公开(公告)号：US09685394B2

公开(公告)日：2017-06-20

申请号：US13106933

申请日：2011-05-13

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： H01L33/62 ,  H01L21/28 ,  H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/13 ,  H01L2224/16146 ,  H01L2224/81 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.

公开(公告)号：US08758900B2

公开(公告)日：2014-06-24

申请号：US12801195

申请日：2010-05-27

申请人： Shigenobu Sekine ,  Yurina Sekine

发明人： Shigenobu Sekine ,  Yurina Sekine

IPC分类号： B22F1/00 ,  C01B33/02 ,  B22F9/08

CPC分类号： B22F9/06 ,  B22F1/0085 ,  B22F9/002 ,  B22F9/08 ,  B22F9/082 ,  B22F2009/084 ,  B22F2009/0844 ,  B22F2998/00 ,  B22F2998/10 ,  B22F2999/00 ,  C01G1/00 ,  C01P2002/60 ,  C01P2002/90 ,  C01P2004/32 ,  Y10T428/12181 ,  Y10T428/2982 ,  B22F2201/11 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2201/03 ,  B22F2201/30 ,  B22F9/10 ,  B22F2202/13

摘要： The present invention provides nanometer-size spherical particles. Each of the particles is made of at least one selected from the group consisting of a metal, an alloy, and a metal compound. The particles include one or both of a polycrystalline region and a single-crystalline region. The particles have a particle size of less than 1 μm; and a sphericity of −10% to +10%.

摘要翻译： 本发明提供了纳米尺寸的球形颗粒。 每个颗粒由选自金属，合金和金属化合物的至少一种制成。 颗粒包括多晶区域和单晶区域中的一个或两个。 颗粒的粒径小于1μm; 和球形度为-10％至+ 10％。

公开(公告)号：US08415784B2

公开(公告)日：2013-04-09

申请号：US12789590

申请日：2010-05-28

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Ryuji Kimura

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Ryuji Kimura

IPC分类号： H01L23/52 ,  H01L21/768 ,  H01L23/48

CPC分类号： H05K13/0465 ,  H01B3/025 ,  H01B3/10 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1131 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/812 ,  H01L2224/8181 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/8384

摘要： An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor.

摘要翻译： 电子设备包括多个堆叠的基板。 每个基板包括半导体基板，柱状导体和环形绝缘体。 柱状导体沿半导体衬底的厚度方向延伸。 环状绝缘体包括主要由玻璃构成的无机绝缘层。 无机绝缘层填充设置在半导体衬底中以围绕柱状导体的环形槽。

公开(公告)号：US08377565B2

公开(公告)日：2013-02-19

申请号：US13084847

申请日：2011-04-12

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： B22F7/00 ,  B32B15/01

CPC分类号： H01L21/76898 ,  H01L21/76882 ,  H01L2924/0002 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12632 ,  H01L2924/00

摘要： A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer.

摘要翻译： 填充材料包括支撑基底构件和金属层，所述金属层包括第一金属层和第二金属层，并且设置在所述支撑基底构件的一侧，所述第一金属层是纳米金属颗粒的聚集体， 具有能够在低于熔点的温度下熔化的膜厚度，所述第二金属层是具有比所述第一金属层低的熔点的金属颗粒的聚集体。

公开(公告)号：US20110284912A1

公开(公告)日：2011-11-24

申请号：US13106933

申请日：2011-05-13

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： H01L33/62 ,  H01L21/28

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/13 ,  H01L2224/16146 ,  H01L2224/81 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.

摘要翻译： 电子设备包括半导体衬底，绝缘材料填充层和垂直导体。 半导体衬底具有沿其厚度方向延伸的垂直孔。 绝缘材料填充层是填充在用于覆盖其内周的垂直孔中的环状层，并且包括主要由玻璃和纳米复合陶瓷组成的有机绝缘材料或无机绝缘材料。 纳米复合陶瓷在室温下的电阻率大于1014＆OHgr·cm，相对介电常数为4〜9。垂直导体是填充在被绝缘材料填充层包围的区域中的凝固金属体。

公开(公告)号：US20110140281A1

公开(公告)日：2011-06-16

申请号：US12943447

申请日：2010-11-10

申请人： Shigenobu SEKINE ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu SEKINE ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L25/50 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/0516 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/10135 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/16146 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method for manufacturing an electronic device, including a step of aligning and stacking a plurality of substrates, each of the plurality of substrates having a plurality of vertical conductors and magnetic films, the vertical conductors being directed along a thickness direction of the substrate and distributed in a row with respect to a substrate surface, the magnetic films being disposed in place on the substrate surface in a predetermined positional relationship with the vertical conductors, upon aligning the plurality of substrates, the electronic device manufacturing method including a step of applying an external magnetic field to produce a magnetic attractive force between the magnetic films of adjacent stacked substrates and align the vertical conductors by the magnetic attractive force.

摘要翻译： 一种电子装置的制造方法，其特征在于，包括：对准和堆叠多个基板的步骤，所述多个基板中的每一个具有多个垂直导体和磁性膜，所述垂直导体沿着所述基板的厚度方向引导并分布 相对于基板表面成一排地，在对准多个基板时，磁性膜以与垂直导体预定的位置关系被布置在基板表面上的适当位置，该电子设备制造方法包括施加外部 磁场，以在相邻堆叠的衬底的磁性膜之间产生磁吸引力，并通过磁吸引力对准垂直导体。

公开(公告)号：US07781382B2

公开(公告)日：2010-08-24

申请号：US11606897

申请日：2006-12-01

申请人： Shigenobu Sekine ,  Yurina Sekine

发明人： Shigenobu Sekine ,  Yurina Sekine

IPC分类号： C10M125/26 ,  C10M103/04 ,  C10M125/20

CPC分类号： C10M103/00 ,  C10M103/04 ,  C10M103/06 ,  C10M111/04 ,  C10M2201/053 ,  C10M2201/0613 ,  C10M2201/0623 ,  C10M2201/1006 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2210/04 ,  C10N2220/08 ,  C10N2220/082 ,  C10N2230/06 ,  C10N2240/02 ,  C10N2250/08 ,  C10N2250/10 ,  C10N2250/18 ,  Y10S977/724 ,  Y10S977/731 ,  Y10S977/778

摘要： There is provided a lubricant composition which includes: a first particle having a spherical shape having a diameter of 1 to 300 nm, having a Mohs hardness of 5 or more, at an amount of 0.01 to 40 weight %; and a second particle, having a diameter of 500 nm to 50 μm, having a Brinell hardness of 17 HB or less, at an amount of 0.01 to 40 weight %. The lubricant composition can form a bearing structure when the lubricant composition is subjected to an extreme pressure. The second particles are deformed into a retainer for the first particle.

摘要翻译： 提供一种润滑剂组合物，其包含：具有0.01〜40重量％的Mohs硬度为5以上的直径为1〜300nm的球状的第1粒子， 和第二颗粒，其直径为500nm至50μm，布氏硬度为17HB或更低，其量为0.01至40重量％。 当润滑剂组合物经受极压时，润滑剂组合物可以形成轴承结构。 第二颗粒变形成用于第一颗粒的保持器。

公开(公告)号：US06368551B1

公开(公告)日：2002-04-09

申请号：US09641136

申请日：2000-08-16

申请人： Shigenobu Sekine ,  Yuko Kawasaki ,  Yoshiki Kuwabara ,  Hiroji Sato ,  Minoru Narita ,  Kazushi Suzuki ,  Koichi Tono ,  Keiji Okada ,  Kenji Sakaguchi ,  Mitsuhisa Hirata

发明人： Shigenobu Sekine ,  Yuko Kawasaki ,  Yoshiki Kuwabara ,  Hiroji Sato ,  Minoru Narita ,  Kazushi Suzuki ,  Koichi Tono ,  Keiji Okada ,  Kenji Sakaguchi ,  Mitsuhisa Hirata

IPC分类号： B22F312

CPC分类号： H01F1/0577

摘要： The method for preparation of sintered permanent magnets according to the present invention comprises the steps of: mixing fully fine powder of a crystalline mother alloy for permanent magnet containing a rare-earth element, Fe and B as the essential components with fine powder of zinc oxide, compaction molding the resulted mixture in the presence of a magnetic field, sintering the compacted mixture in vacuum to cause generation of oxygen and metallic zinc by thermal decomposition of the zinc oxide; segregation of a part of metallic component in the mother alloy at the boundary and inside of the mother alloy crystal; formation of amorphous metallic oxide by forced oxidation of the segregated metal with the generated oxygen; crystallization of the amorphous metallic oxide; formation of an epitaxial junction between the crystallized metallic oxide and the mother alloy crystal; and evaporation of the metallic zinc into the vacuum, and quenching the sintered compact.

摘要翻译： 根据本发明的烧结永磁体的制备方法包括以下步骤：将含有稀土元素，Fe和B的永磁体的结晶母合金的完全细粉末作为必要成分与氧化锌的细粉末混合 在磁场存在下压制成型所得到的混合物，在真空中烧结压实的混合物，以通过氧化锌的热分解产生氧和金属锌; 在母合金晶体的边界和内侧，母合金中的金属成分的一部分偏析; 通过用生成的氧强制氧化分离的金属形成非晶金属氧化物; 无定形金属氧化物的结晶; 在结晶的金属氧化物和母体合金晶体之间形成外延结; 并将金属锌蒸发到真空中，并淬火烧结体。

公开(公告)号：US06103021A

公开(公告)日：2000-08-15

申请号：US112288

申请日：1998-07-09

申请人： Shigenobu Sekine ,  Hiroji Sato

发明人： Shigenobu Sekine ,  Hiroji Sato

IPC分类号： B22F9/22 ,  B22F1/00 ,  H01F1/057 ,  H01F1/059 ,  H01F1/06 ,  B22F9/00

CPC分类号： H01F1/059 ,  B22F1/0007 ,  B22F1/0085 ,  H01F1/0571 ,  H01F1/0578 ,  B22F2999/00

摘要： The present invention is directed to provide a method of preparing a raw material powder for permanent magnets superior in moldability, especially in moldability and productivity of bonded magnets. The method comprises subjecting an acicular iron powder having an aspect ratio of not smaller than 5:1 to heating at 800-900.degree. C. in fluidized state with a gas stream containing no oxygen until the acicular iron powder is transformed into a columnar shape iron powder having an aspect ratio of not larger than 3:1, a die-like shape iron powder or a spherical shape iron powder. The acicular iron powder may contain or may be attached by such a component effective for improving magnetic properties as a rare earth element metal, a rare earth element metal oxide, boron, cobalt and nickel.

摘要翻译： 本发明的目的在于提供一种制备永久磁铁用原料粉末的方法，该成型性优异，特别是成形性和粘结磁铁的生产率。 该方法包括：使具有不小于5:1的纵横比的针状铁粉以不含氧的气流在流化状态下在800-900℃下加热，直到针状铁粉转变为柱状铁 长径比不大于3:1的粉末，模具状铁粉或球形铁粉。 针状铁粉可以含有或者可以通过这样一种有助于提高作为稀土元素金属，稀土元素金属氧化物，硼，钴和镍的磁性能的组分附着。

公开(公告)号：US20130186943A1

公开(公告)日：2013-07-25

申请号：US13793947

申请日：2013-03-11

申请人： Shigenobu SEKINE ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Ryuji Kimura

发明人： Shigenobu SEKINE ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Ryuji Kimura

IPC分类号： H05K13/04

CPC分类号： H05K13/0465 ,  H01B3/025 ,  H01B3/10 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1131 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/812 ,  H01L2224/8181 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/8384

摘要： A method includes applying, between connection conductors of adjacent substrates, a junction material containing the first metal or alloy component and the second metal or alloy component having a higher melting point than said first metal or alloy component. The method further includes melting the junction material by a heat treatment.

摘要翻译： 一种方法包括在相邻基底的连接导体之间施加含有第一金属或合金成分的接合材料和具有比所述第一金属或合金成分更高的熔点的第二金属或合金成分。 该方法还包括通过热处理熔化接合材料。