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公开(公告)号：US20110293917A1
公开(公告)日：2011-12-01
申请号：US13115349
申请日：2011-05-25
CPC分类号： B01D29/05 , B01D67/0046 , B01D67/0058 , B01D67/0095 , B01D71/02 , B01D71/024 , B01D71/025 , B01D71/027 , B01D71/028 , B01D2325/04 , Y10T428/249981
摘要： A method is provided for making a porous inorganic membrane by using a mixture of an inorganic material, organic polymer particles and a solvent to form a slurry, the particles being non-spherical, distributing the slurry onto a surface, drying the slurry to remove the solvent and firing the dried slurry to produce the porous inorganic membrane. Examples of organic polymer particles include particles of acrylic. A substrate with a porous inorganic membrane disposed on the substrate is also provided, the inorganic membrane having an average thickness of from about 0.5 micron to about 30 microns, a porosity of from about 30% to about 65%, a median pore size (d50) of from about 0.01 micron to about 1 micron, and a value of (d90−d10)/d50 less than about 2, as measured by mercury porosimetry. An example of a substrate includes an inorganic porous support.
摘要翻译： 提供了一种通过使用无机材料，有机聚合物颗粒和溶剂的混合物来制造多孔无机膜以形成浆料的方法，该颗粒是非球形的，将浆料分布在表面上，干燥浆料以除去 溶剂并焙烧干燥的浆料以产生多孔无机膜。 有机聚合物颗粒的实例包括丙烯酸颗粒。 还提供了具有设置在基底上的多孔无机膜的基底，无机膜的平均厚度为约0.5微米至约30微米，孔隙率为约30％至约65％，中值孔径（d50 ）为约0.01微米至约1微米，并且通过水银孔率法测定的值（d90-d10）/ d50小于约2。 基材的实例包括无机多孔载体。
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2.发明授权Capture compounds for electronic plating compositions and electronic packaging device manufacture 失效捕获电子电镀组合物和电子封装装置制造的化合物公开(公告)号：US06916741B2
公开(公告)日：2005-07-12
申请号：US09850911
申请日：2001-05-08
CPC分类号： C23C18/31 , C23C18/1834 , C23C18/2066 , C25D3/02 , C25D5/34 , H05K3/181 , H05K3/185 , Y10T428/31504
摘要： The invention relates to use of capture compounds such as a crown ether to facilitate selected compositions and processes employed in manufacture of electronic packaging devices such as printed circuit boards, semiconductor integrated circuit systems, multichip modules, lead frames and other interconnection devices, flat panel display substrates, and the like.
摘要翻译： 本发明涉及捕获化合物如冠醚的用途，以促进用于制造诸如印刷电路板，半导体集成电路系统，多芯片模块，引线框和其它互连装置的电子封装装置中使用的所选组合物和方法，平板显示器 底物等。
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3.发明授权
公开(公告)号：US5900346A
公开(公告)日：1999-05-04
申请号：US808063
申请日：1997-02-28
CPC分类号： G03F7/0045 , G03F7/038 , Y10S430/115 , Y10S430/116 , Y10S430/122 , Y10S430/127
摘要： The present invention relates to novel compositions that contain an activator system that comprises a photoactivator, acid generator and chain extender. Methods and articles of manufacture that comprise such compositions are also provided. In a preferred aspect, the compositions are photoimageable.
摘要翻译： 本发明涉及包含光活化剂，酸发生剂和扩链剂的活化剂体系的新型组合物。 还提供了包含这种组合物的方法和制品。 在优选的方面，组合物是可光成像的。
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公开(公告)号：US5500315A
公开(公告)日：1996-03-19
申请号：US317347
申请日：1994-10-04
IPC分类号： B05D1/18 , C09D4/00 , C12N5/00 , C23C18/16 , C23C18/20 , C23C18/28 , C40B60/14 , G03F7/004 , G06N3/00 , G06N99/00 , H01L21/288 , H05K3/18 , G03C5/58 , G03F7/038
CPC分类号： G06N99/007 , B05D1/185 , B82Y10/00 , B82Y30/00 , B82Y40/00 , B82Y5/00 , C09D4/00 , C12N5/0068 , C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/30 , C23C18/31 , G03F7/004 , G06N3/002 , H01L21/288 , H01L21/2885 , H05K3/185 , B01J2219/00432 , B01J2219/00603 , B01J2219/00605 , B01J2219/00612 , B01J2219/00617 , B01J2219/00626 , B01J2219/00637 , B01J2219/00659 , B01J2219/00711 , C12N2535/10 , C40B60/14 , Y10T428/24917 , Y10T428/31536
摘要： Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
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公开(公告)号：US5203911A
公开(公告)日：1993-04-20
申请号：US719979
申请日：1991-06-24
CPC分类号： C23C18/52
摘要： A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
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公开(公告)号：US5627010A
公开(公告)日：1997-05-06
申请号：US228187
申请日：1994-04-15
IPC分类号： C08G59/40 , C08G59/00 , C08L63/00 , G03F7/004 , G03F7/038 , H05K3/28 , G03C1/73 , G03F7/031 , G03F7/032
CPC分类号： G03F7/038 , G03F7/0045
摘要： A radiation sensitive composition, process for using said composition, and substrates coated with said composition. The photoimageable composition comprises a photobase generator compound, a resin binder and a material capable of crosslinking in the presence of base. In preferred aspects, the invention provides a negative-acting, aqueous developable photoimageable composition comprising a photobase generator compound, a resin binder which preferably is a phenolic polymer, a crosslinking agent that comprises one or more active groups that will undergo base-initiated crosslinking, and a curing agent.
摘要翻译： 辐射敏感组合物，使用所述组合物的方法和用所述组合物涂覆的基材。 可光成像组合物包含光碱产生剂化合物，树脂粘合剂和能够在碱存在下交联的材料。 在优选的方面，本发明提供一种负性水性可显影的可光成像组合物，其包含光碱产生剂化合物，优选为酚类聚合物的树脂粘合剂，包含一种或多种将经历碱引发交联的活性基团的交联剂， 和固化剂。
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公开(公告)号：US5510216A
公开(公告)日：1996-04-23
申请号：US520554
申请日：1995-08-29
申请人： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
发明人： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
IPC分类号： C23F1/00 , C23C18/16 , C23C18/31 , C23F4/00 , G03F7/40 , H01L21/288 , H05K3/06 , H05K3/18 , G03F7/16
CPC分类号： C23C18/1605 , C23C18/1608 , C23C18/1689 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , G03F7/40
摘要： The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
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公开(公告)号：US5468597A
公开(公告)日：1995-11-21
申请号：US111640
申请日：1993-08-25
申请人： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
发明人： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
IPC分类号： C23F1/00 , C23C18/16 , C23C18/31 , C23F4/00 , G03F7/40 , H01L21/288 , H05K3/06 , H05K3/18 , G03F7/00
CPC分类号： C23C18/1605 , C23C18/1608 , C23C18/1689 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , G03F7/40
摘要： The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
摘要翻译： 本发明涉及一种以选择性图案图案化衬底的方法。 在一个实施例中，该方法包括以下步骤：在衬底表面上形成图案化的涂层，由此衬底的部分被图案化的涂层覆盖，并且衬底的部分保持未涂覆。 在至少那些没有图案化涂层的基底部分上涂覆一层结扎材料。 连接层是能够与无电镀金属催化剂连接的结合层。 然后将如此形成的制品与无电金属化催化剂接触，然后与化学镀溶液接触，以在衬底上形成图案化的金属沉积物。
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公开(公告)号：US5389496A
公开(公告)日：1995-02-14
申请号：US62706
申请日：1993-05-17
IPC分类号： B05D1/18 , C09D4/00 , C12N5/00 , C23C18/16 , C23C18/20 , C23C18/28 , C40B60/14 , G03F7/004 , G06N3/00 , G06N99/00 , H01L21/288 , H05K3/18 , G03C5/00
CPC分类号： G06N99/007 , B05D1/185 , B82Y10/00 , B82Y30/00 , B82Y40/00 , B82Y5/00 , C09D4/00 , C12N5/0068 , C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/30 , C23C18/31 , G03F7/004 , G06N3/002 , H01L21/288 , H01L21/2885 , H05K3/185 , B01J2219/00432 , B01J2219/00603 , B01J2219/00605 , B01J2219/00612 , B01J2219/00617 , B01J2219/00626 , B01J2219/00637 , B01J2219/00659 , B01J2219/00711 , C12N2535/10 , C40B60/14 , Y10T428/24917 , Y10T428/31536
摘要： Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
摘要翻译： 无电镀金属化的方法和组成。 在一个方面，本发明的特征在于使用能够与无电金属化催化剂连接的化学基团，包括使用化学结合到基底上的连接基团。 在优选的方面，本发明提供了一种用于选择性金属化而不使用常规光致抗蚀剂图案化顺序的装置，使得能够以直接且方便的方式制造高分辨率金属图案。
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公开(公告)号：US4533443A
公开(公告)日：1985-08-06
申请号：US543574
申请日：1983-10-19
IPC分类号： C25B1/30
CPC分类号： C25B1/30
摘要： Methods, materials and apparatus for production of hydrogen peroxide are disclosed. In one preferred embodiment, high surface area circulating elements derivatized with a quinone catalyst are reduced in an electrolytic cell where the cathode may also be derivatized with a quinone catalyst and a solution quinone at low concentration is used as a mediator. Once reduced, the circulating elements are separated and used to form hydrogen peroxide from molecular oxygen in an aqueous, electrolyte-free, environment. The circulating elements can be cycled repeatedly. Particular, novel naphthoquinone compounds are also disclosed.
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