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1.发明申请公开(公告)号：US20130193470A1
公开(公告)日：2013-08-01
申请号：US13816196
申请日：2011-08-10
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Gertrud Kraeuter
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Gertrud Kraeuter
CPC分类号： H01L33/44 , H01L23/29 , H01L24/24 , H01L33/0095 , H01L33/56 , H01L33/60 , H01L2924/12041 , H01L2933/005 , H01L2924/00
摘要： An optoelectronic component includes a protective layer including a material containing hydrophobic groups. Furthermore, a method is described, by means of which an optoelectronic component can be produced, and in which a protective layer including hydrophobic groups is applied.
摘要翻译： 光电子部件包括包含含有疏水基团的材料的保护层。 此外，描述了可以产生光电子部件并且其中施加包括疏水基团的保护层的方法。
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公开(公告)号：US20130307004A1
公开(公告)日：2013-11-21
申请号：US13822367
申请日：2011-08-22
CPC分类号： H01L33/60 , H01L23/055 , H01L24/18 , H01L24/24 , H01L24/82 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/24 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244
摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.
摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。
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3.发明申请公开(公告)号：US20130207139A1
公开(公告)日：2013-08-15
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译： 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。
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4.发明授权Radiation-emitting component and method for producing radiation-emitting components 有权辐射发射部件和用于产生辐射发射部件的方法公开(公告)号：US09159889B2
公开(公告)日：2015-10-13
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60 , H01L33/20 , H01L33/38 , H01L33/58 , G02F1/1335 , H01L25/075 , H01L33/40 , H01L33/46
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译： 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。
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公开(公告)号：US08901592B2
公开(公告)日：2014-12-02
申请号：US13822367
申请日：2011-08-22
CPC分类号： H01L33/60 , H01L23/055 , H01L24/18 , H01L24/24 , H01L24/82 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/24 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244
摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.
摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。
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6.发明授权公开(公告)号：US09105771B2
公开(公告)日：2015-08-11
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/00 , H01L33/62 , H01L23/00 , H01L21/768 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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7.发明申请公开(公告)号：US20130214323A1
公开(公告)日：2013-08-22
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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公开(公告)号：US20120299041A1
公开(公告)日：2012-11-29
申请号：US13515256
申请日：2010-11-17
IPC分类号： H01L33/60
CPC分类号： H01L33/56 , H01L31/035281 , H01L33/505
摘要： An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.
摘要翻译： 光电子半导体元件包括具有辐射耦合输出区域的辐射发射半导体芯片。 在半导体芯片中产生的电磁辐射通过辐射耦合输出区离开半导体芯片。 转换器元件设置在半导体芯片的辐射耦合输出区域的下游。 转换器元件被配置为转换由半导体芯片发射的电磁辐射。 转换器元件具有背离辐射耦合输出区域的第一表面。 反射封装以形状配合的方式将半导体芯片和转换器元件的部分封装在侧面区域。 转换器元件的第一表面没有反射封装。
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公开(公告)号：US09029907B2
公开(公告)日：2015-05-12
申请号：US13515256
申请日：2010-11-17
IPC分类号： H01L33/60 , H01L33/56 , H01L31/0352 , H01L33/50
CPC分类号： H01L33/56 , H01L31/035281 , H01L33/505
摘要： An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.
摘要翻译： 光电子半导体元件包括具有辐射耦合输出区域的辐射发射半导体芯片。 在半导体芯片中产生的电磁辐射通过辐射耦合输出区离开半导体芯片。 转换器元件设置在半导体芯片的辐射耦合输出区域的下游。 转换器元件被配置为转换由半导体芯片发射的电磁辐射。 转换器元件具有背离辐射耦合输出区域的第一表面。 反射封装以形状配合的方式将半导体芯片和转换器元件的部分封装在侧面区域。 转换器元件的第一表面没有反射封装。
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公开(公告)号：US09818921B2
公开(公告)日：2017-11-14
申请号：US13703127
申请日：2011-06-10
IPC分类号： H01L29/227 , H01L33/60 , H01L33/46 , H01L23/29 , H01L23/31 , H01L23/00 , H01L25/075 , H01L31/0232 , H01L33/54 , H01L33/62 , H01L25/16 , H01L23/60
CPC分类号： H01L33/60 , H01L23/295 , H01L23/3121 , H01L23/60 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0753 , H01L25/167 , H01L31/0232 , H01L33/46 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01079 , H01L2924/05032 , H01L2924/05432 , H01L2924/12036 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45099
摘要： An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.
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