利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.03 秒)

    Method for filling holes in printed wiring boards
    1.
    发明授权
    Method for filling holes in printed wiring boards 失效
    填充印刷电路板孔的方法

    公开(公告)号：US6015520A

    公开(公告)日：2000-01-18

    申请号：US857188

    申请日：1997-05-15

    申请人： Bernd Karl-Heinz Appelt ,  Christina Marie Boyko ,  Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Michael Joseph Klodowski

    发明人： Bernd Karl-Heinz Appelt ,  Christina Marie Boyko ,  Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Michael Joseph Klodowski

    IPC分类号： H05K3/28 ,  B29C35/08 ,  B29C61/00 ,  B29C67/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  B29C37/02

    CPC分类号： B29C61/006 ,  B29C67/004 ,  H05K3/0094 ,  B29C2035/0827 ,  B29C2791/001 ,  H05K1/112 ,  H05K2201/0959 ,  H05K2203/0278 ,  H05K3/3452 ,  H05K3/4602

    摘要： A method for filling a hole in a printed wiring board (PWB) and the resultant PWB. During an intermediate stage in fabrication, a PWB comprises a lamination of dielectric sheets with metalizations on various layers and a plated through hole (PTH). A photoimageable material is formed on a surface of the laminate and covers the PTH. The photoimageable material in a region covering the PTH is partially cured by exposure to light. The remainder of the photoimageable material is developed away. Then, the partially cured photoimageable material in the region of the PTH is pressed into the PTH to form a plug. By application of heat during or after the forcing step, the plug is further cured to a hard condition. For some applications, the plug is mechanically abraded to be flush with one or both surfaces of the laminate. The plug can serve as a solder mask or permit another layer of low viscosity photoimageable material to be formed over the laminate such that the hole, now plugged, will not interfere with the formation of such additional layer.

    摘要翻译： 一种用于在印刷电路板（PWB）中填充孔的方法和所得的PWB。 在制造的中间阶段期间，PWB包括在各种层上具有金属化的电介质片层压和电镀通孔（PTH）。 在该层叠体的表面上形成可光成象的材料并覆盖PTH。 覆盖PTH的区域中的可光成像材料通过曝光而部分固化。 剩余的可光成像材料被开发出来。 然后，将PTH区域中的部分固化的可光成像材料压入PTH中以形成塞子。 通过在强迫步骤期间或之后施加热量，塞子进一步固化到硬的状态。 对于一些应用，插塞被机械磨损以与层压板的一个或两个表面齐平。 塞子可以用作焊接掩模或允许在层压板上形成另一层低粘度可光成像材料层，使得现在堵塞的孔不会干扰这种附加层的形成。

    Printed circuit board with cavity for circuitization
    3.
    发明授权
    Printed circuit board with cavity for circuitization 失效
    带空腔的印刷电路板进行电路化

    公开(公告)号：US6066386A

    公开(公告)日：2000-05-23

    申请号：US57844

    申请日：1998-04-09

    申请人： Christina Marie Boyko ,  Donald Seton Farquhar ,  Robert Maynard Japp ,  Michael Joseph Klodowski

    发明人： Christina Marie Boyko ,  Donald Seton Farquhar ,  Robert Maynard Japp ,  Michael Joseph Klodowski

    IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K3/46 ,  B32B3/00

    CPC分类号： H05K3/4611 ,  H01L21/486 ,  H01L23/5385 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24917

    摘要： A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized dielectric layer and the sticker sheet each have a window which is registered with the other window forming a cavity. Next, a flexible release layer is laid above the second metallized dielectric layer and a thermosetting visco-plastic material is laid on the release layer over the cavity. Next the first and second metallized dielectric layers, sticker sheet, release layer and visco-plastic material are laminated by heat and pressure to cure the sticker sheet and thereby bind the first and second metallized dielectric sheets to each other. During the lamination step, the sticker sheet flows to the perimeter of the cavity. However, the pressure forces the visco-plastic material tightly into the cavity to seal a bottom perimeter of the cavity such that the sticker sheet forms a smooth fillet at the bottom perimeter of the cavity.

    摘要翻译： 公开了一种用于制造具有空腔的印刷电路的方法。 该方法包括以下步骤：将贴纸贴在第一金属化电介质层上，并在贴纸上铺设第二金属化电介质层。 第二金属化介电层和贴纸各自具有与形成空腔的另一窗口对准的窗口。 接下来，将柔性释放层铺设在第二金属化介电层上方，并且将热固性粘塑材料铺设在空腔上的释放层上。 接下来，通过热和压力层压第一和第二金属化介电层，贴纸，剥离层和粘塑材料以固化粘合片，从而将第一和第二金属化介电片彼此粘合。 在层压步骤期间，贴片片流动到空腔的周边。 然而，压力迫使粘塑性材料紧密地进入空腔中以密封空腔的底部周边，使得粘贴片在空腔的底部周边处形成平滑的圆角。

    Method for fabricating printed circuit boards with cavities
    4.
    发明授权
    Method for fabricating printed circuit boards with cavities 失效
    具有空腔的印刷电路板的制造方法

    公开(公告)号：US5784782A

    公开(公告)日：1998-07-28

    申请号：US709373

    申请日：1996-09-06

    申请人： Christina Marie Boyko ,  Donald Seton Farquhar ,  Robert Maynard Japp ,  Michael Joseph Klodowski

    发明人： Christina Marie Boyko ,  Donald Seton Farquhar ,  Robert Maynard Japp ,  Michael Joseph Klodowski

    IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K3/46 ,  H05K3/10 ,  H05K3/36 ,  H05K3/42

    CPC分类号： H05K3/4611 ,  H01L21/486 ,  H01L23/5385 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24917

    摘要： A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized dielectric layer and the sticker sheet each have a window which is registered with the other window forming a cavity. Next, a flexible release layer is laid above the second metallized dielectric layer and a thermosetting visco-plastic material is laid on the release layer over the cavity. Next, the first and second metallized dielectric layers, sticker sheet, release layer and visco-plastic material are laminated by heat and pressure to cure the sticker sheet and thereby bind the first and second metallized dielectric sheets to each other. During the lamination step, the sticker sheet flows to the perimeter of the cavity. However, the pressure forces the visco-plastic material tightly into the cavity to seal a bottom perimeter of the cavity such that the sticker sheet forms a smooth fillet at the bottom perimeter of the cavity.

    摘要翻译： 公开了一种用于制造具有空腔的印刷电路的方法。 该方法包括以下步骤：将贴纸贴在第一金属化电介质层上，并在贴纸上铺设第二金属化电介质层。 第二金属化介电层和贴纸各自具有与形成空腔的另一窗口对准的窗口。 接下来，将柔性释放层铺设在第二金属化介电层上方，并且将热固性粘塑材料铺设在空腔上的释放层上。 接下来，通过热和压力层叠第一和第二金属化电介质层，贴纸，剥离层和粘塑材料，以固化贴纸，从而将第一和第二金属化电介质片材彼此结合。 在层压步骤期间，贴片片流动到空腔的周边。 然而，压力迫使粘塑性材料紧密地进入空腔中以密封空腔的底部周边，使得粘贴片在空腔的底部周边处形成平滑的圆角。

    Method of producing fine-line circuit boards using chemical polishing
    7.
    发明授权
    Method of producing fine-line circuit boards using chemical polishing 失效
    使用化学抛光生产细线电路板的方法

    公开(公告)号：US06547974B1

    公开(公告)日：2003-04-15

    申请号：US08495277

    申请日：1995-06-27

    申请人： Stanley Michael Albrechta ,  Christina Marie Boyko ,  Kathleen Lorraine Covert ,  Natalie Barbara Feilchenfeld ,  Voya Rista Markovich ,  William Earl Wilson ,  Michael Wozniak

    发明人： Stanley Michael Albrechta ,  Christina Marie Boyko ,  Kathleen Lorraine Covert ,  Natalie Barbara Feilchenfeld ,  Voya Rista Markovich ,  William Earl Wilson ,  Michael Wozniak

    IPC分类号： H01B1300

    CPC分类号： H05K3/22 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/0392 ,  H05K2203/1476

    摘要： A printed circuit board is produced by patterning a resist layer according to a circuit mask that defines desired circuit paths. The resist pattern layer is formed by removing the resist from the board in the desired circuit paths and a conductive material is plated onto the board in the resist voids defined by the circuit mask so that the height of the conductive material relative to the substrate equals or exceeds the height of the resist layer relative to the substrate. A low-reactive solution is applied over the conductive material and removes a surface portion of the conductive material. As the solution removes the conductive layer, it forms a film barrier and the solution composition changes, both of which substantially inhibits any further removal of the conductive material. Next, the film barrier is removed from the board allowing another film barrier to form stimulating the removal of further conductive material. The removal step is repeated until the conductive material is at a desired height relative to the height of the resist layer. The board is then finished using conventional circuit board fabrication techniques.

    摘要翻译： 通过根据限定所需电路路径的电路掩模图案化抗蚀剂层来制造印刷电路板。 抗蚀剂图案层通过在所需的电路路径中从基板上去除抗蚀剂而形成，并且导电材料被电镀在由电路掩模限定的抗蚀剂空隙中的基板上，使得导电材料相对于基板的高度等于或等于 超过抗蚀剂层相对于基底的高度。 将低反应性溶液施加在导电材料上并除去导电材料的表面部分。 当溶液去除导电层时，其形成膜阻挡层并且溶液组成发生变化，这两者基本上禁止任何进一步去除导电材料。 接下来，从板上去除膜屏障，允许另一个膜屏障形成刺激去除另外的导电材料。 重复去除步骤，直到导电材料相对于抗蚀剂层的高度处于期望的高度。 然后使用常规电路板制造技术完成电路板。