公开(公告)号：US08697492B2

公开(公告)日：2014-04-15

申请号：US12938068

申请日：2010-11-02

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Ellis Chau ,  Sang Il Lee ,  Kishor Desai

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Ellis Chau ,  Sang Il Lee ,  Kishor Desai

IPC分类号： H01L25/065 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1601 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and other of the first or second conductive elements may include a bond metal disposed between some of the conductive posts. An underfill layer may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer and at least deform the bond metal. The microelectronic element and the dielectric element can be heated to join them together. The height of the posts above the surface may be at least forty percent of a distance between surfaces of the microelectronic element and dielectric element.

摘要翻译： 一种用于制造微电子组件的方法包括：提供具有第一导电元件的微电子元件和具有第二导电元件的介质元件。 第一导电元件或第二导电元件中的至少一些可以是导电柱，并且第一或第二导电元件中的另一个可以包括设置在一些导电柱之间的接合金属。 底部填充层可能过度地部分第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得支柱刺穿底部填充层并且至少使接合金属变形。 微电子元件和电介质元件可以被加热以将它们连接在一起。 表面上方的柱的高度可以是微电子元件和电介质元件的表面之间的距离的至少40％。

公开(公告)号：US20120104595A1

公开(公告)日：2012-05-03

申请号：US12938068

申请日：2010-11-02

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Ellis Chau ,  Sang Il Lee ,  Kishor Desai

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Ellis Chau ,  Sang Il Lee ,  Kishor Desai

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1601 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and other of the first or second conductive elements may include a bond metal disposed between some of the conductive posts. An underfill layer may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer and at least deform the bond metal. The microelectronic element and the dielectric element can be heated to join them together. The height of the posts above the surface may be at least forty percent of a distance between surfaces of the microelectronic element and dielectric element.

摘要翻译： 一种用于制造微电子组件的方法包括：提供具有第一导电元件的微电子元件和具有第二导电元件的介质元件。 第一导电元件或第二导电元件中的至少一些可以是导电柱，并且第一或第二导电元件中的另一个可以包括设置在一些导电柱之间的接合金属。 底部填充层可能过度地部分第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得支柱刺穿底部填充层并且至少使接合金属变形。 微电子元件和电介质元件可以被加热以将它们连接在一起。 表面上方的柱的高度可以是微电子元件和电介质元件的表面之间的距离的至少40％。

公开(公告)号：US20130063918A1

公开(公告)日：2013-03-14

申请号：US13232436

申请日：2011-09-14

申请人： Belgacem Haba ,  Kishor Desai

发明人： Belgacem Haba ,  Kishor Desai

IPC分类号： H05K7/00 ,  B32B38/08 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

摘要翻译： 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（CTE）可以低于每百万摄氏度（ppm /℃）的百万分之十二。

公开(公告)号：US20120126389A1

公开(公告)日：2012-05-24

申请号：US12953994

申请日：2010-11-24

申请人： Kishor Desai ,  Belgacem Haba ,  Wael Zohni

发明人： Kishor Desai ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L25/07 ,  H01L21/98

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103

摘要： The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.

摘要翻译： 微电子组件包括具有前表面的第一微电子元件，在前表面处暴露的多个触点以及远离前表面的后表面; 第二微电子元件具有面向第一微电子元件的后表面并且突出超过第一微电子元件的边缘的前表面，第二微电子元件具有在其前表面处暴露的多个触点; 位于所述微电子元件的前表面上方的电介质区域，所述电介质区域具有背离所述微电子元件的主表面; 在从第一和第二微电子元件的多个触点延伸的电介质区域内的开口内的金属化通孔; 并且引线沿着介电区域的主表面从通孔暴露在主表面处的端子延伸。

公开(公告)号：US08780576B2

公开(公告)日：2014-07-15

申请号：US13232436

申请日：2011-09-14

申请人： Belgacem Haba ,  Kishor Desai

发明人： Belgacem Haba ,  Kishor Desai

IPC分类号： H05K7/00

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

摘要翻译： 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（“CTE”）可以低于每摄氏度12ppm（“ppm /℃”）。

公开(公告)号：US08378478B2

公开(公告)日：2013-02-19

申请号：US12953994

申请日：2010-11-24

申请人： Kishor Desai ,  Belgacem Haba ,  Wael Zohni

发明人： Kishor Desai ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L23/02

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103

摘要： The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.

摘要翻译： 微电子组件包括具有前表面的第一微电子元件，在前表面处暴露的多个触点以及远离前表面的后表面; 第二微电子元件具有面向第一微电子元件的后表面并且突出超过第一微电子元件的边缘的前表面，第二微电子元件具有在其前表面处暴露的多个触点; 位于所述微电子元件的前表面上方的电介质区域，所述电介质区域具有背离所述微电子元件的主表面; 在从第一和第二微电子元件的多个触点延伸的电介质区域内的开口内的金属化通孔; 并且引线沿着介电区域的主表面从通孔暴露在主表面处的端子延伸。

公开(公告)号：US20120314384A1

公开(公告)日：2012-12-13

申请号：US13156609

申请日：2011-06-09

申请人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

发明人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

IPC分类号： H05K5/00 ,  H01L21/768 ,  H05K7/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/00

CPC分类号： H05K3/0094 ,  B23K1/0016 ,  B23K35/24 ,  B23K35/36 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/09701 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.

摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。

公开(公告)号：US08723049B2

公开(公告)日：2014-05-13

申请号：US13156609

申请日：2011-06-09

申请人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

发明人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

IPC分类号： H05K1/11

CPC分类号： H05K3/0094 ,  B23K1/0016 ,  B23K35/24 ,  B23K35/36 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/09701 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.

摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。

公开(公告)号：US08963310B2

公开(公告)日：2015-02-24

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。

公开(公告)号：US20130202255A1

公开(公告)日：2013-08-08

申请号：US13755843

申请日：2013-01-31

申请人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

发明人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/421 ,  G02B6/3885 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4292 ,  G02B6/43

摘要： An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

摘要翻译： 用于在光电收发器和单模光纤阵列之间提供单模光信号耦合的装置采用透镜阵列和套圈部件的形式。 透镜阵列包括多个单独的透镜元件，其设置成截取来自光电收发器的类似多个单模光输出信号，并提供其聚焦版本的输出。 套圈组件包括与透镜阵列无源对准的多个单模光纤短截线，并支持将聚焦的单模光输出信号传输到相关联的单模光纤阵列。