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19 条记录 (耗时 0.026 秒)

    System of fluid inspection and/or identification
    1.
    发明授权
    System of fluid inspection and/or identification 失效
    流体检查和/或识别系统

    公开(公告)号：US4998824A

    公开(公告)日：1991-03-12

    申请号：US363049

    申请日：1989-06-08

    申请人： Douglas J. Littlejohn ,  Douglas Modlin ,  Jerry G. Ingrum ,  Brian R. Devlin

    发明人： Douglas J. Littlejohn ,  Douglas Modlin ,  Jerry G. Ingrum ,  Brian R. Devlin

    IPC分类号： G01J3/42 ,  G01N21/27 ,  G01N21/31 ,  G01N21/85 ,  G01N21/90 ,  G01N21/94

    CPC分类号： G01N21/31 ,  G01N2021/3196 ,  G01N21/85 ,  G01N21/94

    摘要： A method and apparatus for identifying and distinguishing fluids and for recognizing contamination of a fluid, which method and apparatus utilizes spectrographic analysis of control samples of known fluids and then spectrographic analysis of unknown fluids to generate optical signatures, finger prints and/or profiles of data and processed data relating to the relative intensities of light at selected wavelengths; and then, through comparison of the various signatures, fingerprints and/or profiles, provides determinative information as to contamination or non-contamination of the unknown fluids; after which appropriate operation control is effected and/or exercised.

    摘要翻译： 一种用于识别和区分流体并识别流体污染的方法和装置，该方法和装置利用已知流体的对照样品的光谱分析，然后对未知流体进行光谱分析以产生光学特征，指纹和/或数据分布 并处理与所选波长的光的相对强度有关的数据; 然后，通过比较各种签名，指纹和/或轮廓，提供关于未知流体的污染或不污染的确定性信息; 之后进行和/或行使适当的操作控制。

    System of fluid inspection and/or identification
    2.
    发明授权
    System of fluid inspection and/or identification 失效
    流体检查和/或识别系统

    公开(公告)号：US5002397A

    公开(公告)日：1991-03-26

    申请号：US421263

    申请日：1989-10-16

    申请人： Jerry G. Ingrum ,  Douglas J. Littlejohn ,  Douglas Modlin

    发明人： Jerry G. Ingrum ,  Douglas J. Littlejohn ,  Douglas Modlin

    IPC分类号： G01N21/31 ,  G01N21/85 ,  G01N21/94

    CPC分类号： G01N21/31 ,  G01N2021/3196 ,  G01N21/85 ,  G01N21/94

    摘要： A Method and Apparatus for identifying and distinguishing fluids and for recognizing contamination of a fluid, which method and apparatus utilizes spectrographic analysis of control samples of known fluids and then spectrographic analysis of unknown fluids to generate optical signatures, finger prints and/or profiles of data and processed data relating to the relative intensities of light at selected wavelengths; and then, through comparison of the various signatures, fingerprints and/or profiles, provides determinative information as to contamination or non-contamination of the unknown fluids; after which appropriate operation control is effected and/or exercised.

    摘要翻译： 一种用于识别和区分流体并识别流体污染的方法和装置，该方法和装置利用已知流体的对照样品的光谱分析，然后对未知流体进行光谱分析以产生光学特征，指纹和/或数据分布 并处理与所选波长的光的相对强度有关的数据; 然后，通过比较各种签名，指纹和/或轮廓，提供关于未知流体的污染或不污染的确定性信息; 之后进行和/或行使适当的操作控制。

    High density interconnect system for IC packages and interconnect assemblies
    4.
    发明授权
    High density interconnect system for IC packages and interconnect assemblies 失效
    用于IC封装和互连组件的高密度互连系统

    公开(公告)号：US07579848B2

    公开(公告)日：2009-08-25

    申请号：US11350049

    申请日：2006-02-07

    申请人： Wilmer R. Bottoms ,  Fu Chiung Chong ,  Sammy Mok ,  Douglas Modlin

    发明人： Wilmer R. Bottoms ,  Fu Chiung Chong ,  Sammy Mok ,  Douglas Modlin

    IPC分类号： G01R31/02

    CPC分类号： G01R1/07378 ,  G01R1/0483 ,  G01R1/06716 ,  G01R1/07342 ,  G01R3/00

    摘要： An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

    摘要翻译： 描述了改进的互连系统，例如用于电接触器和连接器，电子设备或模块封装组件，插座组件和/或探针卡组件系统。 示例性连接器包括第一连接器结构，其包括具有接触表面和接合表面的接触器基板以及从探针表面延伸的一个或多个导电的微制造弹簧触头，第二连接器结构，包括至少一个基板，并具有 设置在连接器表面上并对应于该组弹簧触点的至少一个导电接触垫，以及用于在至少第一位置和第二位置之间可移动地定位和对准第一连接器结构和第二连接器结构的装置， 使得在至少一个位置中，至少一个导电微制造的弹簧触头电连接到至少一个导电接触垫。

    High Density Interconnect System Having Rapid Fabrication Cycle
    5.
    发明申请
    High Density Interconnect System Having Rapid Fabrication Cycle 失效
    高密度互连系统具有快速制造周期

    公开(公告)号：US20090153165A1

    公开(公告)日：2009-06-18

    申请号：US12354520

    申请日：2009-01-15

    申请人： Fu Chiung Chong ,  Andrew Kao ,  Douglas McKay ,  Anna Litza ,  Douglas Modlin ,  Sammy Mok ,  Nitin Parekh ,  Frank John Swiatowiec ,  Zhaohui Shan

    发明人： Fu Chiung Chong ,  Andrew Kao ,  Douglas McKay ,  Anna Litza ,  Douglas Modlin ,  Sammy Mok ,  Nitin Parekh ,  Frank John Swiatowiec ,  Zhaohui Shan

    IPC分类号： G01R31/02

    CPC分类号： G01R31/02 ,  G01R1/073 ,  G01R1/07378 ,  G01R31/2889 ,  Y10T29/49117 ,  Y10T29/49222

    摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

    摘要翻译： 描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。 示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于 主板安装表面和用于调整参考平面相对于晶片的平面度的机构。 具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。 互连结构和方法优选地提供改进的制造周期。

    High density interconnect system for IC packages and interconnect assemblies
    9.
    发明授权
    High density interconnect system for IC packages and interconnect assemblies 有权
    用于IC封装和互连组件的高密度互连系统

    公开(公告)号：US07812626B2

    公开(公告)日：2010-10-12

    申请号：US12546432

    申请日：2009-08-24

    申请人： Wilmer R. Bottoms ,  Fu Chiung Chong ,  Sammy Mok ,  Douglas Modlin

    发明人： Wilmer R. Bottoms ,  Fu Chiung Chong ,  Sammy Mok ,  Douglas Modlin

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06711 ,  G01R1/07342 ,  G01R3/00

    摘要： An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

    摘要翻译： 描述了改进的互连系统，例如用于电接触器和连接器，电子设备或模块封装组件，插座组件和/或探针卡组件系统。 示例性连接器包括第一连接器结构，其包括具有接触表面和接合表面的接触器基板以及从探针表面延伸的一个或多个导电的微制造弹簧触头，第二连接器结构，包括至少一个基板，并具有 设置在连接器表面上并对应于该组弹簧触点的至少一个导电接触垫，以及用于在至少第一位置和第二位置之间可移动地定位和对准第一连接器结构和第二连接器结构的装置， 使得在至少一个位置中，至少一个导电微制造的弹簧触头电连接到至少一个导电接触垫。

    HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES
    10.
    发明申请
    HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES 有权
    用于IC封装和互连组件的高密度互连系统

    公开(公告)号：US20100066393A1

    公开(公告)日：2010-03-18

    申请号：US12546432

    申请日：2009-08-24

    申请人： W. R. Bottoms ,  Fu Chiung Chong ,  Sammy Mok ,  Douglas Modlin

    发明人： W. R. Bottoms ,  Fu Chiung Chong ,  Sammy Mok ,  Douglas Modlin

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06711 ,  G01R1/07342 ,  G01R3/00

    摘要： An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

    摘要翻译： 描述了改进的互连系统，例如用于电接触器和连接器，电子设备或模块封装组件，插座组件和/或探针卡组件系统。 示例性连接器包括第一连接器结构，其包括具有接触表面和接合表面的接触器基板以及从探针表面延伸的一个或多个导电的微制造弹簧触头，第二连接器结构，包括至少一个基板，并具有 设置在连接器表面上并对应于该组弹簧触点的至少一个导电接触垫，以及用于在至少第一位置和第二位置之间可移动地定位和对准第一连接器结构和第二连接器结构的装置， 使得在至少一个位置中，至少一个导电微制造的弹簧触头电连接到至少一个导电接触垫。