摘要:
The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.
摘要:
The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.
摘要:
A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.
摘要:
A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.
摘要:
A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element can include a plurality of stacked electrically interconnected semiconductor chips. The substrate can have contacts facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.
摘要:
A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.
摘要:
A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each having terminals mounted to the respective panel contacts. Each package can include a microelectronic element having a face and contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The terminals can include first terminals at positions within first and second parallel grids. The first terminals can be configured to carry address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. Signal assignments of the first terminals in the first grid can be a mirror image of signal assignments of the first terminals in the second grid.
摘要:
A microelectronic package can include a substrate having first, second, and third apertures extending between first and second surfaces thereof, first, second, and third microelectronic elements each having a surface facing the first surface, and a plurality of terminals exposed at a central region of the second surface. The apertures can have first, second, and third axes extending in directions of the lengths of the respective apertures. The first and second axes can be parallel to one another. The third axis can be transverse to the first axis. The central region of the second surface of the substrate can be disposed between the first and second axes. The terminals can be configured to carry sufficient address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within at least one of the microelectronic elements.
摘要:
A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.
摘要:
A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.