公开(公告)号：US20170077016A1

公开(公告)日：2017-03-16

申请号：US15342744

申请日：2016-11-03

Applicant: Invensas Corporation

Inventor： Ashok S. Prabhu ,  Rajesh Katkar ,  Sean Moran

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/29 ,  H01L23/552

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: An assembly includes a plurality of stacked encapsulated microelectronic packages, each package including a microelectronic element having a front surface with a plurality of chip contacts at the front surface and edge surfaces extending away from the front surface. An encapsulation region of each package contacts at least one edge surface and extends away therefrom to a remote surface of the package. The package contacts of each package are disposed at a single one of the remote surfaces, the package contacts facing and coupled with corresponding contacts at a surface of a substrate nonparallel with the front surfaces of the microelectronic elements therein.

Abstract translation: 组件包括多个堆叠的封装的微电子封装，每个封装包括微电子元件，该微电子元件具有在前表面处具有多个芯片触点的前表面和远离前表面延伸的边缘表面。 每个包装的封装区域接触至少一个边缘表面，并从其延伸到包装的远端表面。 每个封装的封装触点设置在远程表面中的单个一个处，封装触点面对并与衬底的与其中的微电子元件的前表面不平行的表面处的相应触点耦合。

公开(公告)号：US09490195B1

公开(公告)日：2016-11-08

申请号：US14883864

申请日：2015-10-15

Applicant: Invensas Corporation

Inventor： Ashok S. Prabhu ,  Rajesh Katkar ,  Sean Moran

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: An assembly includes a plurality of stacked encapsulated microelectronic packages, each package including a microelectronic element having a front surface with a plurality of chip contacts at the front surface and edge surfaces extending away from the front surface. An encapsulation region of each package contacts at least one edge surface and extends away therefrom to a remote surface of the package. The package contacts of each package are disposed at a single one of the remote surfaces, the package contacts facing and coupled with corresponding contacts at a surface of a substrate nonparallel with the front surfaces of the microelectronic elements therein.

Abstract translation: 组件包括多个堆叠的封装的微电子封装，每个封装包括微电子元件，该微电子元件具有在前表面处具有多个芯片触点的前表面和远离前表面延伸的边缘表面。 每个包装的封装区域接触至少一个边缘表面，并从其延伸到包装的远端表面。 每个封装的封装触点设置在远程表面中的单个一个处，封装触点面对并与衬底的与其中的微电子元件的前表面不平行的表面处的相应触点耦合。

公开(公告)号：US09666513B2

公开(公告)日：2017-05-30

申请号：US15342744

申请日：2016-11-03

Applicant: Invensas Corporation

Inventor： Ashok S. Prabhu ,  Rajesh Katkar ,  Sean Moran

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: An assembly includes a plurality of stacked encapsulated microelectronic packages, each package including a microelectronic element having a front surface with a plurality of chip contacts at the front surface and edge surfaces extending away from the front surface. An encapsulation region of each package contacts at least one edge surface and extends away therefrom to a remote surface of the package. The package contacts of each package are disposed at a single one of the remote surfaces, the package contacts facing and coupled with corresponding contacts at a surface of a substrate nonparallel with the front surfaces of the microelectronic elements therein.

公开(公告)号：US09917042B2

公开(公告)日：2018-03-13

申请号：US15147099

申请日：2016-05-05

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Sean Moran

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L21/78 ,  H01L25/10 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/367 ,  H01L25/065 ,  H01L25/16 ,  H01L25/18 ,  H01L23/04 ,  H01L25/00

CPC classification number: H01L23/498 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/1427 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2224/81

Abstract: A dielectric element has a plurality of contacts at a first surface and a plurality of first traces coupled thereto which extend in directions parallel to the first surface. A circuit structure made of a plurality of dielectric layers and electrically conductive features thereon includes a plurality of bumps at a first surface which face the contacts of the dielectric element and are joined thereto. Circuit structure contacts at a second surface opposite the first surface are electrically coupled with the bumps through second traces on the circuit structure, the circuit structure contacts configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements, wherein the microelectronic elements can be assembled therewith such that element contacts thereof face and are joined with the circuit structure contacts.

公开(公告)号：US20160329300A1

公开(公告)日：2016-11-10

申请号：US15147099

申请日：2016-05-05

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Sean Moran

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L23/498 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/1427 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2224/81

Abstract: A dielectric element has a plurality of contacts at a first surface and a plurality of first traces coupled thereto which extend in directions parallel to the first surface. A circuit structure made of a plurality of dielectric layers and electrically conductive features thereon includes a plurality of bumps at a first surface which face the contacts of the dielectric element and are joined thereto. Circuit structure contacts at a second surface opposite the first surface are electrically coupled with the bumps through second traces on the circuit structure, the circuit structure contacts configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements, wherein the microelectronic elements can be assembled therewith such that element contacts thereof face and are joined with the circuit structure contacts.

Abstract translation: 电介质元件在第一表面具有多个触点，并且耦合到其上的多个第一迹线在平行于第一表面的方向上延伸。 由多个电介质层及其导电特征构成的电路结构包括在第一表面处的与电介质元件的触点相对并且与其接合的多个凸块。 在与第一表面相对的第二表面处的电路结构接触通过电路结构上的第二迹线与凸块电耦合，电路结构触点被配置为与多个微电子元件中的每一个的多个元件触点相连接，其中微电子 元件可以与其组装，使得其元件接触面并且与电路结构触点接合。