公开(公告)号：US08564936B2

公开(公告)日：2013-10-22

申请号：US12675936

申请日：2008-10-06

Applicant: Daisuke Ejima

Inventor： Daisuke Ejima

IPC: H05K5/00 ,  H05K7/00 ,  G06F3/02 ,  H04M1/00

CPC classification number: H04M1/0237 ,  H04M1/0233

Abstract: To reduce the thickness and improve the operability. It includes a first housing and a second housing placed on top of each other, and connecting means to connect the first and second housings, the connecting means being interposed between the first and second housings, wherein the connecting means engages with the first housing so as to be slidable in at least one direction with respect to the first housing, and engages with the second housing so as to be rotatable with respect to the second housing.

Abstract translation: 减小厚度，提高可操作性。 它包括彼此顶部放置的第一壳体和第二壳体，以及用于连接第一和第二壳体的连接装置，连接装置设置在第一和第二壳体之间，其中连接装置与第一壳体接合，以便 能够相对于第一壳体在至少一个方向上滑动，并且与第二壳体接合以能够相对于第二壳体旋转。

公开(公告)号：US08435527B2

公开(公告)日：2013-05-07

申请号：US13306087

申请日：2011-11-29

Applicant: Ryosuke Yumioka ,  Daisuke Ejima ,  Tsutomu Arakawa

Inventor： Ryosuke Yumioka ,  Daisuke Ejima ,  Tsutomu Arakawa

IPC: A61K39/395

CPC classification number: C07K16/065 ,  C07K1/22 ,  C07K16/2845 ,  C07K16/36 ,  C07K2317/24

Abstract: The present invention provides a method of purifying an antibody by protein A affinity chromatography. More specifically, the present invention provides a technique relating to an elution buffer solution which provides a good antibody recovery rate without denaturation.

Abstract translation: 本发明提供了通过蛋白A亲和层析纯化抗体的方法。 更具体地，本发明提供了一种提供良好抗体回收率而不变性的洗脱缓冲溶液的技术。

公开(公告)号：US20110077384A1

公开(公告)日：2011-03-31

申请号：US12941272

申请日：2010-11-08

Applicant: Ryosuke Yumioka ,  Daisuke Ejima

Inventor： Ryosuke Yumioka ,  Daisuke Ejima

IPC: C07K16/00 ,  C07K14/00

CPC classification number: C07K14/5412 ,  C07K1/1136 ,  C07K1/145 ,  C07K14/475 ,  C07K16/18 ,  C07K16/44 ,  C07K2317/569 ,  C07K2317/64 ,  C12N9/104 ,  C12N9/1044

Abstract: The present invention provides a method for producing a protein which has a restored native higher-order structure by bringing a protein which has lost its native higher-order structure into contact at pH 6.5 to 9.0 with a 1 to 3% aqueous solution of a specific surfactant, such as lauroylglutamic acid to obtain a solubilized solution of the protein; and then adding the solubilized solution to a buffer with pH 6.5 to 9.0 containing arginine or an arginine derivative at a concentration of 0.1 to 1.2 M to lower the concentration of the specific surfactant, such as lauroylglutamic acid, in the obtained mixture solution down to 0.02 to 0.275%. According to the present invention, it is possible to easily restore the native higher-order structure of a protein while smoothly removing the surfactant from the protein.

Abstract translation: 本发明提供一种生产蛋白质的方法，该蛋白质具有恢复的天然高级结构，通过使具有1至3％的特异性的1％至3％的水溶液使具有失去其天然高级结构的蛋白质在pH 6.5至9.0下接触 表面活性剂如月桂酰谷氨酸以获得蛋白质的溶解溶液; 然后将溶解的溶液加入到含有浓度为0.1至1.2M的精氨酸或精氨酸衍生物的pH6.5至9.0的缓冲液中以将得到的混合溶液中的特定表面活性剂如月桂酰谷氨酸的浓度降至0.02 至0.275％。 根据本发明，可以容易地恢复蛋白质的天然高级结构，同时平滑地从蛋白质中除去表面活性剂。

公开(公告)号：US07635912B2

公开(公告)日：2009-12-22

申请号：US12104660

申请日：2008-04-17

Applicant: Daisuke Ejima

Inventor： Daisuke Ejima

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a

Abstract translation: 覆盖布线基板上的半导体芯片的树脂层由第一树脂层和第二树脂层构成，其中第一树脂层和第二树脂层的平面图形不同，满足a

公开(公告)号：US20080318300A1

公开(公告)日：2008-12-25

申请号：US12030321

申请日：2008-02-13

Applicant: Hajime Koyama ,  Tsutomu Arakawa ,  Daisuke Ejima

Inventor： Hajime Koyama ,  Tsutomu Arakawa ,  Daisuke Ejima

IPC: C12N7/00

CPC classification number: A01N47/44 ,  A23L3/3508 ,  A23V2002/00 ,  A61K31/198 ,  A61K2039/5252 ,  C12N7/00 ,  C12N7/04 ,  C12N7/06 ,  C12N2710/16663 ,  C12N2760/16163 ,  C12N2760/18863 ,  A23V2200/10 ,  A23V2250/0606

Abstract: The present invention provides a method for conveniently producing a protein formulation in which viruses are inactivated, without impairing the quality of the obtained protein formulation, characterized by including the step of exposing the protein formulation contaminated with the viruses to a 0.1-2M aqueous solution of arginine, an arginine derivative, or a mixture thereof, the aqueous solution being adjusted to pH 3.5 to 5. The present invention also provides a virus inactivation method characterized by including the step of contacting a virus-containing object with a 0.1-2M aqueous solution of arginine, an arginine derivative, or a mixture thereof, the aqueous solution being adjusted to pH 3.5 to 5.

Abstract translation: 本发明提供了一种方便地制备其中病毒灭活而不损害所获得的蛋白质制剂的质量的蛋白质制剂的方法，其特征在于包括将被病毒污染的蛋白质制剂暴露于0.1-2M的 精氨酸，精氨酸衍生物或其混合物，将该水溶液调节至pH 3.5至5.本发明还提供了一种病毒灭活方法，其特征在于包括使病毒含有物体与0.1-2M水溶液接触的步骤 的精氨酸，精氨酸衍生物或其混合物，将该水溶液调节至pH 3.5至5。

公开(公告)号：US20070246818A1

公开(公告)日：2007-10-25

申请号：US11790081

申请日：2007-04-23

Applicant: Daisuke Ejima ,  Tsuyoshi Kida ,  Hiroshi Yamashita

Inventor： Daisuke Ejima ,  Tsuyoshi Kida ,  Hiroshi Yamashita

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2224/81825 ,  H01L2224/85444 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/3841 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor module includes a wiring board having a bottom surface and a top surface. A first solder electrode terminal has a given melting point, and is provided on the bottom surface of the wiring board. An electrode pad is provided on or above the top surface of the wiring board, and a second solder electrode terminal is soldered to the electrode pad at a temperature corresponding to the given melting point of the first solder electrode terminal by using a reflow process. The second solder electrode terminal contains an additional metal powder component diffused therein when being soldered to the electrode pad.

Abstract translation: 半导体模块包括具有底表面和顶表面的布线板。 第一焊料电极端子具有给定的熔点，并且设置在布线板的底表面上。 在布线板的上表面上或上方设置电极焊盘，通过使用回流工序，在与第一焊料电极端子的给定熔点相对应的温度下将第二焊料电极端子焊接到电极焊盘。 当焊接到电极焊盘时，第二焊料电极端子包含扩散在其中的另外的金属粉末组分。

公开(公告)号：US08925152B2

公开(公告)日：2015-01-06

申请号：US13057848

申请日：2009-09-15

Applicant: Daisuke Ejima

Inventor： Daisuke Ejima

IPC: E05F1/08 ,  H04M1/02

CPC classification number: H04M1/0216 ,  H04M1/0227 ,  Y10T16/538 ,  Y10T16/53832 ,  Y10T16/53888 ,  Y10T16/558

Abstract: A folding portable device in which a first case and a second case are foldably connected and which can be opened by a simple operation even when a thickness of the case is reduced includes support means for supporting the first case with respect to the second case in a relatively displaceable manner within a specified range and opening assistance means of which an open lock is unlocked when the first case is displaced more than a predetermined amount.

Abstract translation: 一种折叠便携式装置，其中第一壳体和第二壳体可折叠地连接，并且即使当壳体的厚度减小时也可以通过简单的操作来打开，包括用于相对于第二壳体在第一壳体中支撑第一壳体的支撑装置 在规定范围内可相对移动的方式和打开辅助装置，当第一壳体移动超过预定量时，打开辅助装置打开锁定。

公开(公告)号：US08669045B2

公开(公告)日：2014-03-11

申请号：US12030321

申请日：2008-02-13

Applicant: Hajime Koyama ,  Tsutomu Arakawa ,  Daisuke Ejima

Inventor： Hajime Koyama ,  Tsutomu Arakawa ,  Daisuke Ejima

IPC: C12Q1/70

CPC classification number: A01N47/44 ,  A23L3/3508 ,  A23V2002/00 ,  A61K31/198 ,  A61K2039/5252 ,  C12N7/00 ,  C12N7/04 ,  C12N7/06 ,  C12N2710/16663 ,  C12N2760/16163 ,  C12N2760/18863 ,  A23V2200/10 ,  A23V2250/0606

Abstract: The present invention provides a method for conveniently producing a protein formulation in which viruses are inactivated, without impairing the quality of the obtained protein formulation, characterized by including the step of exposing the protein formulation contaminated with the viruses to a 0.1-2M aqueous solution of arginine, an arginine derivative, or a mixture thereof, the aqueous solution being adjusted to pH 3.5 to 5. The present invention also provides a virus inactivation method characterized by including the step of contacting a virus-containing object with a 0.1-2M aqueous solution of arginine, an arginine derivative, or a mixture thereof, the aqueous solution being adjusted to pH 3.5 to 5.

Abstract translation: 本发明提供了一种方便地制备其中病毒灭活而不损害所获得的蛋白质制剂的质量的蛋白质制剂的方法，其特征在于包括将被病毒污染的蛋白质制剂暴露于0.1-2M的 精氨酸，精氨酸衍生物或其混合物，将该水溶液调节至pH 3.5至5.本发明还提供了一种病毒灭活方法，其特征在于包括使病毒含有物体与0.1-2M水溶液接触的步骤 的精氨酸，精氨酸衍生物或其混合物，将该水溶液调节至pH 3.5至5。

公开(公告)号：US20070278677A1

公开(公告)日：2007-12-06

申请号：US11783422

申请日：2007-04-09

Applicant: Daisuke Ejima ,  Tsuyoshi Kida

Inventor： Daisuke Ejima ,  Tsuyoshi Kida

IPC: H01L23/488

CPC classification number: H05K3/3463 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K2201/045 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a semiconductor module including a wiring board having a top surface and a bottom surface, a passive element device Is soldered on the top surface of the wiring board by a first solder material, and an external solder electrode terminal is adhered on the bottom surface of the wiring board and made of a second solder material. The first solder material has a higher melting point than that of the second solder material.

Abstract translation: 在包括具有顶表面和底表面的布线板的半导体模块中，无源元件装置通过第一焊料材料焊接在布线板的顶表面上，并且外部焊料电极端子粘附在 接线板，由第二焊料制成。 第一焊料材料具有比第二焊料材料更高的熔点。

公开(公告)号：US20070164445A1

公开(公告)日：2007-07-19

申请号：US11650459

申请日：2007-01-08

Applicant: Daisuke Ejima

Inventor： Daisuke Ejima

IPC: H01L23/52

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/10 ,  H01L24/13 ,  H01L25/105 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09772 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Aiming at adjusting the height of bump electrodes connected to lands on a substrate, a semiconductor device 100 has a first interconnect substrate 103 and a second interconnect substrate 101. On one surface of these substrates, first lands 111 and second lands 113 are provided. The plane geometry of the second lands 113 is a polygon characterized by the inscribed circle thereof having an area smaller than the area of the inscribed circle of the first land.

Abstract translation: 为了调整连接到衬底上的焊盘的凸起电极的高度，半导体器件100具有第一互连衬底103和第二互连衬底101。 在这些基板的一个表面上，设置有第一焊盘111和第二焊盘113。 第二平台113的平面几何形状是其内接圆的面积小于第一平台的内切圆的面积的多边形。