公开(公告)号：US11094619B2

公开(公告)日：2021-08-17

申请号：US16595546

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US09984897B2

公开(公告)日：2018-05-29

申请号：US15268674

申请日：2016-09-19

Applicant: Infineon Technologies AG

Inventor： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini ,  Franz-Peter Kalz

IPC: H01L21/48 ,  H01L23/373 ,  H01L21/77 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L21/4807 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/77 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/743 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.

公开(公告)号：US09790086B2

公开(公告)日：2017-10-17

申请号：US15268244

申请日：2016-09-16

Applicant: Infineon Technologies AG

Inventor： Franz-Peter Kalz ,  Horst Theuss ,  Bernhard Winkler ,  Khalil Hosseini ,  Joachim Mahler ,  Manfred Mengel

IPC: G01B7/16 ,  B81B7/02 ,  G01L9/00 ,  G01L19/02 ,  G01L19/00 ,  B81B3/00 ,  G01L1/18

CPC classification number: B81B7/02 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L1/18 ,  G01L9/0072 ,  G01L19/0092 ,  G01L19/02

Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

公开(公告)号：US09741677B1

公开(公告)日：2017-08-22

申请号：US15057481

申请日：2016-03-01

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller ,  Franz-Peter Kalz

IPC: H01L29/82 ,  H01L23/00 ,  H01L27/22

CPC classification number: H01L24/29 ,  G01R33/0052 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/60 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L27/22 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29561 ,  H01L2224/2957 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/30101 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.

公开(公告)号：US20200043836A1

公开(公告)日：2020-02-06

申请号：US16595546

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US10438878B2

公开(公告)日：2019-10-08

申请号：US15949533

申请日：2018-04-10

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US20170256515A1

公开(公告)日：2017-09-07

申请号：US15057481

申请日：2016-03-01

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller ,  Franz-Peter Kalz

IPC: H01L23/00 ,  H01L27/22

CPC classification number: H01L24/29 ,  G01R33/0052 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/60 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L27/22 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29561 ,  H01L2224/2957 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/30101 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.

公开(公告)号：US20160240449A1

公开(公告)日：2016-08-18

申请号：US15095784

申请日：2016-04-11

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Manfred Mengel ,  Khalil Hosseini ,  Franz-Peter Kalz

IPC: H01L23/29 ,  H01L23/495 ,  C25D13/12 ,  H01L21/48 ,  H01L21/56 ,  C25D13/06 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/293 ,  C25D13/06 ,  C25D13/12 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/573 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8492 ,  H01L2224/8592 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/284 ,  H05K2203/135 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.

Abstract translation: 公开了封装组件和制造封装组件的方法。 在一个实施例中，封装部件包括具有部件载体接触件和设置在部件载体上的部件的部件载体，该部件具有部件接触。 封装部件还包括将部件载体接触件与部件接触件连接的导电连接元件，直接设置在部件或导电连接元件的顶表面中的至少一个上的绝缘膜，以及封装部件载体的密封剂， 组件和封闭的导电连接元件。

公开(公告)号：US20140197552A1

公开(公告)日：2014-07-17

申请号：US13742456

申请日：2013-01-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Wolfram Hable ,  Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini ,  Franz-Peter Kalz

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/29 ,  H01L21/56 ,  H01L23/06 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.

Abstract translation: 提供了芯片布置，芯片布置包括载体; 至少一个芯片电连接到载体顶侧; 至少部分地围绕所述至少一个芯片和所述载体顶侧的封装材料，其中所述封装材料形成在所述载体的一个或多个侧面上; 以及设置在载体底侧上的至少一个侧面上的陶瓷材料。

公开(公告)号：US10370244B2

公开(公告)日：2019-08-06

申请号：US15827057

申请日：2017-11-30

Applicant: Infineon Technologies AG

Inventor： Florian Brandl ,  Manfred Fries ,  Franz-Peter Kalz

IPC: B81C1/00 ,  B81B7/00 ,  H01L23/04 ,  H01L23/10 ,  H01L21/50 ,  B29C35/02

Abstract: A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.