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    Optoelectronic Module
    1.
    发明申请
    Optoelectronic Module 审中-公开
    光电模块

    公开(公告)号：US20120228666A1

    公开(公告)日：2012-09-13

    申请号：US13496805

    申请日：2010-09-06

    申请人： Karl Weidner ,  Matthias Rebhan ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

    发明人： Karl Weidner ,  Matthias Rebhan ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

    IPC分类号： H01L33/36

    CPC分类号： H01L33/44 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/24

    摘要： An optoelectronic module has at least one carrier with at least one contact location. A semiconductor chip emitting radiation includes a first contact surface and a second contact surface. An electrically insulating layer has a first and a second recess. The first contact surface is disposed on the side of the semiconductor chip emitting radiation facing away from the carrier. The electrically insulating layer is applied at least in places to the carrier. The semiconductor chip includes the first recess in the area of the first contact surface and the second recess in the area of the contact location. A electrically conductive conductor structure is disposed on the electrically insulating layer. The first contact surface electrically contacts the contact location of the carrier. The electrically insulating layer is formed predominately from a ceramic material.

    摘要翻译： 光电子模块具有至少一个具有至少一个接触位置的载体。 发射辐射的半导体芯片包括第一接触表面和第二接触表面。 电绝缘层具有第一和第二凹部。 第一接触表面设置在半导体芯片发射背离载体的辐射的一侧。 电绝缘层至少施加到载体的位置。 半导体芯片包括在第一接触表面的区域中的第一凹部和在接触位置的区域中的第二凹部。 导电导体结构设置在电绝缘层上。 第一接触表面电接触载体的接触位置。 电绝缘层主要由陶瓷材料形成。

    OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING IT
    6.
    发明申请
    OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING IT 有权
    光电元件及其生产方法

    公开(公告)号：US20130307004A1

    公开(公告)日：2013-11-21

    申请号：US13822367

    申请日：2011-08-22

    申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

    发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

    IPC分类号： H01L33/60 ,  H01L33/62

    CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

    摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.

    摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。

    Optoelectronic component and method for producing it
    10.
    发明授权
    Optoelectronic component and method for producing it 有权
    光电元件及其制造方法

    公开(公告)号：US08901592B2

    公开(公告)日：2014-12-02

    申请号：US13822367

    申请日：2011-08-22

    申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

    发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

    IPC分类号： H01L33/62 ,  H01L33/60 ,  H01L23/00 ,  H01L23/055 ,  H01L33/50 ,  H01L33/54

    CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

    摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.

    摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。