公开(公告)号：US20080036100A1

公开(公告)日：2008-02-14

申请号：US11435970

申请日：2006-05-17

申请人： Bruce M. McWilliams ,  Belgacem Haba ,  Giles Humpston

发明人： Bruce M. McWilliams ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/58 ,  B23K31/02

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11902 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Elongated solder masses are formed by contacting the molten solder with the walls of holes in a dielectric layer overlying the front face of a chip element such as a wafer. The elongated solder masses have a relatively large aspect ratio, or ratio of height to maximum diameter, and thus provide a high reliability connection with a relatively small diameter compatible with closely spaced contacts on the chip.

摘要翻译： 通过使熔融焊料与位于诸如晶片的芯片元件的前表面上的介电层中的孔的壁接触来形成细长的焊料质量。 细长的焊料质量具有相对较大的纵横比或高度与最大直径的比率，并因此提供与芯片上紧密间隔的触头相兼容的相对较小直径的高可靠性连接。

公开(公告)号：US07298030B2

公开(公告)日：2007-11-20

申请号：US10948976

申请日：2004-09-24

申请人： Bruce M. McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David B. Tuckerman

发明人： Bruce M. McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David B. Tuckerman

IPC分类号： H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US5214844A

公开(公告)日：1993-06-01

申请号：US629731

申请日：1990-12-17

申请人： Bruce M. McWilliams ,  Nicholas E. Brathwaite ,  David B. Tuckerman

发明人： Bruce M. McWilliams ,  Nicholas E. Brathwaite ,  David B. Tuckerman

IPC分类号： H01L23/64 ,  H05K1/16

CPC分类号： H01L23/642 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K1/16 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An assembly structure and process for attaching integrated circuits to multichip modules and attaching the module to a printed circuit board. An epoxy loaded with diamond dust or boron nitride is used to attach the integrated circuit to the module. The dust material increases the thermal conductance of the epoxy for improved heat dissipation without substantially increasing the capacitance of interconnect routed underneath the epoxy. Reverse wedge wire bonding is also used to electrically connect the integrated circuit to the module allowing greater chip densities on the module surface. The chip/module assembly can then be mounted on a printed circuit board and the module leads wired directly to the board.

摘要翻译： 一种用于将集成电路连接到多芯片模块并将模块附接到印刷电路板的组装结构和工艺。 使用装有金刚石粉或氮化硼的环氧树脂将集成电路连接到模块。 粉尘材料增加了环氧树脂的热传导，从而改善了散热性能，而基本上不增加环氧树脂下方布线的互连电容。 反向楔形线接合也用于将集成电路电连接到模块，从而允许模块表面上的更大的芯片密度。 芯片/模块组件然后可以安装在印刷电路板上，模块直接连接到电路板上。

公开(公告)号：US07566853B2

公开(公告)日：2009-07-28

申请号：US11317207

申请日：2005-12-23

申请人： David B. Tuckerman ,  Kenneth Allen Honer ,  Bruce M. McWilliams ,  Nicholas J. Colella ,  Charles Liam Goudge

发明人： David B. Tuckerman ,  Kenneth Allen Honer ,  Bruce M. McWilliams ,  Nicholas J. Colella ,  Charles Liam Goudge

IPC分类号： H01L27/00

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L2924/0002 ,  H04N5/3415 ,  H04N9/045 ,  H04N9/09 ,  H01L2924/00

摘要： Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

摘要翻译： 提供了在检测器层中具有多个光电检测器的图像传感器。可选地，为背照式传感器架构提供光学透明基板。 光电检测器可以被布置成三个或更多个阵列。 通常，每个阵列是连续的并且与不同颜色和/或波长的光相关联。 此外，阵列可以是共面的，或者在替代方案中，以至少部分不重叠的方式位于与光接收表面增加的距离处。 还提供了图像传感器封装。