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82 条记录 (耗时 0.044 秒)

    Printed transistor and fabrication method
    5.
    发明授权
    Printed transistor and fabrication method 有权
    印刷晶体管和制造方法

    公开(公告)号：US09087753B2

    公开(公告)日：2015-07-21

    申请号：US13468576

    申请日：2012-05-10

    申请人： Qinghuang Lin ,  Minhua Lu ,  Robert L. Wisnieff

    发明人： Qinghuang Lin ,  Minhua Lu ,  Robert L. Wisnieff

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L27/12 ,  H01L29/786 ,  H01L29/66 ,  H01L23/532 ,  H01L51/00

    CPC分类号： H01L29/78633 ,  H01L21/283 ,  H01L23/532 ,  H01L23/5329 ,  H01L27/1292 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78618 ,  H01L29/7869 ,  H01L51/0004 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for fabricating a thin film transistor includes printing source, drain and channel regions on a passivated transparent substrate, forming a gate dielectric over the channel region and forming a gate conductor over the gate dielectric. A permanent antireflective coating is deposited over the source region, drain region and gate electrode, and an interlevel dielectric layer is formed over the permanent antireflective coating. Openings in the permanent antireflective coating and the interlevel dielectric layer are formed to provide contact holes to the source region, drain region and gate electrode. A conductor is deposited in the contact holes to electrically connect to the source region, drain region and gate electrode. Thin film transistor devices and other methods are also disclosed.

    摘要翻译： 制造薄膜晶体管的方法包括在钝化的透明衬底上印刷源极，漏极和沟道区域，在沟道区域上形成栅极电介质，并在栅极电介质上形成栅极导体。 永久性抗反射涂层沉积在源极区域，漏极区域和栅极电极上，并且在永久抗反射涂层上形成层间电介质层。 形成永久性抗反射涂层和层间电介质层中的开口以提供与源极区，漏极区和栅电极的接触孔。 导体沉积在接触孔中以电连接到源极区，漏极区和栅电极。 还公开了薄膜晶体管器件和其它方法。

    Liquid crystal integrated circuit and method to fabricate same
    6.
    发明授权
    Liquid crystal integrated circuit and method to fabricate same 有权
    液晶集成电路及其制作方法

    公开(公告)号：US09057915B2

    公开(公告)日：2015-06-16

    申请号：US13482438

    申请日：2012-05-29

    申请人： Minhua Lu ,  Quinghuang Lin ,  Robert L. Wisnieff

    发明人： Minhua Lu ,  Quinghuang Lin ,  Robert L. Wisnieff

    IPC分类号： G02F1/1343 ,  G02F1/1337

    CPC分类号： G02F1/134363 ,  G02F1/133707 ,  G02F1/134336 ,  G02F1/13439

    摘要： A structure includes a first substrate having a first surface and a second substrate having a second surface facing the first surface; liquid crystal material disposed between the first and second surfaces; a first upstanding electrode disposed over the first surface and extending into the liquid crystal material towards the second surface; and a first planar electrode disposed upon the first surface and electrically connected with the first upstanding electrode. The first planar electrode at least partially surrounds the first upstanding electrode. A combination of the first upstanding electrode and the first planar electrode forms at least a portion of a pixel of a liquid crystal display. Various methods to fabricate the structure are also disclosed.

    摘要翻译： 一种结构包括具有第一表面的第一基底和具有面向第一表面的第二表面的第二基底; 设置在第一和第二表面之间的液晶材料; 第一直立电极，设置在第一表面上并延伸到液晶材料朝向第二表面; 以及设置在所述第一表面上并与所述第一直立电极电连接的第一平面电极。 第一平面电极至少部分地围绕第一直立电极。 第一直立电极和第一平面电极的组合形成液晶显示器的像素的至少一部分。 还公开了制造结构的各种方法。

    HDMI cable, HDMI connector and HDMI interface for high definition video/audio playback devices
    7.
    发明申请
    HDMI cable, HDMI connector and HDMI interface for high definition video/audio playback devices 有权
    HDMI电缆，HDMI连接器和HDMI接口，用于高分辨率视频/音频播放设备

    公开(公告)号：US20150044906A1

    公开(公告)日：2015-02-12

    申请号：US14278696

    申请日：2014-05-15

    申请人： Nanlv Tian ,  Jianyun Tang ,  Minhua Lu ,  Shijun Liu ,  Ming Wang

    发明人： Nanlv Tian ,  Jianyun Tang ,  Minhua Lu ,  Shijun Liu ,  Ming Wang

    IPC分类号： H01R13/6463 ,  H01B11/02

    CPC分类号： H01R13/6463 ,  H01B7/0876 ,  H01B11/02 ,  H01R12/79 ,  H01R13/506 ,  H01R23/662

    摘要： An HDMI cable, an HDMI connector and an HDMI interface for a high-definition video/audio apparatus are provided. The HDMI interface includes the HDMI connector and the HDMI cable. The HDMI connector includes a connecting terminal having an extending cable terminal arranged in parallel in a main body. The HDMI cable includes at least one connecting unit consisting of a plurality of parallel metal wires. An insulating unit covers an outside of a face of the connecting unit, in such a manner that the metal wires are parallel and isolated from each other. The present invention is using design of single row of the connector terminal and single row of the HDMI cable, to simplify an HDMI interface structure and reduce size and weight, and manual identification is not required for pin bit definitions, which simplifies production process, reduces the manual work, and greatly improves production efficiency.

    摘要翻译： 提供HDMI电缆，HDMI连接器和用于高分辨率视频/音频设备的HDMI接口。 HDMI接口包括HDMI连接器和HDMI电缆。 HDMI连接器包括具有平行布置在主体中的延伸电缆端子的连接端子。 HDMI电缆包括由多个平行金属线组成的至少一个连接单元。 绝缘单元以金属线彼此平行和隔离的方式覆盖连接单元的表面的外侧。 本发明使用单行连接器端子和单行HDMI电缆的设计，以简化HDMI接口结构并减小尺寸和重量，并且针脚定义不需要手动识别，这简化了生产过程，减少了 手工作业，大大提高生产效率。

    Cooling of substrate using interposer channels
    9.
    发明授权
    Cooling of substrate using interposer channels 有权
    使用插入器通道冷却衬底

    公开(公告)号：US08059400B2

    公开(公告)日：2011-11-15

    申请号：US12233104

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method of forming a structure. An interposer is provided. The interposer is adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.

    摘要翻译： 一种形成结构的方法。 提供了插入器。 插入件适于插入在热源和散热器之间并将热量从热源传递到散热器。 插入器包括封闭空腔的外壳。 外壳由导热材料制成。 空腔包括导热泡沫材料。 泡沫材料包括孔，并且包括至少一个蛇形通道。 每个蛇形通道具有至少两个连续连接的通道段。 每个蛇形通道独立地形成闭环或开放端环。 泡沫材料适于被填充孔的液体浸泡。 每个蛇形通道适于部分地填充有用于将热量从热源传递到散热器的流体。

    Cooling of substrate using interposer channels
    10.
    发明授权
    Cooling of substrate using interposer channels 有权
    使用插入器通道冷却衬底

    公开(公告)号：US07888603B2

    公开(公告)日：2011-02-15

    申请号：US12212925

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K1/00

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.

    摘要翻译： 一个结构。 该结构包括基板和插入件。 衬底在衬底的第一侧上包括热源和N个连续衬底通道（N≥2）。 插入器包括耦合到N个衬底通道的N个连续插入器通道，以形成M个连续环路（1＆amp; NlE; M＆amp; N; N）。 每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。 对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。 每个循环是独立开放的或封闭的。 衬底的第一面连接到插入器。 插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。