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8 条记录 (耗时 0.028 秒)

    Method of preparing a substrate surface for conformal plating
    5.
    发明授权
    Method of preparing a substrate surface for conformal plating 失效
    制备用于保形电镀的基板表面的方法

    公开(公告)号：US5922517A

    公开(公告)日：1999-07-13

    申请号：US662165

    申请日：1996-06-12

    申请人： Anilkumar Chinuprasad Bhatt ,  Ashwinkumar C. Bhatt ,  Voya Rista Markovich ,  William Earl Wilson ,  Gerald Walter Jones

    发明人： Anilkumar Chinuprasad Bhatt ,  Ashwinkumar C. Bhatt ,  Voya Rista Markovich ,  William Earl Wilson ,  Gerald Walter Jones

    IPC分类号： H05K3/00 ,  G03F7/095 ,  H05K3/18 ,  G03F7/00

    CPC分类号： H05K3/184 ,  G03F7/095

    摘要： Bridging between electrically conductive circuit features during conformal plating is prevented by avoiding the deposition of catalytic seed material onto non-circuit areas of the substrate. Preparatory to forming electrical circuit features on a nonconductive substrate by the full additive process, extraneous seed material is either trapped between two layers of a photoimageable film, whereby it is unavailable during plating, or deposited on the surface of an aqueous photoimageable film, which is removed prior to plating. The method embodying the present invention eliminates the need for seed removal after initial plating and prior to conformal plating of a precious metal over the initial plating.

    摘要翻译： 通过避免催化种子材料沉积到衬底的非电路区域上，防止了在保形电镀过程中导电电路特征之间的桥接。 准备通过完全添加的方法在非导电基材上形成电路特征，外来种子材料被捕获在两层可光成像膜之间，由此在电镀期间不可用，或者沉积在水性可光成像膜的表面上， 在电镀之前移除。 实施本发明的方法消除了在初始镀覆之后以及在初始镀覆之前对贵金属进行适形电镀之前的种子去除的需要。

    Method of producing fine-line circuit boards using chemical polishing
    7.
    发明授权
    Method of producing fine-line circuit boards using chemical polishing 失效
    使用化学抛光生产细线电路板的方法

    公开(公告)号：US06547974B1

    公开(公告)日：2003-04-15

    申请号：US08495277

    申请日：1995-06-27

    申请人： Stanley Michael Albrechta ,  Christina Marie Boyko ,  Kathleen Lorraine Covert ,  Natalie Barbara Feilchenfeld ,  Voya Rista Markovich ,  William Earl Wilson ,  Michael Wozniak

    发明人： Stanley Michael Albrechta ,  Christina Marie Boyko ,  Kathleen Lorraine Covert ,  Natalie Barbara Feilchenfeld ,  Voya Rista Markovich ,  William Earl Wilson ,  Michael Wozniak

    IPC分类号： H01B1300

    CPC分类号： H05K3/22 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/0392 ,  H05K2203/1476

    摘要： A printed circuit board is produced by patterning a resist layer according to a circuit mask that defines desired circuit paths. The resist pattern layer is formed by removing the resist from the board in the desired circuit paths and a conductive material is plated onto the board in the resist voids defined by the circuit mask so that the height of the conductive material relative to the substrate equals or exceeds the height of the resist layer relative to the substrate. A low-reactive solution is applied over the conductive material and removes a surface portion of the conductive material. As the solution removes the conductive layer, it forms a film barrier and the solution composition changes, both of which substantially inhibits any further removal of the conductive material. Next, the film barrier is removed from the board allowing another film barrier to form stimulating the removal of further conductive material. The removal step is repeated until the conductive material is at a desired height relative to the height of the resist layer. The board is then finished using conventional circuit board fabrication techniques.

    摘要翻译： 通过根据限定所需电路路径的电路掩模图案化抗蚀剂层来制造印刷电路板。 抗蚀剂图案层通过在所需的电路路径中从基板上去除抗蚀剂而形成，并且导电材料被电镀在由电路掩模限定的抗蚀剂空隙中的基板上，使得导电材料相对于基板的高度等于或等于 超过抗蚀剂层相对于基底的高度。 将低反应性溶液施加在导电材料上并除去导电材料的表面部分。 当溶液去除导电层时，其形成膜阻挡层并且溶液组成发生变化，这两者基本上禁止任何进一步去除导电材料。 接下来，从板上去除膜屏障，允许另一个膜屏障形成刺激去除另外的导电材料。 重复去除步骤，直到导电材料相对于抗蚀剂层的高度处于期望的高度。 然后使用常规电路板制造技术完成电路板。