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公开(公告)号：US09735130B2
公开(公告)日：2017-08-15
申请号：US14472699
申请日：2014-08-29
发明人： Kuo Lung Pan , Ying-Jui Huang , Yu-Feng Chen , Chen-Shien Chen
IPC分类号： H01L23/04 , H01L25/065 , H01L25/00 , H01L23/367 , H01L23/36 , H01L23/00 , H01L23/29 , H01L25/18
CPC分类号： H01L25/0657 , H01L23/04 , H01L23/295 , H01L23/36 , H01L23/3675 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/06181 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13123 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29488 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81815 , H01L2224/8385 , H01L2224/83862 , H01L2224/83868 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06589 , H01L2225/06596 , H01L2924/141 , H01L2924/1421 , H01L2924/1431 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15311 , H01L2924/15313 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/16151 , H01L2924/16235 , H01L2924/16251 , H01L2924/1659 , H01L2924/16724 , H01L2924/16747 , H01L2924/1676 , H01L2924/1679 , H01L2924/18161 , H01L2924/014
摘要： A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die.
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公开(公告)号：US20080054227A1
公开(公告)日：2008-03-06
申请号：US11734988
申请日：2007-04-13
CPC分类号： H05K3/321 , B82Y30/00 , H01B1/20 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/29386 , H01L2224/29393 , H01L2224/29424 , H01L2224/29447 , H01L2224/29488 , H01L2224/83868 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01016 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/01056 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K3/323 , H05K2201/0112 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05032 , H01L2924/05341 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.
摘要翻译： 一种快速固化组合物，其包含聚合物树脂，导电填料和一种或多种近红外吸收添加剂和任选的除氧剂或腐蚀抑制剂或二者，以及其它添加剂如反应性或非反应性稀释剂，惰性填料和粘合促进剂。 组合物可以是导电的，电阻的或各向异性的导电的。 在另一个实施方案中，本发明是通过将组合物暴露于近红外能量源来改善组合物的固化速度的方法。
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公开(公告)号：US20050247916A1
公开(公告)日：2005-11-10
申请号：US10840166
申请日：2004-05-06
CPC分类号： H05K3/321 , B82Y30/00 , H01B1/20 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/29386 , H01L2224/29393 , H01L2224/29424 , H01L2224/29447 , H01L2224/29488 , H01L2224/83868 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01016 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/01056 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K3/323 , H05K2201/0112 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05032 , H01L2924/05341 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.
摘要翻译： 一种快速固化组合物，其包含聚合物树脂，导电填料和一种或多种近红外吸收添加剂和任选的除氧剂或腐蚀抑制剂或二者，以及其它添加剂如反应性或非反应性稀释剂，惰性填料和粘合促进剂。 组合物可以是导电的，电阻的或各向异性的导电的。 在另一个实施方案中，本发明是通过将组合物暴露于近红外能量源来改善组合物的固化速度的方法。
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公开(公告)号：US20160254244A1
公开(公告)日：2016-09-01
申请号：US15152530
申请日：2016-05-11
发明人： S. Kumar Khanna
IPC分类号： H01L23/00 , H05K1/18 , H05K1/02 , H01L23/66 , H05K1/09 , H01L33/62 , H01L25/065 , H01L25/075 , H05K1/11 , H05K1/03
CPC分类号： H01L24/32 , C08K9/08 , C09J9/02 , C09J11/00 , H01L23/66 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/75 , H01L24/83 , H01L25/0655 , H01L25/0753 , H01L33/62 , H01L2223/6677 , H01L2224/16227 , H01L2224/16505 , H01L2224/2732 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75251 , H01L2224/75252 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83001 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83439 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83907 , H01L2224/83986 , H01L2924/00014 , H01L2924/01013 , H01L2924/01047 , H01L2924/0665 , H01L2924/0675 , H01L2924/12041 , H01L2924/1421 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2224/16225 , H01L2924/00 , H01L2224/0401 , H01L2924/0635 , H01L2924/0625 , H01L2924/095
摘要： Illustrative embodiments of systems and method utilizing anisotropic conductive adhesive(s) (“ACA”) are disclosed. In at least one illustrative embodiment, a substrate may comprise one or more electrical contacts, and one or more integrated circuits may be secured to the substrate by ACA. The ACA may comprise a plurality of particles suspended in a binder, where the plurality of particles form electrically conductive and isolated parallel paths between the one or more electrical contacts and the one or more integrated circuits as a result of the ACA being subjected to a magnetic field before or during curing of the binder.
摘要翻译： 公开了使用各向异性导电粘合剂（“ACA”）的系统和方法的说明性实施例。 在至少一个说明性实施例中，衬底可以包括一个或多个电触点，并且一个或多个集成电路可以通过ACA固定到衬底。 ACA可以包括悬挂在粘合剂中的多个颗粒，其中多个颗粒在一个或多个电触点与一个或多个集成电路之间形成导电和隔离的平行路径，作为ACA受到磁性的结果 在粘合剂固化之前或期间。
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公开(公告)号：US20150187725A1
公开(公告)日：2015-07-02
申请号：US14444566
申请日：2014-07-28
发明人： Kyoung-Kook Hong , Su Bin Kang
CPC分类号： H01L24/27 , B22F1/0085 , B22F1/0096 , B22F1/02 , B22F3/10 , B22F3/1003 , B22F2998/10 , B23K1/00 , B23K35/0244 , B23K35/025 , B23K35/3006 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27505 , H01L2224/29294 , H01L2224/29339 , H01L2224/29488 , H01L2224/3201 , H01L2224/83055 , H01L2224/83825 , H01L2224/8384 , H01L2924/10272 , H01L2924/00014 , H01L2924/00012
摘要： A method of joining silver paste is provided that includes preparing silver paste including a plurality of silver powders and solid phase sintering medium materials capable of surrounding each silver powder. In addition, the method incldues heating the silver paste at an oxygen partial pressure that is greater than a level at an atmospheric pressure, and joining the silver powders.
摘要翻译： 提供了一种接合银膏的方法，其包括制备包含多个银粉的银膏和能够围绕每个银粉的固相烧结介质材料。 此外，该方法包括在大于大气压的水平的氧分压下加热银浆，并且连接银粉。
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公开(公告)号：US09365749B2
公开(公告)日：2016-06-14
申请号：US14054529
申请日：2013-10-15
发明人： S. Kumar Khanna
CPC分类号： C09J9/02 , C08K9/08 , C09J11/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83007 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83986 , H01L2924/00014 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2924/00 , H01L2224/0401
摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。
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公开(公告)号：US20160064355A1
公开(公告)日：2016-03-03
申请号：US14472699
申请日：2014-08-29
发明人： Kuo Lung Pan , Ying-Jui Huang , Yu-Feng Chen , Chen-Shien Chen
IPC分类号： H01L25/065 , H01L23/04 , H01L23/00 , H01L23/31 , H01L21/56 , H01L25/00 , H01L23/367
CPC分类号： H01L25/0657 , H01L23/04 , H01L23/295 , H01L23/36 , H01L23/3675 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/06181 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13123 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29488 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81815 , H01L2224/8385 , H01L2224/83862 , H01L2224/83868 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06589 , H01L2225/06596 , H01L2924/141 , H01L2924/1421 , H01L2924/1431 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15311 , H01L2924/15313 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/16151 , H01L2924/16235 , H01L2924/16251 , H01L2924/1659 , H01L2924/16724 , H01L2924/16747 , H01L2924/1676 , H01L2924/1679 , H01L2924/18161 , H01L2924/014
摘要： A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die.
摘要翻译： 芯片封装可以包括：第一裸片; 设置在所述第一管芯上的至少一个第二管芯; 以及设置在所述第一管芯的侧面部分上并且至少部分地围绕所述至少一个第二管芯的盖子，所述盖子具有与所述至少一个第二管芯间隔开并面向所述至少一个第二管芯的倾斜侧壁。
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公开(公告)号：US20140353540A1
公开(公告)日：2014-12-04
申请号：US14054529
申请日：2013-10-15
发明人： S. Kumar Khanna
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08K9/08 , C09J11/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83007 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83986 , H01L2924/00014 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2924/00 , H01L2224/0401
摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。
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