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公开(公告)号：US20150107765A1
公开(公告)日：2015-04-23
申请号：US14512535
申请日：2014-10-13
发明人： S. Kumar Khanna
CPC分类号： C09J9/02 , C08K9/02 , C08K2201/001 , C08K2201/01 , C09J9/00 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16227 , H01L2224/2929 , H01L2224/29298 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29388 , H01L2224/29393 , H01L2224/29499 , H01L2224/29562 , H01L2224/2957 , H01L2224/29639 , H01L2224/29644 , H01L2224/32013 , H01L2224/32057 , H01L2224/32225 , H01L2224/75253 , H01L2224/75265 , H01L2224/75266 , H01L2224/75734 , H01L2224/75735 , H01L2224/81193 , H01L2224/83192 , H01L2224/83851 , H01L2224/83874 , H01L2224/8393 , H01L2924/00014 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2201/0323 , H05K2201/083 , H05K2203/104 , H01L2924/2064 , H01L2924/0665 , H01L2224/0401
摘要： Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.
摘要翻译： 公开了各向异性导电粘合剂（ACA）和相关方法的说明性实施方案。 在一个说明性实施方案中，ACA可以包括可使用UV光固化的粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层的铁磁材料。 当ACA在经受磁场后用UV光固化时，导电材料可以形成导电和隔离的平行路径。
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公开(公告)号：US11606864B2
公开(公告)日：2023-03-14
申请号：US16192785
申请日：2018-11-15
发明人： Andrew Stemmermann
摘要： Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
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公开(公告)号：US20160254244A1
公开(公告)日：2016-09-01
申请号：US15152530
申请日：2016-05-11
发明人： S. Kumar Khanna
IPC分类号： H01L23/00 , H05K1/18 , H05K1/02 , H01L23/66 , H05K1/09 , H01L33/62 , H01L25/065 , H01L25/075 , H05K1/11 , H05K1/03
CPC分类号： H01L24/32 , C08K9/08 , C09J9/02 , C09J11/00 , H01L23/66 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/75 , H01L24/83 , H01L25/0655 , H01L25/0753 , H01L33/62 , H01L2223/6677 , H01L2224/16227 , H01L2224/16505 , H01L2224/2732 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75251 , H01L2224/75252 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83001 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83439 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83907 , H01L2224/83986 , H01L2924/00014 , H01L2924/01013 , H01L2924/01047 , H01L2924/0665 , H01L2924/0675 , H01L2924/12041 , H01L2924/1421 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2224/16225 , H01L2924/00 , H01L2224/0401 , H01L2924/0635 , H01L2924/0625 , H01L2924/095
摘要： Illustrative embodiments of systems and method utilizing anisotropic conductive adhesive(s) (“ACA”) are disclosed. In at least one illustrative embodiment, a substrate may comprise one or more electrical contacts, and one or more integrated circuits may be secured to the substrate by ACA. The ACA may comprise a plurality of particles suspended in a binder, where the plurality of particles form electrically conductive and isolated parallel paths between the one or more electrical contacts and the one or more integrated circuits as a result of the ACA being subjected to a magnetic field before or during curing of the binder.
摘要翻译： 公开了使用各向异性导电粘合剂（“ACA”）的系统和方法的说明性实施例。 在至少一个说明性实施例中，衬底可以包括一个或多个电触点，并且一个或多个集成电路可以通过ACA固定到衬底。 ACA可以包括悬挂在粘合剂中的多个颗粒，其中多个颗粒在一个或多个电触点与一个或多个集成电路之间形成导电和隔离的平行路径，作为ACA受到磁性的结果 在粘合剂固化之前或期间。
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公开(公告)号：US20210175015A1
公开(公告)日：2021-06-10
申请号：US17118584
申请日：2020-12-10
发明人： Andrew Stemmermann
摘要： Compositions and methods for creating in situ capacitors, micro-capacitors, battery like applications, and chipless memory chips are provided. The methods and compositions all comprise the use of magnetically-alignable particles. In various applications herein the particles may be nonconductive, in another aspect, the particles are conductive. The functional capacitors entail the ferromagnetic particles and a dielectric material or a non-conductive coating.
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公开(公告)号：US20200163225A1
公开(公告)日：2020-05-21
申请号：US16192785
申请日：2018-11-15
发明人： Andrew Stemmermann
摘要： Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
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公开(公告)号：US09365749B2
公开(公告)日：2016-06-14
申请号：US14054529
申请日：2013-10-15
发明人： S. Kumar Khanna
CPC分类号： C09J9/02 , C08K9/08 , C09J11/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83007 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83986 , H01L2924/00014 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2924/00 , H01L2224/0401
摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。
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公开(公告)号：US20140353540A1
公开(公告)日：2014-12-04
申请号：US14054529
申请日：2013-10-15
发明人： S. Kumar Khanna
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08K9/08 , C09J11/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83007 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83986 , H01L2924/00014 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2924/00 , H01L2224/0401
摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。
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公开(公告)号：US09777197B2
公开(公告)日：2017-10-03
申请号：US14512535
申请日：2014-10-13
发明人： S. Kumar Khanna
CPC分类号： C09J9/02 , C08K9/02 , C08K2201/001 , C08K2201/01 , C09J9/00 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16227 , H01L2224/2929 , H01L2224/29298 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29388 , H01L2224/29393 , H01L2224/29499 , H01L2224/29562 , H01L2224/2957 , H01L2224/29639 , H01L2224/29644 , H01L2224/32013 , H01L2224/32057 , H01L2224/32225 , H01L2224/75253 , H01L2224/75265 , H01L2224/75266 , H01L2224/75734 , H01L2224/75735 , H01L2224/81193 , H01L2224/83192 , H01L2224/83851 , H01L2224/83874 , H01L2224/8393 , H01L2924/00014 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2201/0323 , H05K2201/083 , H05K2203/104 , H01L2924/2064 , H01L2924/0665 , H01L2224/0401
摘要： Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.
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