公开(公告)号：US07059049B2

公开(公告)日：2006-06-13

申请号：US10253725

申请日：2002-09-24

申请人： Donald S. Farquhar ,  James D. Herard ,  Michael J. Klodowski ,  David Questad ,  Der-jin Woan

发明人： Donald S. Farquhar ,  James D. Herard ,  Michael J. Klodowski ,  David Questad ,  Der-jin Woan

IPC分类号： H01K3/10

CPC分类号： H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.

摘要翻译： 电子封装和形成方法。 提供具有第一和第二相对表面的导热层。 第一电介质层在加压下被层压在导热层的第一相对表面上，温度在最低温度T 1 1MIN和最高温度T 1MAX之间。 在层压之后，T 1MAX 3将第一介电层的延展性约束至少为D 1。 T 1MAX取决于D 1和在由第一介电层组成的第一电介质材料上。 在加压下将第二电介质层在导热层的第二相对表面上，在最低温度T 2 M 2 N 2和最大温度T 2 MAX之间的温度下层压。 在层压之后，T 2MAX 2将第二介电层的延展性约束为至少D 2。 T 2MAX取决于D 2和在由第二介电层组成的第二电介质材料上。

公开(公告)号：US07329816B2

公开(公告)日：2008-02-12

申请号：US11148890

申请日：2005-06-08

申请人： Donald S. Farquhar ,  James D. Herard ,  Michael J. Klodowski ,  David Questad ,  Der-jin Woan

发明人： Donald S. Farquhar ,  James D. Herard ,  Michael J. Klodowski ,  David Questad ,  Der-jin Woan

IPC分类号： H05K1/16

CPC分类号： H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.

摘要翻译： 电子封装和形成方法。 提供具有第一和第二相对表面的导热层。 第一电介质层在加压下被层压在导热层的第一相对表面上，温度在最低温度T 1 1MIN和最高温度T 1MAX之间。 在层压之后，T 1MAX 3将第一介电层的延展性约束至少为D 1。 T 1MAX取决于D 1和在由第一介电层组成的第一电介质材料上。 在加压下将第二电介质层在导热层的第二相对表面上，在最低温度T 2 M 2 N 2和最大温度T 2 MAX之间的温度下层压。 在层压之后，T 2MAX 2将第二介电层的延展性约束为至少D 2。 T 2MAX取决于D 2和在由第二介电层组成的第二电介质材料上。

公开(公告)号：US06349871B1

公开(公告)日：2002-02-26

申请号：US09761616

申请日：2001-01-16

申请人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

发明人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

IPC分类号： B23K3102

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K2101/42 ,  H05K3/26 ,  H05K2203/0445 ,  H05K2203/045 ,  H05K2203/081

摘要： A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.

摘要翻译： 描述了一种用于重新加工具有插入通孔和电镀通孔的印刷电路板的方法和装置。 由可移动的局部支撑件支撑的印刷电路板仅通过加热装置从底部被加热，该加热装置靠近PCB上的区域，其中包含要进行返工的电镀通孔或孔。 当堵塞的PTH中的焊料完全熔化时，取出加热装置。 此时，打开鼓风空气去除和吹除PTH中多余的焊料。 由于本发明的非接触性质，压缩空气比抽真空更有效地替代熔融焊料，并且比传统的返工方法具有较少的损坏PCB的可能性。

公开(公告)号：US06216938B1

公开(公告)日：2001-04-17

申请号：US09409832

申请日：1999-09-30

申请人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

发明人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

IPC分类号： B23K1018

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K2101/42 ,  H05K3/26 ,  H05K2203/0445 ,  H05K2203/045 ,  H05K2203/081

摘要： A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.

摘要翻译： 描述了一种用于重新加工具有插入通孔和电镀通孔的印刷电路板的方法和装置。 由可移动的局部支撑件支撑的印刷电路板仅通过加热装置从底部被加热，该加热装置靠近PCB上的区域，其中包含要进行返工的电镀通孔或孔。 当堵塞的PTH中的焊料完全熔化时，取出加热装置。 此时，打开鼓风空气去除和吹除PTH中多余的焊料。 由于本发明的非接触性质，压缩空气比抽真空更有效地替代熔融焊料，并且比传统的返工方法具有较少的损坏PCB的可能性。

公开(公告)号：US5669775A

公开(公告)日：1997-09-23

申请号：US524361

申请日：1995-09-05

申请人： Jeffrey Scott Campbell ,  James D. Herard ,  Ronald Peter Nowak ,  John Robert Slack ,  David Brian Stone

发明人： Jeffrey Scott Campbell ,  James D. Herard ,  Ronald Peter Nowak ,  John Robert Slack ,  David Brian Stone

IPC分类号： H01R12/70 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H01R9/09

CPC分类号： H01R23/661 ,  H05K1/189 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/2009 ,  H05K3/0058

摘要： A support structure is attached to the front or back side of a flexible circuit by direct mounting to the flexible circuit flat ribbon cable, thereby providing a stress-free region of the cable in which the flexible circuit electrical components can be mounted. The support structure comprises a flat ring that is attached to the cable by adhesive, soldering, or mechanical fastening. The flat ring mounts on one side of the flat ribbon cable and encloses an area of the cable that is sufficiently large for the mounting of the flexible circuit electrical components. The flat ribbon cable within the enclosed area is held flat and free from stress, even as the cable is handled. Thus, any components mounted within the enclosed area are not subjected to bending moments. The invention also can be incorporated into cable connectors, such as multi-pin connectors at the ends of cables, and can include support hooks and air cooling baffles.

摘要翻译： 支撑结构通过直接安装到柔性电路扁平带状电缆而附接到柔性电路的前侧或后侧，由此提供电缆的无应力区域，其中可安装柔性电路电气部件。 支撑结构包括通过粘合剂，焊接或机械紧固附接到电缆的平环。 扁平环安装在扁平带状电缆的一侧，并且包围电缆的足够大的区域以用于安装柔性电路电气部件。 封闭区域内的扁平带状电缆保持平坦，无应力，即使电缆处理。 因此，安装在封闭区域内的任何部件都不会受到弯矩的影响。 本发明还可以结合到电缆连接器中，例如在电缆端部处的多针连接器，并且可以包括支撑钩和空气冷却挡板。

公开(公告)号：US5468917A

公开(公告)日：1995-11-21

申请号：US217141

申请日：1994-02-23

申请人： William L. Brodsky ,  James D. Herard ,  Thomas G. Macek ,  Timothy L. Sharp ,  George J. Shovlowsky

发明人： William L. Brodsky ,  James D. Herard ,  Thomas G. Macek ,  Timothy L. Sharp ,  George J. Shovlowsky

IPC分类号： H05K1/03 ,  H01R12/62 ,  H01R13/24 ,  H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K1/14

CPC分类号： H01R13/2414 ,  H01R12/62 ,  H05K3/0058 ,  H05K3/365 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K3/325 ,  H05K3/361 ,  Y10T29/49126

摘要： A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

摘要翻译： 电路结构包括具有至少一层电介质的柔性电路，其上具有多个导电构件（例如铜焊盘）。 使用包括多个直立部分的弹性体部件，每个直立部分各自具有相应的金属垫部件，该弹性体 - 衬垫结构在相对于相应的导电部件的位置处接合到柔性电路，以确保在其上大体上独立的力量施加 例如，当柔性电路电耦合到诸如印刷电路板的单独的电路化基板时。 还提供了一种用于制造用于这种电路化基板中的弹性体支撑构件的方法。

公开(公告)号：US5083927A

公开(公告)日：1992-01-28

申请号：US637246

申请日：1991-01-03

申请人： James D. Herard ,  Steven R. Herard

发明人： James D. Herard ,  Steven R. Herard

IPC分类号： H01L23/50 ,  H01L23/32 ,  H01R13/11 ,  H01R13/187 ,  H05K1/18

CPC分类号： H01R12/58 ,  H01R13/111 ,  H01R13/187

摘要： A socket for use within a circuit board's conductive opening, e.g., plated-thru-hole, to frictionally engage the opening's internal surface(s) and thereby retain the socket within the opening without the need for solder or the like material. The socket includes a first plurality, e.g., three, of resilient members to achieve said frictional engagement with the opening's surface(s) and a second plurality of resilient members to frictionally engage a conductive pin which is inserted within the socket to thereby become electrically connected thereto. The force exerted by the resilient members against the opening's internal surface(s) exceeds that exerted by the other resilient members against the conductive pin to thereby assure retention of the socket during pin insertion and withdrawal. A connector assembly using such a socket is also defined herein. The socket is preferably of tubular metallic material, e.g., beryllium-copper.

摘要翻译： 在电路板的导电开口（例如电镀通孔）内使用的用于摩擦地接合开口的内表面并由此将插座保持在开口内而不需要焊料或类似材料的插座。 插座包括第一多个，例如三个弹性构件，以实现与开口表面的摩擦接合，以及第二多个弹性构件，以摩擦地接合插入插座内的导电销，从而变得电连接 到此。 由弹性构件抵抗开口的内表面施加的力超过由另一个弹性构件抵靠导电销施加的力，从而确保在销插入和抽出期间保持插座。 使用这种插座的连接器组件也在本文中定义。 插座优选地是管状金属材料，例如铍铜。

公开(公告)号：US07007378B2

公开(公告)日：2006-03-07

申请号：US10317329

申请日：2002-12-12

申请人： John G. Gaudiello ,  James D. Herard ,  John J. Konrad ,  Jeffrey McKeveny ,  Timothy L. Wells

发明人： John G. Gaudiello ,  James D. Herard ,  John J. Konrad ,  Jeffrey McKeveny ,  Timothy L. Wells

IPC分类号： H01R9/00

CPC分类号： H05K3/244 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.

摘要翻译： 公开了一种制造用于印刷电路板的焊盘格栅阵列连接器的方法。 该过程不需要电镀贵金属覆盖层。 因此，不需要通用条。 本发明的另一个优点包括仅在连接器的外表面中使用闪光灯，软金应用的连接器设计。 物理硬度和耐久性源自位于闪金属层下面的薄钯层。

公开(公告)号：US5468159A

公开(公告)日：1995-11-21

申请号：US288179

申请日：1994-08-10

申请人： William L. Brodsky ,  James D. Herard

发明人： William L. Brodsky ,  James D. Herard

IPC分类号： H01B7/08 ,  H01R13/72 ,  H02G11/02 ,  H05K1/00

CPC分类号： H01B7/0846 ,  H01B7/0869 ,  H01R13/72 ,  H02G11/02 ,  H05K1/0393

摘要： This invention provides a means of using flexible (also often referred to as simply "flex") circuit structures for external cabling in a small light package, particularly those utilized in portable computers. The external cabling is composed of a flex circuit that is strengthened by fiber strands, and a wrapped sheath of woven mesh netting. The cabling may be further encased in an overcoating for protection against abrasion and chemicals. The packaging scheme using this cable may include a storage device for the cable such that the cable is retractable.

摘要翻译： 本发明提供了一种在小型光包装（特别是在便携式计算机中使用的那些）中使用柔性（也通常简称为“柔性”）电路结构用于外部布线的手段。 外部电缆由柔性电路组成，该电路由纤维束加强，编织网的包裹护套组成。 布线可以进一步封装在外涂层中，以防止磨损和化学物质。 使用该电缆的包装方案可以包括用于电缆的存储装置，使得电缆可缩回。

公开(公告)号：US5397240A

公开(公告)日：1995-03-14

申请号：US143327

申请日：1993-10-26

申请人： James D. Herard

发明人： James D. Herard

IPC分类号： H01R13/33 ,  H01R4/26 ,  H01R12/52 ,  H01K23/72

CPC分类号： H01R12/52 ,  H01R4/26

摘要： An electrical connector for interconnecting first and second circuit members wherein the connector includes an insulative, e.g., plastic, housing having a cylindrical metallic conductor rod therein and at least one electrical contact positioned on or within the housing and having opposed conductive end portions. When the connector is in a non-contacting position relative to the circuit members, the contact assumes a first configuration, e.g., oval, and thereafter assumes (moves to) a second configuration, e.g., round, when contact occurs. In this second configuration, the conductive end portions of the contact are equidistant from the conductor rod, thereby assuring a predetermined level of impedance for the connector during operation thereof. An information handling system (computer) which uses such a connector is also disclosed.

摘要翻译： 一种用于互连第一和第二电路构件的电连接器，其中连接器包括绝缘的例如塑料壳体，其中具有圆柱形金属导体杆，以及定位在壳体上或壳体内并且具有相对的导电端部的至少一个电触头。 当连接器相对于电路构件处于非接触位置时，触点呈现第一构造，例如椭圆形，并且此后在接触发生时呈现（移动）第二构型，例如圆形。 在该第二构造中，接触件的导电端部与导体棒等距，从而在其操作期间确保连接器的预定阻抗水平。 还公开了使用这种连接器的信息处理系统（计算机）。