摘要:
A semiconductor device with a BGA package includes a substrate made of a resin and having one side on which a number of solder ball terminals are formed and the other side on which a chip mounting portion electrically connected to the solder ball terminals is formed, and a cover plate made of a metal and attached to a semiconductor chip so as to cover and come into contact with it under a condition where the semiconductor chip is connected to the resin substrate by a flip-chip process. The cover plate includes a base brought into contact with the semiconductor chip and a peripheral portion formed with a plurality of bonding portions where the cover plate is bonded to the substrate. The bonding portions are discontinuous to each other.
摘要:
In one embodiment, a method for manufacturing a semiconductor device includes following steps. An aperture is formed in an interlayer insulating film formed on a semiconductor wafer apart from an integrated circuit portion by etching process. The interlayer insulating film has a dielectric constant smaller than a silicon oxide film (SiO2), and the width of the aperture is larger than a dicing region. A resin layer is embedded in the aperture. An adhesive layer is formed on the interlayer insulating film and the resin layer. The semiconductor wafer is attached to a glass substrate using the adhesive layer by Face Down method. The semiconductor wafer, the resin layer, and the adhesive layer on a dicing region are cut by blade dicing. The semiconductor wafer and the glass substrate adhered to the semiconductor wafer are cut into pieces by the blade dicing of the glass substrate under the dicing region.
摘要:
A lubricant member of a preferred embodiment of the invention is formed, into a stick-shaped body longer in a lengthwise direction than in a diametrical direction, of a mixture including at least a polyamide resin as a thermoplastic resin, an ultrahigh molecular weight polyethylene, and lubricant oil. A film made mainly of the polyamide resin is formed in the outer peripheral surface of the lubricant member. At the inner side of the film, fibrous crystals of the polyamide resin and the ultrahigh molecular weight polyethylene extend in the lengthwise direction of the lubricant member, and multiple pores are formed. With this structure, the lubricant member is produced with excellent workability without sacrificing the mechanical strength and the lubricating property.
摘要:
A sensor chip includes: a semiconductor substrate that is provided with a light receiving portion on a main surface; a light transmissive member that is provided on the main surface of the semiconductor substrate, enclosing a hollow portion above the light receiving portion, to surround upper and periphery of the light receiving portion; and a light transmissive protective member that is provided on the light transmissive member.
摘要:
One-side ends of fine metal wires are bonded onto pads of a semiconductor chip via wire bonding and the other ends of the fine metal wires are mounted on the board by flip chip.
摘要:
A process for treating a radioactive liquid waste is disclosed, in which a radioactive liquid waste containing uranium and .beta.-decay nuclides, daughter nuclides of uranium, is treated by combination of a flocculation method using water glass as pretreatment and a subsequent ion exchange method. An approximately total amount of the uranium and a part of the .beta.-decay nuclides, daughter nuclides of uranium, in the liquid waste are captured by an amorphous silica precipitate formed by addition of the water glass and a remaining part of the .beta.-decay nuclides, daughter nuclides of uranium, is captured thereafter by the ion exchange treatment. The thus captured radioactive materials are respectively eluted from the filtered out precipitate, a radioactive solid waste, and the ion exchanger by acid treatment to be recovered as an acidic solution. Thus, the radioactive materials in the liquid waste are recovered approximately completely, thereby making the radioactivities of a final drain remarkably reduced. The precipitate is then dissolved in an alkali metal hydroxide solution to make the amorphous silica constituting the precipitate regenerated to water glass.
摘要:
In one embodiment, a method for manufacturing a semiconductor device includes following steps. An aperture is formed in an interlayer insulating film formed on a semiconductor wafer apart from an integrated circuit portion by etching process. The interlayer insulating film has a dielectric constant smaller than a silicon oxide film (SiO2), and the width of the aperture is larger than a dicing region. A resin layer is embedded in the aperture. An adhesive layer is formed on the interlayer insulating film and the resin layer. The semiconductor wafer is attached to a glass substrate using the adhesive layer by Face Down method. The semiconductor wafer, the resin layer, and the adhesive layer on a dicing region are cut by blade dicing. The semiconductor wafer and the glass substrate adhered to the semiconductor wafer are cut into pieces by the blade dicing of the glass substrate under the dicing region.
摘要:
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.
摘要:
A gaseous fuel rotary piston engine has a rotor housing and a rotor. A side housing of the rotor housing is provided with an air intake port for supplying air to working chambers defined in the rotor housing and a gaseous fuel port which is connected to a gaseous fuel source through a fuel supply passage and through which gaseous fuel is supplied to the working chambers. The air intake port is formed to open near the top dead center on the intake stroke and close after the bottom dead center on the intake stroke. The gaseous fuel port is formed to open near the opening time of the air intake port and close substantially at the middle of the compression stroke.
摘要:
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.