公开(公告)号：US20120142173A1

公开(公告)日：2012-06-07

申请号：US13308721

申请日：2011-12-01

申请人： Hiroki WATANABE ,  Yasuo KITOU ,  Yasushi FURUKAWA ,  Kensaku YAMAMOTO ,  Hidefumi TAKAYA ,  Masahiro SUGIMOTO ,  Yukihiko WATANABE ,  Narumasa SOEJIMA ,  Tsuyoshi ISHIKAWA

发明人： Hiroki WATANABE ,  Yasuo KITOU ,  Yasushi FURUKAWA ,  Kensaku YAMAMOTO ,  Hidefumi TAKAYA ,  Masahiro SUGIMOTO ,  Yukihiko WATANABE ,  Narumasa SOEJIMA ,  Tsuyoshi ISHIKAWA

IPC分类号： H01L21/20 ,  C30B25/20 ,  C30B25/02

CPC分类号： H01L21/0262 ,  C30B25/186 ,  C30B29/36 ,  H01L21/02378 ,  H01L21/0243 ,  H01L21/02529 ,  H01L21/02658 ,  H01L21/046 ,  H01L21/0475 ,  H01L29/04

摘要： A manufacturing method of an SiC single crystal includes preparing an SiC substrate, implanting ions into a surface portion of the SiC substrate to form an ion implantation layer, activating the ions implanted into the surface portion of the SiC substrate by annealing, chemically etching the surface portion of the SiC substrate to form an etch pit that is caused by a threading screw dislocation included in the SiC substrate and performing an epitaxial growth of SiC to form an SiC growth layer on a surface of the SiC substrate including an inner wall of the etch pit in such a manner that portions of the SiC growth layer grown on the inner wall of the etch pit join with each other.

摘要翻译： SiC单晶的制造方法包括制备SiC衬底，将离子注入到SiC衬底的表面部分中以形成离子注入层，通过退火激活注入到SiC衬底的表面部分中的离子，化学蚀刻表面 以形成由SiC衬底中的螺纹位错引起的蚀刻坑，并且在SiC衬底的表面上进行SiC的外延生长以形成SiC生长层，所述SiC生长层包括蚀刻的内壁 以使得在蚀刻坑的内壁上生长的SiC生长层的部分彼此连接的方式形成凹坑。

公开(公告)号：US20120273801A1

公开(公告)日：2012-11-01

申请号：US13450639

申请日：2012-04-19

申请人： Hiroki WATANABE ,  Shinichiro MIYAHARA ,  Masahiro SUGIMOTO ,  Hidefumi TAKAYA ,  Yukihiko WATANABE ,  Narumasa SOEJIMA ,  Tsuyoshi ISHIKAWA

发明人： Hiroki WATANABE ,  Shinichiro MIYAHARA ,  Masahiro SUGIMOTO ,  Hidefumi TAKAYA ,  Yukihiko WATANABE ,  Narumasa SOEJIMA ,  Tsuyoshi ISHIKAWA

IPC分类号： H01L29/24

CPC分类号： H01L29/7813 ,  H01L29/045 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/7397

摘要： A SiC semiconductor device includes: a SiC substrate including a first or second conductive type layer and a first conductive type drift layer and including a principal surface having an offset direction; a trench disposed on the drift layer and having a longitudinal direction; and a gate electrode disposed in the trench via a gate insulation film. A sidewall of the trench provides a channel formation surface. The vertical semiconductor device flows current along with the channel formation surface of the trench according to a gate voltage applied to the gate electrode. The offset direction of the SiC substrate is perpendicular to the longitudinal direction of the trench.

摘要翻译： SiC半导体器件包括：SiC衬底，包括第一或第二导电类型层和第一导电类型漂移层，并且包括具有偏移方向的主表面; 设置在所述漂移层上并具有纵向方向的沟槽; 以及通过栅极绝缘膜设置在沟槽中的栅电极。 沟槽的侧壁提供通道形成表面。 垂直半导体器件根据施加到栅电极的栅极电压与沟道形成表面一起流动电流。 SiC衬底的偏移方向垂直于沟槽的纵向方向。

公开(公告)号：US20120161154A1

公开(公告)日：2012-06-28

申请号：US13330835

申请日：2011-12-20

申请人： Tomohiro MIMURA ,  Shinichiro MIYAHARA ,  Hidefumi TAKAYA ,  Masahiro SUGIMOTO ,  Narumasa SOEJIMA ,  Tsuyoshi ISHIKAWA ,  Yukihiko WATANABE

发明人： Tomohiro MIMURA ,  Shinichiro MIYAHARA ,  Hidefumi TAKAYA ,  Masahiro SUGIMOTO ,  Narumasa SOEJIMA ,  Tsuyoshi ISHIKAWA ,  Yukihiko WATANABE

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7813 ,  H01L29/045 ,  H01L29/1608 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/66068 ,  H01L29/7397

摘要： An SiC semiconductor device includes a substrate, a drift layer, a base region, a source region, a trench, a gate oxide film, a gate electrode, a source electrode and a drain electrode. The substrate has a Si-face as a main surface. The source region has the Si-face. The trench is provided from a surface of the source region to a portion deeper than the base region and extends longitudinally in one direction and has a Si-face bottom. The trench has an inverse tapered shape, which has a smaller width at an entrance portion than at a bottom, at least at a portion that is in contact with the base region.

摘要翻译： SiC半导体器件包括衬底，漂移层，基极区域，源极区域，沟槽，栅极氧化膜，栅电极，源电极和漏电极。 基板具有作为主表面的Si面。 源区具有Si面。 沟槽从源极区域的表面提供到比基部区域更深的部分并且在一个方向上纵向延伸并且具有Si面底部。 沟槽具有倒锥形形状，至少在与基部区域接触的部分处，入口部分处的宽度比底部宽。

公开(公告)号：US20110291110A1

公开(公告)日：2011-12-01

申请号：US13117575

申请日：2011-05-27

申请人： Naohiro SUZUKI ,  Hideo MATSUKI ,  Masahiro SUGIMOTO ,  Hidefumi TAKAYA ,  Jun MORIMOTO ,  Tsuyoshi ISHIKAWA ,  Narumasa SOEJIMA ,  Yukihiko WATANABE

发明人： Naohiro SUZUKI ,  Hideo MATSUKI ,  Masahiro SUGIMOTO ,  Hidefumi TAKAYA ,  Jun MORIMOTO ,  Tsuyoshi ISHIKAWA ,  Narumasa SOEJIMA ,  Yukihiko WATANABE

IPC分类号： H01L29/12 ,  H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7813 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/1608 ,  H01L29/66068

摘要： The silicon carbide semiconductor device includes a substrate, a drift layer, a base region, a source region, a trench, a gate insulating layer, a gate electrode, a source electrode, a drain electrode, and a deep layer. The deep layer is disposed under the base region and is located to a depth deeper than the trench. The deep layer is divided into a plurality of portions in a direction that crosses a longitudinal direction of the trench. The portions include a group of portions disposed at positions corresponding to the trench and arranged at equal intervals in the longitudinal direction of the trench. The group of portions surrounds corners of a bottom of the trench.

摘要翻译： 碳化硅半导体器件包括衬底，漂移层，基极区域，源极区域，沟槽，栅极绝缘层，栅极电极，源极电极，漏极电极和深层。 深层设置在基底区域下方并且位于比沟槽更深的深度。 深层在与沟槽的纵向方向交叉的方向上分成多个部分。 这些部分包括设置在与沟槽相对应的位置处的一组部分，其在沟槽的纵向方向上以相等的间隔布置。 该组部分围绕沟槽的底部的角落。

公开(公告)号：US20100295098A1

公开(公告)日：2010-11-25

申请号：US12822328

申请日：2010-06-24

申请人： Masahiro SUGIMOTO ,  Tetsu KACHI ,  Yoshitaka NAKANO ,  Tsutomu UESUGI ,  Hiroyuki UEDA ,  Narumasa SOEJIMA

发明人： Masahiro SUGIMOTO ,  Tetsu KACHI ,  Yoshitaka NAKANO ,  Tsutomu UESUGI ,  Hiroyuki UEDA ,  Narumasa SOEJIMA

IPC分类号： H01L29/778 ,  H01L21/335

CPC分类号： H01L29/778 ,  H01L21/28 ,  H01L29/2003 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7787

摘要： A semiconductor device has a stacked structure in which a p-GaN layer, an SI-GaN layer, and an AlGaN layer are stacked, and has a gate electrode that is formed at a top surface side of the AlGaN layer. A band gap of the AlGaN layer is wider than a band gap of the p-GaN layer and the SI-GaN layer. Moreover, impurity concentration of the SI-GaN layer is less than 1×1017 cm−3. Semiconductor devices including III-V semiconductors may have a stable normally-off operation.

摘要翻译： 半导体器件具有其中堆叠p-GaN层，SI-GaN层和AlGaN层的堆叠结构，并且具有形成在AlGaN层的顶表面侧的栅电极。 AlGaN层的带隙比p-GaN层和SI-GaN层的带隙宽。 此外，SI-GaN层的杂质浓度小于1×1017cm-3。 包括III-V半导体的半导体器件可以具有稳定的常关断操作。

公开(公告)号：US20170084735A1

公开(公告)日：2017-03-23

申请号：US15365150

申请日：2016-11-30

申请人： Masahiro SUGIMOTO ,  Hidefumi TAKAYA ,  Akitaka SOENO ,  Jun MORIMOTO ,  DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Yuichi TAKEUCHI ,  Naohiro SUZUKI ,  Masahiro SUGIMOTO ,  Hidefumi TAKAYA ,  Akitaka SOENO ,  Jun MORIMOTO ,  Narumasa SOEJIMA ,  Yukihiko WATANABE

IPC分类号： H01L29/78 ,  H01L29/16 ,  H01L29/06 ,  H01L21/04 ,  H01L29/66 ,  H01L29/417 ,  H01L29/872 ,  H01L29/15 ,  H01L21/761

CPC分类号： H01L29/7811 ,  H01L21/046 ,  H01L21/0475 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/761 ,  H01L21/8213 ,  H01L29/0615 ,  H01L29/063 ,  H01L29/0634 ,  H01L29/0661 ,  H01L29/0696 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/157 ,  H01L29/158 ,  H01L29/1608 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/66068 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/861 ,  H01L29/872

摘要： An SiC semiconductor device has a p type region including a low concentration region and a high concentration region filled in a trench formed in a cell region. A p type column is provided by the low concentration region, and a p+ type deep layer is provided by the high concentration region. Thus, since a SJ structure can be made by the p type column and the n type column provided by the n type drift layer, an on-state resistance can be reduced. As a drain potential can be blocked by the p+ type deep layer, at turnoff, an electric field applied to the gate insulation film can be alleviated and thus breakage of the gate insulation film can be restricted. Therefore, the SiC semiconductor device can realize the reduction of the on-state resistance and the restriction of breakage of the gate insulation film.

公开(公告)号：US20140231827A1

公开(公告)日：2014-08-21

申请号：US14141174

申请日：2013-12-26

申请人： Yukihiko WATANABE ,  Sachiko AOI ,  Masahiro SUGIMOTO ,  Akitaka SOENO ,  Shinichiro MIYAHARA

发明人： Yukihiko WATANABE ,  Sachiko AOI ,  Masahiro SUGIMOTO ,  Akitaka SOENO ,  Shinichiro MIYAHARA

IPC分类号： H01L29/47 ,  H01L29/45 ,  H01L29/16 ,  H01L21/285 ,  H01L29/78

CPC分类号： H01L29/47 ,  H01L21/0485 ,  H01L21/28518 ,  H01L29/1608 ,  H01L29/45 ,  H01L29/66068 ,  H01L29/78 ,  H01L29/7806 ,  H01L29/7813

摘要： A method of manufacturing a semiconductor device includes forming an ohmic electrode in a first area on one of main surfaces of a silicon carbide layer, siliciding the ohmic electrode, and forming a Schottky electrode in a second area on the one of the main surfaces of the silicon carbide layer with self alignment. The second area is exposed where the ohmic electrode is not formed.

摘要翻译： 一种制造半导体器件的方法包括：在碳化硅层的一个主表面上的第一区域中形成欧姆电极，将欧姆电极硅化，并在第二区域中形成肖特基电极 具有自对准的碳化硅层。 在没有形成欧姆电极的情况下暴露第二区域。

公开(公告)号：US20080105903A1

公开(公告)日：2008-05-08

申请号：US11976450

申请日：2007-10-24

申请人： Masahito KODAMA ,  Eiko HAYSASHI ,  Masahiro SUGIMOTO

发明人： Masahito KODAMA ,  Eiko HAYSASHI ,  Masahiro SUGIMOTO

IPC分类号： H01L29/205 ,  H01L29/20 ,  H01L21/20

CPC分类号： H01L21/02433 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/0265

摘要： The invention provides a method for producing a group III nitride based semiconductor having a reduced number of crystal defects. A GaN layer 2 is epitaxially grown on a sapphire substrate 1 having C-plane as a main plane (FIG. 1A). Then, the layer is wet-etched by use of a 25% aqueous TMAH solution at 85° C. for one hour, to thereby form an etch pit 4 (FIG. 1B) Then, a GaN layer 5 is grown on the GaN layer 2 through the ELO method (FIG. 1C). The thus-formed GaN layer 5 has a screw dislocation density lower than that of the GaN layer 2.

摘要翻译： 本发明提供一种具有减少晶体缺陷数的III族氮化物基半导体的制造方法。 在具有C面作为主平面的蓝宝石衬底1上外延生长GaN层2（图1A）。 然后，通过在85℃下使用25％TMAH水溶液湿法蚀刻该层1小时，从而形成蚀刻坑4（图1B）然后，在GaN上生长GaN层5 层2通过ELO方法（图1C）。 如此形成的GaN层5的螺旋位错密度低于GaN层2的位错密度。

公开(公告)号：US20130330749A1

公开(公告)日：2013-12-12

申请号：US13968292

申请日：2013-08-15

申请人： Masahiro SUGIMOTO ,  Tomoyoshi SOGA

发明人： Tomoyoshi SOGA ,  Masahiro SUGIMOTO ,  Makoto SUEMATSU ,  Masashi HONMA ,  Takehito YAMAMOTO ,  Hiroshi SUZUKI

IPC分类号： G01N33/487 ,  G01N33/497

CPC分类号： G01N33/487 ,  C07K5/0215 ,  G01N33/497 ,  G01N33/576 ,  G01N33/6812 ,  G01N33/6893 ,  G01N2800/08 ,  G01N2800/60

摘要： A normal person (i.e. a control) and liver diseases such as drug induced liver injury, an asymptomatic hepatitis B carrier, an asymptomatic hepatitis C carrier, chronic hepatitis B, chronic hepatitis C, liver cancer, a nonalcoholic fatty liver disease (NAFLD), nonalcoholic steatohepatitis (NASH), and simple steatosis (SS) are identified by measuring the concentrations of γ-Glu-X (X represents an amino acid or an amine) peptides or the levels of AST or ALT in blood and carrying out, for example, a multiple logistic regression based on the measured value.

摘要翻译： 正常人（即对照）和肝脏疾病如药物诱发的肝损伤，无症状乙型肝炎携带者，无症状丙型肝炎携带者，慢性乙型肝炎，慢性丙型肝炎，肝癌，非酒精性脂肪性肝病（NAFLD） 通过测量血液中的γ-Glu-X（X代表氨基酸或胺）肽的浓度或AST或ALT的水平，进行例如，通过测定非酒精性脂肪性肝炎（NASH）和简单脂肪变性（SS） ，基于测量值的多重逻辑回归。

公开(公告)号：US20100013006A1

公开(公告)日：2010-01-21

申请号：US12502251

申请日：2009-07-14

申请人： Masahiro SUGIMOTO ,  Tsutomu Uesugi ,  Masakazu Kanechika ,  Testsu Kachi

发明人： Masahiro SUGIMOTO ,  Tsutomu Uesugi ,  Masakazu Kanechika ,  Testsu Kachi

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/8122 ,  H01L29/0623 ,  H01L29/0657 ,  H01L29/1029 ,  H01L29/1037 ,  H01L29/1075 ,  H01L29/1079 ,  H01L29/42316 ,  H01L29/7828 ,  H01L29/7832 ,  H01L29/7838 ,  H01L29/812

摘要： A semiconductor device has a semiconductor substrate having a surface layer and a p-type semiconductor region, wherein the surface layer includes a contact region, a channel region and a drift region, the channel region is adjacent to and in contact with the contact region, the drift region is adjacent to and in contact with the channel region and includes n-type impurities at least in part, and the p-type semiconductor region is in contact with the drift region and at least a portion of a rear surface of the channel region, a main electrode disposed on the surface layer and electrically connected to the contact region, a gate electrode disposed on the surface layer and extending from above a portion of the contact region to above at least a portion of the drift region via above the channel region, and an insulating layer covering at least the portion of the contact region and not covering at least the portion of the drift region. The gate electrode and the contact region are insulated by the insulating layer, and the gate electrode and the drift region are in direct contact to form a Schottky junction.

摘要翻译： 半导体器件具有具有表面层和p型半导体区域的半导体衬底，其中表面层包括接触区域，沟道区域和漂移区域，沟道区域与接触区域相邻并与其接触， 漂移区域与沟道区域相邻并且与沟道区域接触并且至少部分地包括n型杂质，并且p型半导体区域与漂移区域和沟道的后表面的至少一部分接触 区域，设置在所述表面层上并电连接到所述接触区域的主电极，设置在所述表面层上并且从所述接触区域的一部分的上方延伸到所述漂移区域的至少一部分之上的栅电极， 以及至少覆盖所述接触区域的部分并且至少覆盖所述漂移区域的部分的绝缘层。 栅极电极和接触区域被绝缘层绝缘，栅电极和漂移区域直接接触形成肖特基结。