公开(公告)号：US20130139753A1

公开(公告)日：2013-06-06

申请号：US13409791

申请日：2012-03-01

申请人： Joon Seok Kang ,  Seung Wan Shin

发明人： Joon Seok Kang ,  Seung Wan Shin

IPC分类号： C23C16/458 ,  C23C16/50

CPC分类号： H01J37/32091 ,  H01L21/68742

摘要： Disclosed herein is an apparatus for manufacturing a substrate. The apparatus for manufacturing a substrate includes: a reaction gas ejector ejecting reaction gas; a lift pin supporting the substrate and having a header contacting a rear surface of the substrate; and a support chuck having a lift pin insertion unit inserted with the lift pin and moving vertically and including a ring in a header insertion portion into which the header is inserted in the lift pin insertion unit.

摘要翻译： 本文公开了一种用于制造基板的装置。 用于制造衬底的装置包括：反应气体喷射器喷射反应气体; 支撑所述基板并且具有与所述基板的后表面接触的头部的升降销; 以及支撑卡盘，其具有插入所述提升销并垂直移动的升降销插入单元，并且在所述插头插入部中包括环，所述插头插入所述插头插入单元中。

公开(公告)号：US08351215B2

公开(公告)日：2013-01-08

申请号：US12320523

申请日：2009-01-28

申请人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

发明人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

IPC分类号： H05K3/00

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155

摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.

摘要翻译： 芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种嵌入式芯片的印刷电路板及其制造方法。 本发明提供了一种芯片嵌入式印刷电路板，其包括嵌入在上部设置有柱的芯片的绝缘层，通过绝缘层形成的通孔，形成在要连接到柱的绝缘层的上部的上部图案， 形成在绝缘层的与通孔连接的下部的通孔和下部图案及其制造方法。

公开(公告)号：US20090321118A1

公开(公告)日：2009-12-31

申请号：US12230874

申请日：2008-09-05

申请人： Woon Chun Kim ,  Soon Gyu Yim ,  Joon Seok Kang

发明人： Woon Chun Kim ,  Soon Gyu Yim ,  Joon Seok Kang

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/0203 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/284 ,  H05K2201/1056 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board and a manufacturing method thereof. The electronic component embedded printed circuit board includes an insulating layer forming a core layer; an electronic component inserted to project a part thereof on an upper part of the insulating layer; a metallic seed layer formed on the insulating layer including a projected surface of the electronic component; a plating layer formed on the metallic seed layer; circuit patterns electrically connected to pads of the electronic component through via-holes formed on the insulating layer; and a solder resist layer which is formed on the insulating layer and has solder balls attached onto the via-holes electrically connected to the circuit patterns. In the electronic component embedded printed circuit board, a heat radiation characteristic can be maximized and a thickness of the printed circuit board can be minimized. In case that the insulating is made of a thermoplastic resin, the electronic component can be reutilized, thereby saving product cost.

摘要翻译： 一种电子部件嵌入式印刷电路板及其制造方法。 电子部件嵌入式印刷电路板包括形成芯层的绝缘层; 被插入以将其部分投影在绝缘层的上部上的电子部件; 形成在绝缘层上的金属种子层，包括电子部件的投影表面; 形成在所述金属种子层上的镀层; 电路图案通过形成在绝缘层上的通孔电连接到电子部件的焊盘; 以及阻焊层，其形成在绝缘层上并且具有附着到电连接到电路图案的通孔上的焊球。 在电子部件嵌入式印刷电路板中，可以使热辐射特性最大化，并且可以使印刷电路板的厚度最小化。 在绝热材料由热塑性树脂制成的情况下，电子部件可以再利用，从而节省产品成本。

公开(公告)号：US07113689B2

公开(公告)日：2006-09-26

申请号：US10606348

申请日：2003-06-26

申请人： Yoon Shik Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee ,  Suk Kee Hong ,  Joon Seok Kang ,  Jung Hyun Lee

发明人： Yoon Shik Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee ,  Suk Kee Hong ,  Joon Seok Kang ,  Jung Hyun Lee

IPC分类号： G02B6/00

CPC分类号： G02B6/353 ,  G02B6/266 ,  G02B6/35 ,  G02B6/3552 ,  G02B6/356 ,  G02B6/357 ,  G02B6/358 ,  G02B6/3582 ,  G02B6/3592 ,  G02B6/3594

摘要： An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.

摘要翻译： MEMS可变光衰减器包括具有平面表面的基板，布置在基板的平面表面上的微电致动器，分别具有接收端和发射端的一对同轴对准的光波导，以及可移动的光闸 到光波导的接收端和发送端之间的预定位置，并由微电动致动器驱动。 表面层形成在光学快门上，具有小于80％的反射率，以便使入射光束部分地透射，并且还具有足够的消光比，由此熄灭其中部分透射的光束。

公开(公告)号：US06552839B1

公开(公告)日：2003-04-22

申请号：US10104692

申请日：2002-03-21

申请人： Yoon Shik Hong ,  Joon Seok Kang ,  Sang Kee Yoon ,  Sung Cheon Jung ,  Jung Hyun Lee ,  Hyun Kee Lee

发明人： Yoon Shik Hong ,  Joon Seok Kang ,  Sang Kee Yoon ,  Sung Cheon Jung ,  Jung Hyun Lee ,  Hyun Kee Lee

IPC分类号： G02B2600

CPC分类号： G02B6/358 ,  B81B3/0054 ,  B81B2201/045 ,  B81B2203/053 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/357 ,  G02B6/3584 ,  G02B26/0841 ,  H02N1/006

摘要： Disclosed herein is an optical switch. The optical switch includes an electrostatic actuator and a substrate. The electrostatic actuator includes an electrostatic actuator, the electrostatic actuator comprising, a reciprocating mass located in the center of the electrostatic actuator, first rotating axes located symmetrically at the left and right sides of the reciprocating mass, first rotating masses rotatably connected to the first rotating axes, first rotating springs for supporting the first rotating masses, linear springs connected to the first rotating masses, second rotating masses connected to the linear springs, second rotating springs for supporting the second rotating masses, second rotating axes connected to the second rotating masses, structural anchors at the side ends of the actuator, drive electrodes, and a micro mirror movable by the same displacement as the reciprocating mass.

摘要翻译： 这里公开了一种光开关。 光开关包括静电致动器和基板。 所述静电致动器包括静电致动器，所述静电致动器包括位于所述静电致动器的中心的往复运动物质，位于所述往复运动质量块的左右两侧的第一旋转轴，所述第一旋转体可旋转地连接到所述第一旋转 轴，用于支撑第一旋转块的第一旋转弹簧，连接到第一旋转块的线性弹簧，连接到线性弹簧的第二旋转块，用于支撑第二旋转块的第二旋转弹簧，连接到第二旋转块的第二旋转轴， 在致动器的侧端处的结构锚固件，驱动电极和可与往复运动块相同位移的微反射镜。

公开(公告)号：US08334602B2

公开(公告)日：2012-12-18

申请号：US12547284

申请日：2009-08-25

申请人： Joon Seok Kang ,  Young Do Kweon ,  Hong Won Kim ,  Jingli Yuan

发明人： Joon Seok Kang ,  Young Do Kweon ,  Hong Won Kim ,  Jingli Yuan

IPC分类号： H01L29/72

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3171 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized.

摘要翻译： 本文公开了一种包括封装模具的模具封装，包括：一个模具，其在其一侧包括焊盘; 覆盖所述管芯的侧面的封装层; 覆盖该封装层和该芯片的一侧的支撑层; 钝化层，形成在所述管芯的另一侧上，使得所述焊盘暴露在其中; 以及形成在钝化层上的再分配层，使得其一部分与焊盘连接。 这里，由于模具的一侧由支撑层支撑，并且仅在模具的侧面形成封装层，所以能够将由于热膨胀系数的差异导致的模具封装的翘曲最小化。

公开(公告)号：US08110914B2

公开(公告)日：2012-02-07

申请号：US12318752

申请日：2009-01-07

申请人： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

发明人： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L23/3114 ,  H01L21/56 ,  H01L21/568 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A wafer level package includes a chip, a removable resin layer, a molding material, a dielectric layer, redistribution lines and a solder resist. The removable resin layer is formed to surround side surfaces and a lower surface of the chip. The molding material is formed on the lower surface of the removable resin layer. The dielectric layer is formed over the removable resin layer including the chip and having via holes to expose portions of the chip. The redistribution lines are formed on the dielectric layer including insides of the via holes to be connected to the chip. The solder resist layer is formed on the dielectric layer to expose portions of the redistribution lines.

摘要翻译： 晶片级封装包括芯片，可移除树脂层，成型材料，电介质层，再分布线和阻焊剂。 可移除树脂层形成为围绕芯片的侧表面和下表面。 成型材料形成在可移除树脂层的下表面上。 电介质层形成在包括芯片的可移除树脂层上，并且具有通孔以暴露芯片的部分。 再分配线形成在包括要连接到芯片的通孔的内部的电介质层上。 在电介质层上形成阻焊层以暴露再分布线的部分。

公开(公告)号：US20110108993A1

公开(公告)日：2011-05-12

申请号：US12805334

申请日：2010-07-26

申请人： Joon Seok Kang ,  Young Do Kweon ,  Seung Wook Park ,  Jong Yun Lee ,  Kyung Seob Oh

发明人： Joon Seok Kang ,  Young Do Kweon ,  Seung Wook Park ,  Jong Yun Lee ,  Kyung Seob Oh

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L23/49827 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0231 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/185 ,  H05K2201/10674 ,  H05K2203/1469 ,  H01L2924/00

摘要： There is provided a semiconductor package including: a circuit board having a receiving space formed therein; a semiconductor chip inserted into the receiving space of the circuit board; and an electrode pattern portion having a pattern shape on one surface of the semiconductor chip, and directly contacting a via portion of the circuit board so as to be electrically connected thereto.

摘要翻译： 提供一种半导体封装，包括：电路板，其中形成有容纳空间; 插入电路板的接收空间中的半导体芯片; 以及在半导体芯片的一个表面上具有图案形状的电极图形部分，并且与电路板的通孔部分直接接触以与其电连接。

公开(公告)号：US20090302468A1

公开(公告)日：2009-12-10

申请号：US12232252

申请日：2008-09-12

申请人： Jong Hwan Baek ,  Sung Yi ,  Young Do Kweon ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Joon Seok Kang

发明人： Jong Hwan Baek ,  Sung Yi ,  Young Do Kweon ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Joon Seok Kang

IPC分类号： H01L23/488 ,  H01L21/56

CPC分类号： H05K3/3436 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board including a semiconductor chip, which includes a semiconductor chip having a connection pad, which is exposed, on the upper surface thereof, a first solder ball formed on the connection pad and having a first melting point, a printed circuit board having an external connection terminal formed at the outermost circuit layer thereof, and a second solder ball formed on the external connection terminal, connected to the first solder ball, and having a second melting point higher than the first melting point. In the printed circuit board including a semiconductor chip, the distance between the printed circuit board and the semiconductor chip is increased, thus realizing high resistance to flexure due to the difference in thermal expansion coefficient between the printed circuit board and the semiconductor chip.

摘要翻译： 公开了一种印刷电路板，其包括半导体芯片，该半导体芯片包括具有连接焊盘的半导体芯片，该连接焊盘在其上表面上露出形成在连接焊盘上并具有第一熔点的第一焊球，印刷电路 板上具有形成在其最外侧电路层的外部连接端子，和形成在外部连接端子上的第二焊球，与第一焊球相连，并具有高于第一熔点的第二熔点。 在包括半导体芯片的印刷电路板中，印刷电路板和半导体芯片之间的距离增加，由于印刷电路板和半导体芯片之间的热膨胀系数的差异，实现了高抗弯曲性。

公开(公告)号：US06833288B2

公开(公告)日：2004-12-21

申请号：US10412465

申请日：2003-04-11

申请人： Joon Seok Kang ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee

发明人： Joon Seok Kang ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee

IPC分类号： H01L2144

CPC分类号： B81C1/00888 ,  B81C1/00896 ,  B81C2201/053

摘要： A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).

摘要翻译： 一种用于微机电系统芯片的切割方法，其中可以通过使用保护掩模在切割过程中防止对微结构的损害而实现高产量和高生产率的芯片。 一种微机电系统芯片的切割方法，其特征在于，包括如下步骤：在作为保护罩的透明胶带的非粘合表面上以芯片尺度设计网格线和晶片图案（第一步骤）。 在透明胶带的粘合剂表面上粘附微结构保护膜（第二步）; 将透明带放置在晶片的整个表面上，其中设计在透明带的非粘合表面上的栅格线与晶片的切割线相匹配（第三步）。 将透明胶带切割成比晶片大的尺寸，将晶片安装在引导环上并切割晶片（第四步骤）; 并将透明胶带分离成切片（第五步）。