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    LOW CTE INTERPOSER
    1.
    发明申请
    LOW CTE INTERPOSER 有权

    公开(公告)号：US20130063918A1

    公开(公告)日：2013-03-14

    申请号：US13232436

    申请日：2011-09-14

    申请人： Belgacem Haba ,  Kishor Desai

    发明人： Belgacem Haba ,  Kishor Desai

    IPC分类号： H05K7/00 ,  B32B38/08 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16

    CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

    摘要翻译： 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（CTE）可以低于每百万摄氏度（ppm /℃）的百万分之十二。

    Low CTE interposer
    3.
    发明授权
    Low CTE interposer 有权
    低CTE插值器

    公开(公告)号：US08780576B2

    公开(公告)日：2014-07-15

    申请号：US13232436

    申请日：2011-09-14

    申请人： Belgacem Haba ,  Kishor Desai

    发明人： Belgacem Haba ,  Kishor Desai

    IPC分类号： H05K7/00

    CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

    摘要翻译： 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（“CTE”）可以低于每摄氏度12ppm（“ppm /℃”）。

    Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
    9.
    发明申请
    Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors 审中-公开
    使用硅基车削镜的光电组件包装平台

    公开(公告)号：US20130188970A1

    公开(公告)日：2013-07-25

    申请号：US13745773

    申请日：2013-01-19

    申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

    发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

    IPC分类号： H04B10/12

    CPC分类号： H04B10/501 ,  G02B6/3512 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/4256 ,  G02B6/4292 ,  Y10T29/49002

    摘要： An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.

    摘要翻译： 用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。 外壳用于封装填充的插入器组件，并且包括硅侧壁和透明盖。 侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征，转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。 盖板设置在外壳上并与壳体对准，其中盖板包括硅侧壁构件，其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。 由外壳重新引导的光学信号然后穿过外壳的透明盖，撞击盖板的转向镜元件，然后沿着纵向轴线重新定向。