公开(公告)号：US5972732A

公开(公告)日：1999-10-26

申请号：US994177

申请日：1997-12-19

申请人： James M. Gee ,  Stephen E. Garrett ,  William P. Morgan ,  Walter Worobey

发明人： James M. Gee ,  Stephen E. Garrett ,  William P. Morgan ,  Walter Worobey

IPC分类号： H01L31/048 ,  H01L31/05 ,  H01L31/18

CPC分类号： H01L31/0516 ,  H01L31/048 ,  Y02E10/50

摘要： Methods for "monolithic module assembly" which translate many of the advantages of monolithic module construction of thin-film PV modules to wafered c-Si PV modules. Methods employ using back-contact solar cells positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The methods of the invention allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

摘要翻译： “单片模块组装”的方法，将薄膜光伏组件的整体模块结构的许多优点转移到等离子体c-Si光伏组件上。 方法采用使用固定在平面支架上的导电电路元件上方的背接触太阳能电池，以便产生能产生电能的电路。 这些模块使用通常用于光伏组件制造的密封剂材料如EVA来封装。 本发明的方法允许多个单元在单个封装步骤中电连接，而不是通过顺序焊接来表征当前使用的商业实践。

公开(公告)号：US06779971B2

公开(公告)日：2004-08-24

申请号：US09975862

申请日：2001-10-12

申请人： Stephen E. Garrett

发明人： Stephen E. Garrett

IPC分类号： F01D1716

CPC分类号： F01D17/165

摘要： A turbine in which a turbine wheel is mounted in a housing between an inlet and an outlet. Rotatably mounted vanes are located in the inlet and coupled by linkages to an actuator which is displaceable relative to the vanes so as to control the angular orientation of the vanes relative to the housing inlet. Each vane is coupled to the actuator by a flexible link, the ends of the link being secured to the vanes and actuator in a manner which prevents relative movement between the link ends and the vane or the actuator. Flexing of the links thus accommodates the rotation of the vanes which results from actuator displacements.

摘要翻译： 一种涡轮机，其中涡轮机叶轮安装在入口和出口之间的壳体中。 可旋转安装的叶片位于入口中并通过与致动器的连接件联接，致动器可相对于叶片移动，以便控制叶片相对于壳体入口的角度定向。 每个叶片通过柔性连杆联接到致动器，链节的端部以防止连杆端和叶片或致动器之间的相对运动的方式固定到叶片和致动器。 因此，链节的弯曲容纳由致动器位移导致的叶片的旋转。

公开(公告)号：US5951786A

公开(公告)日：1999-09-14

申请号：US994071

申请日：1997-12-19

申请人： James M. Gee ,  Stephen E. Garrett ,  William P. Morgan ,  Walter Worobey

发明人： James M. Gee ,  Stephen E. Garrett ,  William P. Morgan ,  Walter Worobey

IPC分类号： H01L31/048 ,  H01L31/05

CPC分类号： B32B17/10018 ,  B32B17/10788 ,  H01L31/048 ,  H01L31/0512 ,  H01L31/0516 ,  Y02E10/50

摘要： Photovoltaic modules which comprise back-contact solar cells, such as back-contact crystalline silicon solar cells, positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The module designs allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

摘要翻译： 包括背接触太阳能电池（例如背接触晶体硅太阳能电池）的光伏模块被定位在固定到平面支撑件上的导电电路元件顶上，从而产生能够产生电力的电路。 这些模块使用通常用于光伏组件制造的密封剂材料如EVA来封装。 模块设计允许多个单元在单个封装步骤中电连接，而不是通过顺序焊接来表征当前使用的商业实践。

公开(公告)号：US5522697A

公开(公告)日：1996-06-04

申请号：US342546

申请日：1994-11-21

申请人： John F. Parker ,  Stephen E. Garrett

发明人： John F. Parker ,  Stephen E. Garrett

IPC分类号： F01D9/00 ,  F01D17/14 ,  F01D17/16 ,  F02B37/22

CPC分类号： F02B37/22 ,  F01D17/143 ,  F05D2220/40 ,  Y02T10/144

摘要： A variable geometry turbine comprising a housing 1 including an annular cavity 19 which supports a moveable annular wall member 5. An annular turbine inlet passageway 4 is defined between an end face of the moveable wall member 5 and a facing wall 6 of the housing 1. The moveable wall member 5 is moveable so as to vary the width of the annular turbine inlet passageway 4. Gas tight seals 20, 21 are provided between the wall member 5 and radially inner and outer surfaces of the cavity 19 and apertures 24 are provided through the face of the annular wall member 5. The arrangement is such that the mean pressure difference between the cavity 19 and the annular turbine inlet passageway 4 is reduced so that the total axial load on the wall member 5 due to gas flow through the inlet passageway 4 is reduced.

摘要翻译： 可变几何涡轮机包括壳体1，壳体1包括支撑可移动环形壁构件5的环形空腔19.环形涡轮机入口通道4限定在可移动壁构件5的端面和壳体1的面对壁6之间。 可移动壁构件5是可移动的，以便改变环形涡轮机入口通道4的宽度。气密密封件20,21设置在壁构件5和空腔19的径向内外表面之间，孔24通过 环形壁构件5的表面。这种布置使得空腔19和环形涡轮机入口通道4之间的平均压力差减小，使得由于气体流过入口通道而导致的壁构件5上的总轴向载荷 4减少。

公开(公告)号：US06858943B1

公开(公告)日：2005-02-22

申请号：US10396879

申请日：2003-03-25

申请人： Kenneth A. Peterson ,  Stephen E. Garrett ,  Cathleen A. Reber

发明人： Kenneth A. Peterson ,  Stephen E. Garrett ,  Cathleen A. Reber

IPC分类号： B81B7/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B81B7/0006 ,  B82Y30/00 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05138 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85099 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2224/451 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/01006

摘要： A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a “package-first, release-second” sequence for fabricating MEMS devices. Likewise, the bond strength of an Au—Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

摘要翻译： 耐剥离电气互连，包括直接与MEMS，IMEMS或MOEMS器件中的高度掺杂的多晶硅焊盘压接的金基电导体，而不使用任何铝，钛，焊料或导电粘合剂的中间层 在导体和多晶硅垫之间。 在形成初始压接之后，接头在363℃以上的热处理在包含金加上约3重量％的硅的粘结线上产生液态共晶相，再次凝固时，通过重整显着地提高了粘合强度， 增强初始债券。 这种类型的电互连耐受用于释放MEMS元件（HF，HCL）的酸的化学侵蚀，从而能够使用“封装第一，释放 - 第二”序列来制造MEMS器件。 同样，通过形成包含Au-12wt％Ge的瞬态液体共晶相，可以增加Au-Ge压缩键的键合强度。

公开(公告)号：US06500760B1

公开(公告)日：2002-12-31

申请号：US09922518

申请日：2001-08-02

申请人： Kenneth A. Peterson ,  Stephen E. Garrett ,  Cathleen A. Reber ,  Robert D. Watson

发明人： Kenneth A. Peterson ,  Stephen E. Garrett ,  Cathleen A. Reber ,  Robert D. Watson

IPC分类号： H01L21302

CPC分类号： H01L24/85 ,  B81B7/0006 ,  B82Y30/00 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81206 ,  H01L2224/81207 ,  H01L2224/81948 ,  H01L2224/83805 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85099 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/85375 ,  H01L2224/85948 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2224/48824 ,  H01L2924/0665 ,  H01L2924/013 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/01006

摘要： A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed in-between the conductor and the silicon surface. After compression bonding, optional heating of the bond above 363 C. allows formation of a liquid gold-silicon eutectic phase containing approximately 3% (by weight) silicon, which significantly improves the bond strength by reforming and enhancing the initial compression bond. The same process can be used for improving the bond strength of Au—Ge bonds by forming a liquid Au-12Ge eutectic phase.

摘要翻译： 一种制造从微电子器件到封装的电互连的方法，包括将金或基板导体直接压接在硅表面上的球形或楔形结构，例如MEMS或IMEMS器件中的多晶硅焊盘，而不使用铝层 或设置在导体和硅表面之间的钛。 在压接之后，可选地加热363℃以上的键，可以形成含有约3％（重量）硅的液态金 - 硅共晶相，通过重整和增强初始压缩键显着地提高了结合强度。 通过形成液态Au-12Ge共晶相，可以使用相同的工艺来改善Au-Ge键的键合强度。