摘要:
An interference analysis device can be provided, which analyzes interference between wirings of a circuit board with reduced load and for a short time period. The interference analysis device according to the present invention includes: a design data input part for inputting design data of the circuit board; a noise characteristics setting part that sets data representing electrical characteristics of noise for a wiring of the circuit board; a limit value setting part that sets an allowable limit value of noise received by a wiring; a selection part that selects a wiring group to be analyzed based on the noise characteristics data and the allowable limit value; an interference analysis part that calculates, concerning the selected wiring group, an amount of interference from a wiring giving the interference to a wiring receiving the interference; and a received noise level calculation part that calculates a noise level that the wiring receiving the interference will receive.
摘要:
An interference analysis device can be provided, which analyzes interference between wirings of a circuit board with reduced load and for a short time period. The interference analysis device according to the present invention includes: a design data input part for inputting design data of the circuit board; a noise characteristics setting part that sets data representing electrical characteristics of noise for a wiring of the circuit board; a limit value setting part that sets an allowable limit value of noise received by a wiring; a selection part that selects a wiring group to be analyzed based on the noise characteristics data and the allowable limit value; an interference analysis part that calculates, concerning the selected wiring group, an amount of interference from a wiring giving the interference to a wiring receiving the interference; and a received noise level calculation part that calculates a noise level that the wiring receiving the interference will receive.
摘要:
An interference analysis device that analyzes interference includes an input unit 2 that inputs design data, a selection unit 3 that selects an analysis region, a division unit 5 that divides a wire into segments, a calculation unit 6 that calculates a circuit matrix regarding a coupled line, and an analysis unit 7 that obtains a degree of electromagnetic interference, wherein the calculation unit 6 calculates a circuit matrix of the coupled line, using a parameter set obtained by adding an asymmetry parameter to RLGC parameters of a transmission line in the coupled line. Thus, a method for analyzing an interference of circuit wiring can be provided, which is capable of shortening a processing time substantially while maintaining high precision.
摘要:
An interference analysis device that analyzes interference includes an input unit that inputs design data, a selection unit that selects an analysis region, a division unit that divides a wire into segments, a calculation unit that calculates a circuit matrix regarding a coupled line, and an analysis unit that obtains a degree of electromagnetic interference, wherein the calculation unit calculates a circuit matrix of the coupled line, using a parameter set obtained by adding an asymmetry parameter to RLGC parameters of a transmission line in the coupled line. Thus, a method for analyzing an interference of circuit wiring can be provided, which is capable of shortening a processing time substantially while maintaining high precision.
摘要:
An insulator is provided between interconnect layers oppositely placed. The interconnect layers are connected between by connection members provided through the insulator. The connection members at one and the other ends are connected between in their center positions. A shield layer is provided spaced from the intermediate connection layer generally on a same plane as the intermediate connection layer. The interconnect layers where considered generally as a circular cylinder have a diameter m, and the intermediate connection layer where considered generally as circular has a diameter r, r
摘要:
A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.
摘要:
An insulator is provided between interconnect layers oppositely placed. The interconnect layers are connected between by connection members provided through the insulator. The connection members at one and the other ends are connected between in their center positions. A shield layer is provided spaced from the intermediate connection layer generally on a same plane as the intermediate connection layer. A condition of (R·r)/(2·h)≦L≦(5·R·r)/h is satisfied, provided that a connection distance between the interconnect layers through the connection members and the intermediate connection layer is h, the connection members where considered generally as a circular cylinder have a diameter R, the intermediate connection layer where considered generally as circular has a diameter r, and a spaced distance between the intermediate connection layer and the shield layer is L. Thus, characteristic impedance is stabilized.
摘要翻译:在相互布置的互连层之间设置绝缘体。 互连层通过通过绝缘体提供的连接构件连接在一起。 连接构件在一端和另一端连接在它们的中心位置之间。 屏蔽层设置成与中间连接层间隔开,通常在与中间连接层相同的平面上。 满足(Rr)/(2.h)<= L <=(5.Rr)/ h的条件,条件是通过连接构件和中间连接层的互连层之间的连接距离为h,连接 通常被认为是圆柱体的构件具有直径R,中间连接层通常被认为是圆形的,具有直径r,并且中间连接层和屏蔽层之间的间隔距离为L.因此,特性阻抗稳定。
摘要:
A pair of discretionary points on a principal surface of a block are coupled to each other with a metal wire having a length larger than a distance between the pair of discretionary points, liquid resin is applied to the principal surface so as to cover the metal wire and then cured, so that a resin-cured material is formed, and the upper-surface portion of the resin-cured material is removed together with an intermediate portion of the metal wire, and then the block is removed from the resin-cured material.
摘要:
At least four terminal electrodes are provided on a surface of multi-layer substrate main body. An electric functional layer is selectively provided at an internal area of said multi-layer substrate placed at a downward position of all terminal electrodes in a substrate thickness direction. A semiconductor device is flip-chip-bonded to the terminal electrodes. Thus, the semiconductor device is electrically connected to the electric functional layer at a short distance. As a result, a reduction in parasitic inductance and an improvement in high frequency characteristic can be accomplished. Generation of height variations between the terminal electrodes can be prevented, and the semiconductor device is stably flip-chip-bonded to the multi-layer substrate.
摘要:
In a noise reduction circuit, a transistor circuit amplifies an input signal and outputs an output signal with supply of power from the DC voltage source via a power supply line circuit. The canceling signal adding circuit acquires and attenuates a part of the output signal, to generate a canceling signal having a phase substantially opposite to a phase of a leakage signal leaking to the power supply line circuit, and having an amplitude substantially the same as an amplitude of the leakage signal.