公开(公告)号：US06918705B2

公开(公告)日：2005-07-19

申请号：US10633623

申请日：2003-08-05

申请人： Kazunori Sakurai ,  Kazushige Umetsu ,  Akihiro Murata

发明人： Kazunori Sakurai ,  Kazushige Umetsu ,  Akihiro Murata

IPC分类号： G02B6/24 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4212 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4239 ,  G02B6/4242 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4274 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599

摘要： An optical module comprising: an optical fiber; an optical element having an optical section and with a fixed position relative to the optical fiber; and a semiconductor chip electrically connected to the optical element, and the optical element and semiconductor chip being packaged. A hole is formed in the semiconductor chip, and the optical element is mounted on the semiconductor chip with the optical section facing the hole, and the optical fiber is inserted in the hole and fitted to the semiconductor chip.

摘要翻译： 一种光学模块，包括：光纤; 具有光学部分并且相对于光纤具有固定位置的光学元件; 以及与光学元件电连接的半导体芯片，并且所述光学元件和半导体芯片被封装。 在半导体芯片中形成孔，并且将光学元件安装在半导体芯片上，其中光学部件面向孔，并且将光纤插入孔中并将其装配到半导体芯片。

公开(公告)号：US06623178B1

公开(公告)日：2003-09-23

申请号：US09593462

申请日：2000-06-14

申请人： Kazunori Sakurai ,  Kazushige Umetsu ,  Akihiro Murata

发明人： Kazunori Sakurai ,  Kazushige Umetsu ,  Akihiro Murata

IPC分类号： G02B636

CPC分类号： G02B6/4201 ,  G02B6/4212 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4239 ,  G02B6/4242 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4274 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599

摘要： An optical module comprising: an optical fiber; an optical element having an optical section and with a fixed position relative to the optical fiber; and a semiconductor chip electrically connected to the optical element, and the optical element and semiconductor chip being packaged. A hole is formed in the semiconductor chip, and the optical element is mounted on the semiconductor chip with the optical section facing the hole, and the optical fiber is inserted in the hole and fitted to the semiconductor chip.

摘要翻译： 一种光学模块，包括：光纤; 具有光学部分并且相对于光纤具有固定位置的光学元件; 以及与光学元件电连接的半导体芯片，并且所述光学元件和半导体芯片被封装。 在半导体芯片中形成孔，并且将光学元件安装在半导体芯片上，其中光学部件面向孔，并且将光纤插入孔中并将其装配到半导体芯片。

公开(公告)号：US20090133830A1

公开(公告)日：2009-05-28

申请号：US12317201

申请日：2008-12-18

申请人： Hayato Kazeoka ,  Sotoji Ohsasa ,  Akihiro Murata ,  Tadaaki Ochiai

发明人： Hayato Kazeoka ,  Sotoji Ohsasa ,  Akihiro Murata ,  Tadaaki Ochiai

IPC分类号： B32B37/10

CPC分类号： B32B37/206 ,  B32B5/142 ,  B32B7/005 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B27/20 ,  B32B2250/40 ,  B32B2307/4026 ,  B32B2307/714 ,  B32B2307/75 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2439/66 ,  B32B2439/70 ,  Y10T428/31678

摘要： When laminating two types of film (1, 2) with different melting points on the two sides of a metal sheet (3), the thickness of the low melting point side film (2) is adjusted. Specifically, the thickness d2 of the low melting point side film (2) at the part sandwiched between the lamination roll (10) and metal sheet (3) is made a range defined by d2≧k(ΔMP−ΔT)/V. Here, ΔMP is the difference of melting points of the two types of film, k is k≧2, O

摘要翻译： 当在金属片（3）的两侧层压具有不同熔点的两种类型的膜（1,2）时，调节低熔点侧膜（2）的厚度。 具体地说，夹在层叠辊（10）和金属片（3）之间的部分处的低熔点侧膜（2）的厚度d2被制成由d2> = k（DeltaMP-ΔT）/ V限定的范围。 这里，DeltaMP是两种类型的膜的熔点的差，k是k> = 2，O <ΔT= MP1-PhiTi <= 50（℃）（Ti是入口侧的金属片温度 辊V是片材运行速度，Phi是通过层压时的除热条件确定的常数，其中0.75 <= Phi <1）。 由此，可以防止将低熔点侧膜（2）粘附到层叠辊（10）上。

公开(公告)号：US07096579B2

公开(公告)日：2006-08-29

申请号：US10778107

申请日：2004-02-17

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： H05K3/30

CPC分类号： H01L33/56 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01S5/0222 ,  H01S5/02228 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/183 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/53191 ,  H01L2224/0401

摘要： The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a second portion surrounding the first portion is adhered to the substrate, and a closed space is defined between the first portion and the substrate. The optical element is mounted on the substrate within the closed space.

摘要翻译： 本发明提供了一种具有光学元件，基底和柔性构件的光学装置。 柔性构件的第一部分设置成与衬底间隔开，围绕第一部分的第二部分粘附到衬底上，并且在第一部分和衬底之间限定封闭空间。 光学元件安装在封闭空间内的基板上。

公开(公告)号：US06961182B2

公开(公告)日：2005-11-01

申请号：US10910795

申请日：2004-08-03

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： B81B7/02 ,  B81B7/00 ,  G02B26/08 ,  H01H59/00 ,  G02B27/00

CPC分类号： B81B7/007 ,  B81C2203/0118 ,  G02B26/0841 ,  H01H59/0009 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10155 ,  Y10S359/90 ,  H01L2924/00014

摘要： A micro electro mechanical systems (MEMS) device includes a first substrate on which an electrode is formed, a movable substrate having at least a moving part and a periphery supporting member, and a second substrate having a concave portion. A space that includes a part of the concave portion is formed by jointing the first substrate, the movable substrate, and the second substrate together. The moving part inside the space moves when a voltage is applied between the electrode and the moving part through the periphery supporting member, and a part of the first substrate protrudes outside a side surface of the second substrate.

摘要翻译： 微电子机械系统（MEMS）装置包括其上形成有电极的第一基板，至少具有移动部分和周边支撑部件的可移动基板以及具有凹部的第二基板。 包括凹部的一部分的空间通过将第一基板，可动基板和第二基板接合在一起而形成。 当通过周边支撑构件在电极和移动部件之间施加电压时，空间内的移动部分移动，并且第一基板的一部分突出到第二基板的侧表面的外侧。

公开(公告)号：US06945707B2

公开(公告)日：2005-09-20

申请号：US09834614

申请日：2001-04-16

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： G02B6/42 ,  G02B6/43 ,  H01L21/56 ,  H01L23/52 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4201 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4274 ,  H01L2224/48091 ,  H05K1/187 ,  H05K3/20 ,  H01L2924/00014

摘要： A three-dimensional mounted assembly includes a molded body, a plurality of electronic parts sealed with the molded body, a plurality of interconnections electrically connected to the electronic parts and sealed with the molded body wherein part of at least one of the interconnections is exposed on a first side of the molded body and at least another one of the interconnections is exposed on a second side of the molded body differing from the first side.

公开(公告)号：US20050111008A1

公开(公告)日：2005-05-26

申请号：US10953876

申请日：2004-09-29

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： G01N21/05 ,  G01J3/26 ,  G01N21/01 ,  G01N21/17 ,  G01N21/31 ,  G01N21/35 ,  G01N21/3577 ,  G01N21/59 ,  G02B5/28 ,  G02B26/00 ,  G01B9/02

CPC分类号： G01J3/26 ,  G01J3/0256 ,  G01N21/31 ,  G02B26/001

摘要： An analyzer includes an optical tunable filter 1 for selectively outputting light having a predetermined wavelength, and a PD 421 for receiving light outputted from the optical tunable filter 1 and then passed through or reflected by an object to be measured. The optical tunable filter 1 includes a first substrate 3 including a movable portion 31 having a light transmitting property; a second substrate 2 having a light transmitting property, the second substrate being provided so as to be opposed to the first substrate; a first gap 21 and a second gap 22 which are respectively provided between the movable portion 31 of the first substrate 3 and the second substrate 2; an interference portion which cases interference with light that enters the optical tunable filter 1 and that has the predetermined wavelength between the movable portion and the second substrate 2 by means of the second gap 22; and a driving portion for changing a distance of the second gap 22 by displacing the movable portion 31 with respect to the second substrate 2 using the first gap 21.

摘要翻译： 分析器包括用于选择性地输出具有预定波长的光的光学可调谐滤光器1和用于接收从光学可调谐滤光器1输出的光然后通过或被待测物体反射的PD 421。 光可调谐滤光器1包括具有透光性的可动部31的第一基板3; 具有透光性的第二基板2，第二基板设置成与第一基板相对; 分别设置在第一基板3的可动部31和第二基板2之间的第一间隙21和第二间隙22; 干涉部分，其通过第二间隙22干扰进入光可调谐滤光器1并具有预定波长的可移动部分和第二基板2之间的光; 以及用于通过使用第一间隙21使可动部31相对于第二基板2移位来改变第二间隙22的距离的驱动部。

公开(公告)号：US20050094297A1

公开(公告)日：2005-05-05

申请号：US10946621

申请日：2004-09-21

申请人： Akihiro Murata ,  Ryosuke Nakamura ,  Shinichi Kamisuki

发明人： Akihiro Murata ,  Ryosuke Nakamura ,  Shinichi Kamisuki

IPC分类号： G02B26/00 ,  B81B3/00 ,  G02B5/20 ,  G02B5/28 ,  H01P1/203 ,  H01P1/20

CPC分类号： H01P1/20381

摘要： An optical tunable filter includes a first substrate 3 having a light transmitting property which includes a movable portion 31, a second substrate 20 having a light transmitting property which is provided so as to be opposed to the first substrate, a first gap 21 and a second gap 22 which are respectively provided between the movable portion 31 and the second substrate 20, an interference portion which causes interference of incident light between the movable portion 31 and the second substrate 20 through the second gap 22, and a driving portion which changes a distance of the second gap 22 by displacing the movable portion 31 with respect to the second substrate 20 using the first gap 21. This makes it possible to provide an optical tunable filter having a simpler structure and a smaller size, which can be manufactured through a simplified manufacturing process without using a release hole and can achieve stable driving of a movable portion, and a method for manufacturing such an optical tunable filter.

摘要翻译： 光可调谐滤光器包括具有透光性的第一基板3，其包括可移动部分31，具有与第一基板相对的透光性的第二基板20，第一间隙21和第二基板 分别设置在可动部31和第二基板20之间的间隙22，通过第二间隙22引起可动部31和第二基板20之间的入射光的干涉的干涉部，以及改变距离 通过使用第一间隙21使可动部31相对于第二基板20移位。 这使得可以提供一种具有更简单的结构和更小尺寸的光学可调滤波器，其可以通过简化的制造工艺而不使用释放孔来制造并且可以实现可移动部分的稳定驱动，以及制造这种 光学可调滤波器。

公开(公告)号：US06425695B1

公开(公告)日：2002-07-30

申请号：US09509898

申请日：2000-04-03

申请人： Akihiro Murata ,  Shojiro Kitamura

发明人： Akihiro Murata ,  Shojiro Kitamura

IPC分类号： G02B636

CPC分类号： H01S5/02216 ,  G02B6/4201 ,  G02B6/4202 ,  G02B6/4212 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/4251 ,  G02B6/4255 ,  G02B6/4269 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/423 ,  H01L2924/00014

摘要： A surface emission laser (14) is disposed so that a side surface (15) of a semiconductor substrate of the surface emission laser (14) faces a plane (13) of a mounting substrate (12). By this means, emitted light (44) from the surface emission laser (14) travels in the direction along the plane (13) of the mounting substrate (12). Therefore, it is possible to dispose the optical fiber (16) so as to be along the plane (13) of the mounting substrate (12). By this means, an optical module (10) can be made thinner.

摘要翻译： 表面发射激光器（14）被布置成使得表面发射激光器（14）的半导体衬底的侧表面（15）面向安装衬底（12）的平面（13）。 通过这种方式，来自表面发射激光器（14）的发射光（44）沿着安装基板（12）的平面（13）的方向行进。 因此，能够沿着安装基板（12）的平面（13）配置光纤（16）。 通过这种方式，可以使光学模块（10）变薄。

公开(公告)号：US06281045B1

公开(公告)日：2001-08-28

申请号：US09235237

申请日：1999-01-22

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： H01L2144

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2224/81

摘要： A semiconductor apparatus, method of manufacturing the same, and an electronic apparatus are provided that improve the productivity and reduce the manufacturing cost. A plurality of semiconductor devices 16 may be mounted on a substrate 10. The semiconductor devices 16 may be sealed by resin 19. A heat radiation plate 18 may be mounted and the substrate 10 and the heat radiation plate 18 may be cut into pieces corresponding to the respective semiconductor devices 16.

摘要翻译： 提供了一种提高生产率并降低制造成本的半导体装置及其制造方法和电子设备。 多个半导体器件16可以安装在基板10上。半导体器件16可以由树脂19密封。可以安装散热板18，并且可以将基板10和散热板18切割成对应于 各个半导体器件16。