摘要:
A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip.
摘要:
A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip.
摘要:
A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip.
摘要:
A semiconductor device having a metal layer at the peripheral area surrounding an element forming area formed on a semiconductor substrate. This metal layer may be connected to the grounding potential or the power potential. The peripheral area is a scribing line area for example. The metal layer may be formed simultaneously with the formation of a bump within the element forming area.
摘要:
A semiconductor device having a metal layer at the peripheral area surrounding an element forming area formed on a semiconductor substrate. This metal layer may be connected to the grounding potential or the power potential. The peripheral area is a scribing line area for example. The metal layer may be formed simultaneously with the formation of a bump within the element forming area.
摘要:
Insulating layers are formed, for instance, by ion injection, in a multilayer of compound semiconductor layers in regions spaced at predetermined intervals, to leave a plurality of narrow channel layers between the insulating layers. A gate electrode is formed on the insulating layers and channel layers so as to traverse those layers.
摘要:
The present invention relates to techniques including a phenolic oligomer of general formula (1): wherein n is an integer of 0 to 15, Rs are allyl groups, a1 and a3 are each independently 0, 1, 2 or 3, each a2 is independently 0, 1 or 2, each R′ is independently a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an aryl group, and proviso that at least one of a1, each a2 and a3 represents 2, and a method for producing such phenolic oligomer.
摘要:
A gate electrode in an NMOS region is one of intrinsic silicon and a material having a work function equivalent to that of intrinsic silicon, and a material having a work function smaller than that of intrinsic silicon. A gate electrode in a PMOS region is one of intrinsic silicon and a material having a work function equivalent to that of intrinsic silicon, and a material having a work function larger than that of intrinsic silicon. Further, a source/drain region in the NMOS region includes a silicide layer of a material having a work function smaller than that of intrinsic silicon, and a source/drain region in the PMOS region includes a silicide layer of a material having a work function larger than that of intrinsic silicon.
摘要:
A compound semiconductor device includes an undoped semiconductor layer; a doped semiconductor layer formed on the undoped semiconductor layer and having smaller electron affinity than the undoped semiconductor layer, impurities being doped in the doped semiconductor layer; a gate electrode formed on the doped semiconductor layer; and a source electrode and a drain electrode respectively formed at both sides of the gate electrode, wherein an impurity concentration of the doped semiconductor layer is selected such that a portion of the doped semiconductor layer located immediately below the gate electrode is not completely depleted in a state in which a gate voltage is not applied to the gate electrode, and is completely depleted in a state in which a negative voltage for minimizing a noise figure is applied to the gate electrode.
摘要:
A field-effect transistor (FET) in which an InGaAs layer formed on a GaAs substrate is formed in such a manner that the In composition ratio on the gate electrode side on the substrate surface is made small and the In composition ratio on the GaAs substrate side is made large. Thereby, the FET does not cause a decline in the mutual conductance in the FET and a decline in the noise figure (NF) even if negative voltage is applied to a gate electrode.