公开(公告)号：US20170162555A1

公开(公告)日：2017-06-08

申请号：US15346089

申请日：2016-11-08

申请人： Junglae Jo ,  Yeo-Hoon Yoon ,  Hojeong Moon ,  Taeeun Kim

发明人： Junglae Jo ,  Yeo-Hoon Yoon ,  Hojeong Moon ,  Taeeun Kim

IPC分类号： H01L25/18 ,  B23K35/26 ,  H01L25/065 ,  C22C13/00 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L25/18 ,  B23K35/262 ,  C22C13/00 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/75283 ,  H01L2224/8121 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8149 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/00

摘要： Solder compositions for semiconductor fabrication are provided that include silver (Ag) of 3.0 wt. % to 4.0 wt. %, copper (Cu) of 0.75 wt. % to 1.0 wt. %, nickel (Ni) of 0.08 wt. % to 1.0 wt. %, and tin (Sn) of 94 wt. % to 96.17 wt. %, or that include bismuth (Bi) of 0.3 wt. % to 2.0 wt. % in place of a portion of the tin (Sn) in the solder composition; and, semiconductor packages are also provided that use the solder compositions for bonding one or more components of the semiconductor packages to each other.

公开(公告)号：US08399987B2

公开(公告)日：2013-03-19

申请号：US12951140

申请日：2010-11-22

申请人： Woonseong Kwon ,  Hyuekjae Lee ,  Taeje Cho ,  Yonghwan Kwon ,  Jung-Hwan Kim ,  Chiyoung Lee ,  Taeeun Kim

发明人： Woonseong Kwon ,  Hyuekjae Lee ,  Taeje Cho ,  Yonghwan Kwon ,  Jung-Hwan Kim ,  Chiyoung Lee ,  Taeeun Kim

IPC分类号： H01L23/04 ,  H01L21/30

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02166 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/732 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.

摘要翻译： 微电子器件包括延伸到衬底表面中并且还突出超过衬底表面以限定导电通孔端表面的导电通孔和从端表面朝向衬底面延伸的导电通孔侧壁。 导电盖设置在端表面上，导电盖包括延伸穿过端表面的导电盖本体和从导电盖主体沿着导电通孔侧壁朝向衬底面延伸的凸缘。 还描述了相关的制造方法。

公开(公告)号：US08948966B2

公开(公告)日：2015-02-03

申请号：US13780928

申请日：2013-02-28

申请人： Taeeun Kim ,  Hakkyu Kim ,  Saewon Oh ,  Younwoo Lim ,  Sangjun Yoo ,  Jungjae Lee ,  Youngho Choi ,  Sungho Kang ,  Jeonghun Seo

发明人： Taeeun Kim ,  Hakkyu Kim ,  Saewon Oh ,  Younwoo Lim ,  Sangjun Yoo ,  Jungjae Lee ,  Youngho Choi ,  Sungho Kang ,  Jeonghun Seo

IPC分类号： G06F7/00 ,  F25B1/00 ,  B60H1/00 ,  F25B29/00 ,  B60H1/22 ,  B60H1/32

CPC分类号： F25B29/003 ,  B60H1/00921 ,  B60H1/2218 ,  B60H1/3216 ,  B60H2001/3238 ,  B60H2001/3261 ,  B60H2001/3272

摘要： Disclosed therein are a heat pump system for a vehicle and a method of controlling the heat pump system, which variably controls only a compressor if the number of revolutions of the compressor is less than the upper limit of the number of the maximum revolutions of the compressor and operates an electric heater only when the number of revolutions of the compressor reaches the upper limit of the number of the maximum revolutions of the compressor in order to satisfy a target discharge temperature in a heat pump mode, thereby preventing that convergence of an air discharge temperature of the interior of the vehicle is deteriorated or becomes unstable when the compressor and the electric heater are variably controlled at the same time in order to satisfy the target discharge temperature.

摘要翻译： 其中公开了一种用于车辆的热泵系统和一种控制热泵系统的方法，该系统仅在压缩机的转数小于压缩机的最大转数的上限时可变地仅控制压缩机 并且仅当压缩机的转数达到压缩机的最大转速的上限以满足热泵模式中的目标排出温度时才操作电加热器，从而防止空气排出 为了满足目标排放温度，当压缩机和电加热器同时可变地控制时，车辆内部的温度劣化或变得不稳定。

公开(公告)号：US20110133333A1

公开(公告)日：2011-06-09

申请号：US12951140

申请日：2010-11-22

申请人： Woonseong Kwon ,  Hyuekjae Lee ,  Taeje Cho ,  Yonghwan Kwon ,  Jung-Hwan Kim ,  Chiyoung Lee ,  Taeeun Kim

发明人： Woonseong Kwon ,  Hyuekjae Lee ,  Taeje Cho ,  Yonghwan Kwon ,  Jung-Hwan Kim ,  Chiyoung Lee ,  Taeeun Kim

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02166 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/732 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.

摘要翻译： 微电子器件包括延伸到衬底表面中并且还突出超过衬底表面以限定导电通孔端表面的导电通孔和从端表面朝向衬底面延伸的导电通孔侧壁。 导电盖设置在端表面上，导电盖包括延伸穿过端表面的导电盖本体和从导电盖主体沿着导电通孔侧壁朝向衬底面延伸的凸缘。 还描述了相关的制造方法。