:US20090174157A1
公开(公告)日:2009-07-09
申请号:US12008022
申请日:2008-01-08
申请人: Sheng Ming Chang
发明人: Sheng Ming Chang
CPC分类号: B25B15/001 , B25B23/0064 , B25B23/12 , Y10T279/17 , Y10T279/17931 , Y10T279/23
摘要: A tool connecting device includes a mandrel having a non-circular engaging hole for receiving a tool member, and having an outer peripheral recess for forming a peripheral shoulder, and a sleeve slidably engaged onto the mandrel and having a retaining ring frictionally engaged in the sleeve for slidably engaging with the peripheral recess of the mandrel and for limiting the sleeve to slide relative to the mandrel, the retaining ring is engageable with the peripheral shoulder of the mandrel for preventing the sleeve from being disengaged from the mandrel, and the tool member is extendible out of the sleeve for engaging with a fastener. The sleeve may limit the tool member to extend out of the sleeve.
摘要翻译: 工具连接装置包括具有非圆形接合孔的心轴,用于容纳工具构件,并且具有用于形成周边肩部的外周凹槽,以及可滑动地接合到心轴上并具有与套筒摩擦接合的保持环的套筒 为了与心轴的周边凹部可滑动地接合并且用于限制套筒相对于心轴滑动,保持环可与心轴的周边肩部接合,以防止套筒与心轴脱离,并且工具构件是 可延伸出套筒以与紧固件接合。 套筒可能限制工具构件伸出套筒。
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公开(公告)号:US06931967B1
公开(公告)日:2005-08-23
申请号:US10788554
申请日:2004-02-26
申请人: Sheng-Ming Chang
发明人: Sheng-Ming Chang
CPC分类号: B25B23/12 , B25B15/001
摘要: The present invention of a connecting shaft device for screws mainly comprises a sliding sleeve having a magnetic element disposed on the inner circumference of the front end, the sliding sleeve is then sleeved on a connecting shaft and can slide on it, the sliding distance is controlled by an elastic element, a slant groove and a groove, the structure is simple and can temporarily position a screw, hold the screw in locking position and at the same time can also control the depth of locking.
摘要翻译: 螺丝连接轴装置的本发明主要包括具有设置在前端内圆周上的磁性元件的滑动套筒,然后将滑动套筒套在连接轴上并可在其上滑动,滑动距离被控制 通过弹性元件,倾斜槽和槽,结构简单,可以临时定位螺丝,将螺丝保持在锁定位置,同时还可以控制锁定深度。
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公开(公告)号:US08952718B2
公开(公告)日:2015-02-10
申请号:US13572143
申请日:2012-08-10
申请人: Yan-Bin Luo , Sheng-Ming Chang , Bo-Wei Hsieh , Ming-Shi Liou , Chih-Chien Hung , Shang-Ping Chen
发明人: Yan-Bin Luo , Sheng-Ming Chang , Bo-Wei Hsieh , Ming-Shi Liou , Chih-Chien Hung , Shang-Ping Chen
IPC分类号: H03K19/003 , H03K19/00 , G11C7/10 , G11C11/4093
CPC分类号: H03K19/0005 , G11C7/10 , G11C7/1048 , G11C7/1072 , G11C11/4093
摘要: A termination circuit for a plurality of memories controlled by a controller is provided. The termination circuit includes a plurality of drivers, a plurality of resistors and a plurality of capacitors. Each of the drivers is coupled to the memories via a transmission line. Each of the resistors is coupled to the corresponding driver via the corresponding transmission line. Each of the capacitors is coupled between the corresponding resistor and a reference voltage. The controller is coupled to the memories via the drivers, and the controller provides a specific code to one of the drivers when a quantity of logic “0” and a quantity of logic “1” transmitted to the memories via the transmission line corresponding to the one of the drivers are unbalanced, so as to adjust a termination voltage of the capacitor corresponding to the one of the drivers.
摘要翻译: 提供了一种由控制器控制的多个存储器的终端电路。 终端电路包括多个驱动器,多个电阻器和多个电容器。 每个驱动器经由传输线耦合到存储器。 每个电阻器经由相应的传输线耦合到相应的驱动器。 每个电容器耦合在相应的电阻器和参考电压之间。 控制器经由驱动器耦合到存储器,并且当经由对应于传输线的传输线传输到存储器的逻辑“0”和逻辑“1”的数量时,控制器向一个驱动器提供特定的代码 其中一个驱动器是不平衡的,以便调整与其中一个驱动器相对应的电容器的终端电压。
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公开(公告)号:US20110248394A1
公开(公告)日:2011-10-13
申请号:US13085446
申请日:2011-04-12
申请人: Nan-Jang Chen , Chun-Wei Chang , Sheng-Ming Chang , Che-Yuan Jao , Ching-Chih Li , Nan-Cheng Chen
发明人: Nan-Jang Chen , Chun-Wei Chang , Sheng-Ming Chang , Che-Yuan Jao , Ching-Chih Li , Nan-Cheng Chen
IPC分类号: H01L23/495
CPC分类号: H01L24/49 , H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L24/48 , H01L2224/05554 , H01L2224/48177 , H01L2224/48247 , H01L2224/49109 , H01L2224/49175 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.
摘要翻译: 半导体封装包括管芯焊盘; 安装在管芯焊盘上的半导体管芯; 沿着所述管芯焊盘的周缘设置的多个引线; 引线和芯片焊盘之间的接地棒; 以及将接地棒与管芯焊盘连接的多个桥,其中两个相邻桥之间的间隙具有等于或小于3mm的长度。
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公开(公告)号:US20110241206A1
公开(公告)日:2011-10-06
申请号:US13164779
申请日:2011-06-21
申请人: Che-Yuan Jao , Sheng-Ming Chang
发明人: Che-Yuan Jao , Sheng-Ming Chang
IPC分类号: H01L25/07 , H01L23/49 , H01L23/492
CPC分类号: H01L24/06 , H01L23/50 , H01L23/552 , H01L24/05 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48139 , H01L2224/48145 , H01L2224/48147 , H01L2224/48463 , H01L2224/4847 , H01L2224/4911 , H01L2224/49111 , H01L2224/85399 , H01L2225/06506 , H01L2225/06527 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01076 , H01L2924/01077 , H01L2924/01082 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor device is provided by the present invention. The semiconductor device includes a first semiconductor die comprising at least a first bond pad; and a second semiconductor die comprising at least a second bond pad with voltage level equivalent to the first bond pad of the first semiconductor die; wherein the first bond pad of the first semiconductor die is electrically connected to the second bond pad of the second semiconductor die via at least a bond wire. The semiconductor device of the present invention is capable of solving the IR drop of the semiconductor die with low cost.
摘要翻译: 本发明提供一种半导体器件。 半导体器件包括至少包括第一接合焊盘的第一半导体管芯; 以及第二半导体管芯,其包括至少第二接合焊盘,其具有与所述第一半导体管芯的所述第一接合焊盘相当的电压电平; 其中所述第一半导体管芯的所述第一接合焊盘至少通过接合线电连接到所述第二半导体管芯的所述第二接合焊盘。 本发明的半导体器件能够以低成本解决半导体管芯的IR下降。
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公开(公告)号:US20090139379A1
公开(公告)日:2009-06-04
申请号:US11998658
申请日:2007-11-30
申请人: Wen Hung Chiang , Sheng Ming Chang
发明人: Wen Hung Chiang , Sheng Ming Chang
IPC分类号: B25B23/00
CPC分类号: B25B23/0035 , B25B23/12
摘要: A driver tool includes a driver shank having a non-circular engaging hole formed in one end for changeably engaging with either of two end portions of a tool stem, and the end portions of the tool stem may be engaged with different tool members, a detent is slidably engaged in the driver shank for detachably anchoring the tool stem to the driver shank, a sleeve is slidably engaged onto the driver shank and biased by a biasing device for engaging with the detent and for selectively forcing the detent to engage with the tool stem and for detachably anchoring and securing the tool stem to the driver shank, and for allowing different tool members to be changeably rotated or driven by the driver shank.
摘要翻译: 驱动器工具包括:驱动柄,其具有形成在一端的非圆形接合孔,用于与工具杆的两个端部中的任一个可变地接合,并且工具杆的端部可与不同的工具构件接合, 可滑动地接合在驾驶员柄中,用于将工具杆可拆卸地固定到驾驶员柄上,套筒可滑动地接合到驾驶员柄上,并由偏置装置偏压以与制动器接合并且用于选择性地迫使制动器与工具杆 并且用于可拆卸地将工具杆锚定并固定到驾驶员柄上,并且用于允许不同的工具构件由驾驶员柄可变地旋转或驱动。
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公开(公告)号:US20090139378A1
公开(公告)日:2009-06-04
申请号:US11998585
申请日:2007-11-30
申请人: Wen Hung Chiang , Sheng Ming Chang
发明人: Wen Hung Chiang , Sheng Ming Chang
IPC分类号: B25B23/00
CPC分类号: B25B23/0035 , B25B23/12
摘要: A driver tool includes a driver shank having a non-circular engaging hole for engaging with a tool member, a sleeve slidably engaged onto the driver shank and limited to slide relative to the driver shank, and an adjusting device for adjusting the sleeve relative to the driver shank to limit and to determine a sliding movement of the sleeve relative to the driver shank or to determine the outwardly extending of the tool member relative to the sleeve for allowing the tool member to suitably drive the fastener and for preventing the fastener from being deeply driven or engaged into the work pieces or for preventing the fastener from being damaged by the tool member.
摘要翻译: 驾驶员工具包括具有用于与工具构件接合的非圆形接合孔的驾驶员柄,可滑动地接合到驾驶员柄上并被限制为相对于驾驶员柄滑动的套筒,以及用于相对于驾驶员柄调整套筒的调节装置 驾驶员柄限制并且确定套筒相对于驾驶员柄的滑动运动或确定工具构件相对于套筒的向外延伸,以允许工具构件适当地驱动紧固件并防止紧固件深入 驱动或接合到工件中或用于防止紧固件被工具构件损坏。
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