METHOD OF FORMING GROUP IV SEMICONDUCTOR JUNCTIONS USING LASER PROCESSING
    7.
    发明申请
    METHOD OF FORMING GROUP IV SEMICONDUCTOR JUNCTIONS USING LASER PROCESSING 审中-公开
    使用激光加工形成IV族半导体结的方法

    公开(公告)号:US20080305619A1

    公开(公告)日:2008-12-11

    申请号:US12114141

    申请日:2008-05-02

    IPC分类号: H01L21/20 H01L21/02

    摘要: A method forming a Group IV semiconductor junction on a substrate is disclosed. The method includes depositing a first set Group IV semiconductor nanoparticles on the substrate. The method also includes applying a first laser at a first laser wavelength, a first fluence, a first pulse duration, a first number of repetitions, and a first repetition rate to the first set Group IV semiconductor nanoparticles to form a first densified film with a first thickness, wherein the first laser wavelength and the first fluence are selected to limit a first depth profile of the first laser to the first thickness. The method further includes depositing a second set Group IV semiconductor nanoparticles on the first densified film. The method also includes applying a second laser at a second laser wavelength, a second fluence, a second pulse duration, a second number of repetitions, and a second repetition rate to the second set Group IV semiconductor nanoparticles to form a second densified film with a second thickness, wherein the second laser wavelength and the second fluence are selected to limit a second depth profile of the second laser to the second thickness.

    摘要翻译: 公开了一种在衬底上形成IV族半导体结的方法。 该方法包括在衬底上沉积第一组IV族半导体纳米颗粒。 该方法还包括将第一激光波长的第一激光,第一注量,第一脉冲持续时间,第一次重复和第一重复率应用于第一组IV族半导体纳米颗粒,以形成第一致密化膜,其具有 第一厚度,其中选择第一激光波长和第一注量以将第一激光器的第一深度分布限制到第一厚度。 该方法还包括在第一致密化膜上沉积第二组IV族半导体纳米颗粒。 该方法还包括将第二激光器以第二激光波长,第二注量,第二脉冲持续时间,第二数量的重复和第二重复率施加到第二组IV族半导体纳米颗粒以形成第二致密化膜,其具有 第二厚度,其中选择第二激光波长和第二注量以将第二激光器的第二深度分布限制到第二厚度。

    METHOD OF FABRICATING A DENSIFIED NANOPARTICLE THIN FILM WITH A SET OF OCCLUDED PORES
    8.
    发明申请
    METHOD OF FABRICATING A DENSIFIED NANOPARTICLE THIN FILM WITH A SET OF OCCLUDED PORES 审中-公开
    用一组封闭的聚四氟乙烯薄膜制造方法

    公开(公告)号:US20080138966A1

    公开(公告)日:2008-06-12

    申请号:US11940056

    申请日:2007-11-14

    IPC分类号: H01L21/208

    摘要: A method of fabricating a densified nanoparticle thin film with a set of occluded pores in a chamber is disclosed. The method includes positioning a substrate in the chamber; and depositing a nanoparticle ink, the nanoparticle ink including a set of Group IV semiconductor particles and a solvent. The method further includes heating the nanoparticle ink to a first temperature between about 30° C. and about 300° C., and for a first time period between about 5 minutes and about 60 minutes, wherein the solvent is substantially removed, and a porous compact with a set of pores is formed. The method also includes heating the porous compact to a second temperature between about 300° C. and about 900° C., and for a second time period of between about 5 minutes and about 15 minutes, and flowing a precursor gas into the chamber at a partial pressure between about 0.1 Torr and about 50 Torr, wherein the precursor gas substantially fills the set of pores, and wherein the densified nanoparticle film with the set of occluded pores is formed.

    摘要翻译: 公开了一种在腔室中制造具有一组闭塞孔的致密纳米颗粒薄膜的方法。 该方法包括将衬底定位在腔室中; 以及沉积纳米颗粒油墨,所述纳米颗粒油墨包括一组IV族半导体颗粒和溶剂。 该方法还包括将纳米颗粒油墨加热至约30℃至约300℃之间的第一温度和约5分钟至约60分钟的第一时间,其中基本上除去溶剂,并且将多孔 形成一组细孔。 该方法还包括将多孔压块加热至约300℃至约900℃之间的第二温度和约5分钟至约15分钟的第二时间段,并将前体气体流入室中 在约0.1托和约50托之间的分压,其中前体气体基本上填充该组孔,并且其中形成具有该组闭塞孔的致密纳米颗粒膜。