公开(公告)号：US07324254B2

公开(公告)日：2008-01-29

申请号：US11253925

申请日：2005-10-18

申请人： Cynthia S. Bell ,  Kenneth E. Salsman ,  Henning Braunisch

发明人： Cynthia S. Bell ,  Kenneth E. Salsman ,  Henning Braunisch

IPC分类号： G02B26/00

CPC分类号： G02B3/0056 ,  G02B3/0006 ,  G02B3/0062 ,  G02B26/0841 ,  H04N9/3152

摘要： Micro-displays used for front or rear projection systems as well as near-eye viewing systems may be enhanced using embodiments of the present invention. In one embodiment, the invention may include an array of micromechanical optical modulators, an electronic control system for operating the optical modulators in accordance with a received video signal, and an overlayer for the array of modulators to modify the fill factor for incident light on the array of modulators, the incident light corresponding to at least one color constituent of a video signal.

摘要翻译： 可以使用本发明的实施例来增强用于前投影系统或后投影系统以及近眼观察系统的微显示器。 在一个实施例中，本发明可以包括微机械光学调制器的阵列，用于根据接收到的视频信号来操作光调制器的电子控制系统，以及用于调制器阵列的覆盖层，用于修改入射光的填充因子 调制器阵列，入射光对应于视频信号的至少一种颜色成分。

公开(公告)号：US07180646B2

公开(公告)日：2007-02-20

申请号：US10815412

申请日：2004-03-31

申请人： Cynthia S. Bell ,  Kenneth E. Salsman ,  Henning Braunisch

发明人： Cynthia S. Bell ,  Kenneth E. Salsman ,  Henning Braunisch

IPC分类号： G02B26/00

CPC分类号： G02B3/0056 ,  G02B3/0006 ,  G02B3/0062 ,  G02B26/0841 ,  H04N9/3152

摘要： Micro-displays used for front or rear projection systems as well as near-eye viewing systems may be enhanced using embodiments of the present invention. In one embodiment, the invention may include an array of micromechanical optical modulators, an electronic control system for operating the optical modulators in accordance with a received video signal, and an overlayer for the array of modulators to modify the fill factor for incident light on the array of modulators, the incident light corresponding to at least one color constituent of a video signal.

摘要翻译： 可以使用本发明的实施例来增强用于前投影系统或后投影系统以及近眼观察系统的微显示器。 在一个实施例中，本发明可以包括微机械光学调制器的阵列，用于根据接收到的视频信号来操作光调制器的电子控制系统，以及用于调制器阵列的覆盖层，用于修改入射光的填充因子 调制器阵列，入射光对应于视频信号的至少一种颜色成分。

公开(公告)号：US09391427B2

公开(公告)日：2016-07-12

申请号：US13698453

申请日：2011-11-18

申请人： Feras Eid ,  Shawna M. Liff ,  Henning Braunisch

发明人： Feras Eid ,  Shawna M. Liff ,  Henning Braunisch

IPC分类号： H01S5/024 ,  H01S5/022 ,  H01S5/183 ,  H01S5/42

CPC分类号： H01S5/02476 ,  H01S5/02236 ,  H01S5/183 ,  H01S5/423

摘要： Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip.

摘要翻译： 提供了垂直腔表面发射激光（VCSEL）芯片的热管理系统。 本发明的实施例提供了具有设置在衬底表面上并与衬底电互连的垂直腔表面发射激光器芯片的衬底，设置在衬底表面上并且靠近垂直腔表面发射激光器芯片的至少三个侧面的热框架， 以及设置在垂直腔表面发射激光芯片和热框架的至少三个侧面之间的热界面材料。 衬底还可以包括可操作地耦合到另一集成电路芯片并且能够驱动VCSEL芯片的收发器芯片。

公开(公告)号：US09310553B2

公开(公告)日：2016-04-12

申请号：US13995136

申请日：2011-11-16

申请人： Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang

发明人： Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/46

CPC分类号： G02B6/4261 ,  G02B6/12 ,  G02B6/4201 ,  G02B6/4239 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4257 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4292 ,  G02B6/46 ,  Y10T29/49128

摘要： Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.

公开(公告)号：US20140203175A1

公开(公告)日：2014-07-24

申请号：US13996531

申请日：2011-12-30

申请人： Mauro J. Kobrinsky ,  Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang ,  Bruce A. Block ,  Johanna M. Swan

发明人： Mauro J. Kobrinsky ,  Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang ,  Bruce A. Block ,  Johanna M. Swan

IPC分类号： H04B10/25 ,  G02B6/12

CPC分类号： G02B6/12004 ,  G02B6/12 ,  G02B6/30 ,  G02B6/4214 ,  G02B6/4257 ,  G02B6/428 ,  G02B2006/12061 ,  G02B2006/12121 ,  G02B2006/12123 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/167 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83048 ,  H01L2224/83102 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15312 ,  H04B10/25 ,  H04B10/40 ,  H04B10/801 ,  H01L2924/00014 ,  H01L2924/014

摘要： Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.

摘要翻译： 光子元件放置在处理器封装上，使光信号靠近处理器管芯。 处理器封装包括处理器管芯耦合到其上的基板，并且允许处理器管芯连接到印刷电路板。 处理器封装还包括收发器逻辑，电光转换电路和光耦合器。 电光转换电路可以包括激光器，调制器和用于发射和接收光信号的光电检测器。 耦合器连接到从处理器封装延伸的光纤。 多个光纤可以被带到处理器封装，允许与处理器的可扩展的高速，高带宽互连。

公开(公告)号：US07989946B2

公开(公告)日：2011-08-02

申请号：US12882322

申请日：2010-09-15

申请人： Henning Braunisch ,  Kemal Aygun

发明人： Henning Braunisch ,  Kemal Aygun

IPC分类号： H01L23/48

CPC分类号： H05K1/0243 ,  H01L23/367 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/182 ,  H05K3/222 ,  H05K2201/10356 ,  H05K2201/10492 ,  H05K2201/10704 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2224/0401

摘要： A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point.

摘要翻译： 具有至少两个端点的多模系统可以包括在一些实施例中是多模电缆或多模板并且可插​​拔地连接到每个端点处的封装的多模信令路径。 每个端点可以包括耦合到插座的处理器管芯封装。 插座还可以接收将电缆耦合到封装的连接器。 电源信号和输入/输出信号可以在每个端点解耦。

公开(公告)号：US07507604B2

公开(公告)日：2009-03-24

申请号：US12044239

申请日：2008-03-07

申请人： Daoqiang Lu ,  Henning Braunisch

发明人： Daoqiang Lu ,  Henning Braunisch

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构， 各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

公开(公告)号：US07280024B2

公开(公告)日：2007-10-09

申请号：US11050379

申请日：2005-02-02

申请人： Henning Braunisch

发明人： Henning Braunisch

IPC分类号： H01F5/00

CPC分类号： H01L23/49822 ,  H01F17/0006 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/645 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2224/0401

摘要： A microelectronic assembly including a die substrate, a plurality of electronic components formed in and on the die substrate and connected to one another to form an integrated circuit, a first and a second single-turn inductor, and a magnetic material electro-magnetically coupling the first and the second single-turn inductor to one another to form a transformer, the transformer being connected to the integrated circuit.

摘要翻译： 一种微电子组件，包括管芯基板，形成在管芯基板中和管芯基板上并且彼此连接以形成集成电路的多个电子部件，第一和第二单匝电感器以及磁 - 电耦合 第一和第二单匝电感器彼此形成变压器，变压器连接到集成电路。

公开(公告)号：US20070069333A1

公开(公告)日：2007-03-29

申请号：US11554567

申请日：2006-10-30

申请人： Ankur Crawford ,  Henning Braunisch ,  Rajendran Nair ,  Gilroy Vandentop ,  Shan Wang

发明人： Ankur Crawford ,  Henning Braunisch ,  Rajendran Nair ,  Gilroy Vandentop ,  Shan Wang

IPC分类号： H01L29/00

CPC分类号： H01L23/645 ,  H01F17/0033 ,  H01F41/046 ,  H01L23/49822 ,  H01L28/10 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/4644 ,  H05K2201/086 ,  H05K2201/09563 ,  H01L2224/0401

摘要： An inductor structure comprised of a magnetic section and a single turn solenoid The single turn solenoid to contain within a portion of the magnetic section and circumscribed by the magnetic section.

摘要翻译： 由磁性部分和单匝螺线管组成的电感器结构单转螺线管包含在磁性部分的一部分内并由磁性部分限定。

公开(公告)号：US20060251360A1

公开(公告)日：2006-11-09

申请号：US11124033

申请日：2005-05-06

申请人： Daoqiang Lu ,  Gilroy Vandentop ,  Henning Braunisch

发明人： Daoqiang Lu ,  Gilroy Vandentop ,  Henning Braunisch

IPC分类号： G02B6/36

CPC分类号： G02B6/4232 ,  G02B6/4214 ,  G02B6/4292 ,  G02B6/43 ,  H01L2224/16225 ,  H05K1/0274 ,  H05K3/3436

摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.

摘要翻译： 光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。 连接器不包括光学部件。 定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。